Kyocera offers lifetime LCD supply News & Analysis 12/30/2011 9 comments A lifetime supply of liquid-crystal displays is being guaranteed to original equipment manufacturers by Kyocera, which recently extended its acquisition of LCD and touchscreen suppliers by purchasing Optrex.
Chinese foundries confirm merger News & Analysis 12/29/2011 9 comments Hua Hong Semiconductor and Grace Semiconductor Manufacturing, China's second and third largest foundries, said they completed a merger between the two companies.
Intel's Medfield benchmarks leaked News & Analysis 12/27/2011 13 comments Purported specifications and benchmarks of Intel’s upcoming 32nm Medfield platform have been leaked online, detailing performance figures set to rival if not beat current chip market leaders in the tablet space.
NTT Docomo tips fabless JV for mobile chips News & Analysis 12/27/2011 4 comments NTT Docomo, Japan's largest wireless carrier, said it reached a basic agreement with five chip companies to establish a fabless joint venture to develop and sell semiconductors for handsets and other mobile devices.
Soitec to acquire Alatech Semi News & Analysis 12/27/2011 Post a comment Electronic materials vendor Soitec said it would acquire all of the outstanding shares of French chip equipment company Alatech Semiconductor by the end of January 2012.
Back Story News & Analysis 12/27/2011 6 comments We have compiled our “Confidential Top 10,” the ten most well-read EE Times Confidential stories this year. We have also put together "back stories," illustrating what have motivated us to go after a specific story.
ESL, down under style News & Analysis 12/26/2011 2 comments I love it when I discover new EDA companies, especially those in the ESL field. Introducing VWorks…
Touchscreens adopt on-cover over in-cell News & Analysis 12/22/2011 3 comments LCD vendors worldwide are being pressured by smartphone and tablet makers to quickly integrate touch into the display itself, using in- or on-cell sensors, but slow development has prompted add-on touchscreen vendors to offer interim sensor-on-cover, touch-on-lens, and similar one-glass solutions, at least for 2012.
Indian chip firm hits rare milestone News & Analysis 12/22/2011 11 comments An announcement by Cosmic Circuits that it has shipped 12 million ICs so far didn't garner a lot of attention internationally, but made waves here because it marks the first time an Indian chip company has attained such numbers.
Chip sales for smart meters set to double News & Analysis 12/21/2011 13 comments Sales of semiconductors used in smart electricity meters are projected to grow to $1.1 billion in 2016 from $505.6 million in 2011, due to rapid growth expected for the devices, according to market research firm IHS iSuppli.
Vivante claims top GPU spot in China TD phones News & Analysis 12/21/2011 3 comments Graphics IP licensor Vivante Corp. claims to be providing graphics cores for the majority of TD-SCDMA based smartphones. This would put Vivante ahead of better known graphics core licensors Imagination Technologies Group plc and ARM Holdings plc, albeit in just a part of the Chinese mobile phone market.
Fabless smart grid startup raises $12 million News & Analysis 12/21/2011 2 comments Fabless communications chip company EnVerv Inc. has announced it has raised $12 million in a Series B round of funding led by Benchmark Capital. Previous investors, NEA and Walden International also participated in the round.
Irwin Jacobs to retire from Qualcomm's board News & Analysis 12/20/2011 3 comments Irwin Jacobs, a co-founder of Qualcomm who served as the company's CEO for its first 20 years and as its chairman for almost 24 years, will step down from Qualcomm's board of directors after his current term expires in 2012, the company said.
Sematech identifies top tech challenges to 3-D ICs News & Analysis 12/20/2011 1 comment Semiconductor technology research consortium Sematech's 3D Enablement Center, together with the Semiconductor Industry Association and Semiconductor Research Corp., has identified the top technical challenges for new "killer" applications to enable future development of heterogeneous 3-D integrations beyond mobile wide I/O DRAM, Sematech said Tuesday (Dec. 20).
Gartner: Chip sales grew 1% in 2011 News & Analysis 12/20/2011 3 comments Market research firm Gartner again trimmed its forecast for 2011 semiconductor sales, saying its preliminary analysis shows chip revenue will grow by slightly less than 1 percent this year.
Five announce flash memory security initiative News & Analysis 12/19/2011 3 comments Panasonic, Samsung, SanDisk, Sony and Toshiba have reached an agreement in principle to collaborate on a content protection technology for flash memory cards such as SD Cards and for other flash-based storage options.
Chip executives confidence in decline, says KPMG News & Analysis 12/19/2011 2 comments The Semiconductor Business Confidence Index, a metric based on survey data gathered by audit and consultancy company KPMG LLC, has fallen to 46 in 2011, compared with 60 in 2010 and 61 in 2009, the firm said.
Flexible substrates harness carbon News & Analysis 12/14/2011 1 comment Carbon nanotube ink outperforms organic alternatives for future flexible electronics printed with ink jets, according to the U.S. Department of Energy's Lawrence Berkeley National Laboratory.
Gartner sees 20% drop in IC capex in 2012 News & Analysis 12/14/2011 Post a comment Market research firm Gartner said it expects global semiconductor capital spending to decline by 19.5 percent from this year's projected total, largely due to the slowing macroeconomic environment.
Broadcom raises fourth quarter revenue guidance News & Analysis 12/14/2011 1 comment Wireless and broadband fabless chip company Broadcom Corp. has raised its financial guidance for the fourth quarter of 2011. The company has increased it net revenue guidance to high-end of the previous range to approximately $1.8 billion.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.