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Content tagged with Semiconductors posted in December 2011
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Tegal sells nanolayer deposition patents
News & Analysis  
12/30/2011   4 comments
Chip equipment vendor Tegal said it has sold more than 30 patents from its nanolayer deposition patent portfolio for about $3.6 million.
Kyocera offers lifetime LCD supply
News & Analysis  
12/30/2011   9 comments
A lifetime supply of liquid-crystal displays is being guaranteed to original equipment manufacturers by Kyocera, which recently extended its acquisition of LCD and touchscreen suppliers by purchasing Optrex.
Tessera subsidiary buys 73 MoSys patents
News & Analysis  
12/29/2011   4 comments
Invensas, a subsidiary of technology licensor Tessera Technologies, said it purchased 73 memory chip technology patents from MoSys for $35 million in cash.
Chinese foundries confirm merger
News & Analysis  
12/29/2011   9 comments
Hua Hong Semiconductor and Grace Semiconductor Manufacturing, China's second and third largest foundries, said they completed a merger between the two companies.
UMC tips 0.11-micron aluminum BEOL process
News & Analysis  
12/29/2011   1 comment
UMC claimed to be the first foundry to provide a specialized 0.11-micron aluminum process in the company's 200-mm fabs.
EE Times 10 most read news stories of 2011
News & Analysis  
12/28/2011   5 comments
Here, we present the 10 most widely read news stories on EETimes.com in 2011.
Report: TSMC mulls New York investment
News & Analysis  
12/28/2011   30 comments
Foundry giant TSMC is considering making an investment in New York state, according to a report by Taiwan's Central News Agency.
Raspberry Pi foundation readies $25 PC for launch
News & Analysis  
12/28/2011   30 comments
British not-for-profit foundation Raspberry Pi has said its credit-card sized $25 PCs will become available for sale next month, once they emerge from final beta testing.
Intel's Medfield benchmarks leaked
News & Analysis  
12/27/2011   13 comments
Purported specifications and benchmarks of Intel’s upcoming 32nm Medfield platform have been leaked online, detailing performance figures set to rival if not beat current chip market leaders in the tablet space.
NTT Docomo tips fabless JV for mobile chips
News & Analysis  
12/27/2011   4 comments
NTT Docomo, Japan's largest wireless carrier, said it reached a basic agreement with five chip companies to establish a fabless joint venture to develop and sell semiconductors for handsets and other mobile devices.
Soitec to acquire Alatech Semi
News & Analysis  
12/27/2011   Post a comment
Electronic materials vendor Soitec said it would acquire all of the outstanding shares of French chip equipment company Alatech Semiconductor by the end of January 2012.
Invest in mobile, not PC in 2012 say financial analysts
News & Analysis  
12/27/2011   13 comments
Investment bank Canaccord Genuity has unveiled its top tech picks for 2012, with Qualcomm and Apple topping the list, while investors were warned to be wary of buying Intel stock in the coming months.
Back Story
News & Analysis  
12/27/2011   6 comments
We have compiled our “Confidential Top 10,” the ten most well-read EE Times Confidential stories this year. We have also put together "back stories," illustrating what have motivated us to go after a specific story.
ESL, down under style
News & Analysis  
12/26/2011   2 comments
I love it when I discover new EDA companies, especially those in the ESL field. Introducing VWorks…
IHS: Wireless infrastructure gear market grew 9% in 2011
News & Analysis  
12/23/2011   5 comments
Global spending on wireless infrastructure equipment is set to return to growth in 2011 after two years of decline and stagnation, according to market research firm IHS iSuppli.
Broadcom takes Rambus license
News & Analysis  
12/22/2011   2 comments
Broadcom signed a patent license agreement giving the company access to Rambus technology in its ICs.
Touchscreens adopt on-cover over in-cell
News & Analysis  
12/22/2011   3 comments
LCD vendors worldwide are being pressured by smartphone and tablet makers to quickly integrate touch into the display itself, using in- or on-cell sensors, but slow development has prompted add-on touchscreen vendors to offer interim sensor-on-cover, touch-on-lens, and similar one-glass solutions, at least for 2012.
Lead-free auto power MOSFETs come in standard TO packages
Product News  
12/22/2011   2 comments
Diffusion-soldering die-attach approach permits producing lead-free packages.
Linear Technology LTC2863 RS485 transceivers
Product News  
12/22/2011   Post a comment
Linear Technology's latest RS485/RS422 transceivers eliminate field failures without the need of costly external protection devices.
Indian chip firm hits rare milestone
News & Analysis  
12/22/2011   11 comments
An announcement by Cosmic Circuits that it has shipped 12 million ICs so far didn't garner a lot of attention internationally, but made waves here because it marks the first time an Indian chip company has attained such numbers.
Power semi market to grow 5% in 2012, says IMS
News & Analysis  
12/22/2011   5 comments
The global power semiconductor market will grow by 5.0 percent in 2012 to $32 billion after growing by 3.7 percent in 2011, according to market research firm IMS Research.
Chip sales for smart meters set to double
News & Analysis  
12/21/2011   13 comments
Sales of semiconductors used in smart electricity meters are projected to grow to $1.1 billion in 2016 from $505.6 million in 2011, due to rapid growth expected for the devices, according to market research firm IHS iSuppli.
10 notable blunders of 2011
News & Analysis  
12/21/2011   21 comments
As with any year, 2011 contained its share of blunders in the electronics world that will be remembered for years to come.
Vivante claims top GPU spot in China TD phones
News & Analysis  
12/21/2011   3 comments
Graphics IP licensor Vivante Corp. claims to be providing graphics cores for the majority of TD-SCDMA based smartphones. This would put Vivante ahead of better known graphics core licensors Imagination Technologies Group plc and ARM Holdings plc, albeit in just a part of the Chinese mobile phone market.
Fabless smart grid startup raises $12 million
News & Analysis  
12/21/2011   2 comments
Fabless communications chip company EnVerv Inc. has announced it has raised $12 million in a Series B round of funding led by Benchmark Capital. Previous investors, NEA and Walden International also participated in the round.
Irwin Jacobs to retire from Qualcomm's board
News & Analysis  
12/20/2011   3 comments
Irwin Jacobs, a co-founder of Qualcomm who served as the company's CEO for its first 20 years and as its chairman for almost 24 years, will step down from Qualcomm's board of directors after his current term expires in 2012, the company said.
Microsemi and INVIA deliver DPA-resistant cryptographic software on SmartFusion FPGAs
Product News  
12/20/2011   1 comment
New solution from Microsemi and INVIA provides enhanced protection for security applications
Sematech identifies top tech challenges to 3-D ICs
News & Analysis  
12/20/2011   1 comment
Semiconductor technology research consortium Sematech's 3D Enablement Center, together with the Semiconductor Industry Association and Semiconductor Research Corp., has identified the top technical challenges for new "killer" applications to enable future development of heterogeneous 3-D integrations beyond mobile wide I/O DRAM, Sematech said Tuesday (Dec. 20).
Gartner: Chip sales grew 1% in 2011
News & Analysis  
12/20/2011   3 comments
Market research firm Gartner again trimmed its forecast for 2011 semiconductor sales, saying its preliminary analysis shows chip revenue will grow by slightly less than 1 percent this year.
Seagate completes purchase of Samsung HDD business
News & Analysis  
12/20/2011   2 comments
Technology plc has completed the acquisition of the hard disk drive business of Samsung Electronics Co. Ltd.
Broadcom claims legal vicotry over Emulex
News & Analysis  
12/19/2011   1 comment
A U.S. federal court found that network chip vendor Emulex infringed on two patents held by rival chip vendor Broadcom, according to Broadcom.
Five announce flash memory security initiative
News & Analysis  
12/19/2011   3 comments
Panasonic, Samsung, SanDisk, Sony and Toshiba have reached an agreement in principle to collaborate on a content protection technology for flash memory cards such as SD Cards and for other flash-based storage options.
Chip executives confidence in decline, says KPMG
News & Analysis  
12/19/2011   2 comments
The Semiconductor Business Confidence Index, a metric based on survey data gathered by audit and consultancy company KPMG LLC, has fallen to 46 in 2011, compared with 60 in 2010 and 61 in 2009, the firm said.
Xilinx Ships First Zynq-7000 Devices
Product News  
12/18/2011   1 comment
Xilinx, Inc. has launched its first Zynq-7000 Extensible Processing Platform (EPP).
SandForce SSD processor targets cloud computing
Product News  
12/18/2011   Post a comment
The SF-2481 SSD increases the endurance of SSDs built with standard MLC flash by incorporating nearly twice the normal error correction strength.
Qualcomm's Gobi to provide HP with 3G laptop connectivity
News & Analysis  
12/15/2011   3 comments
Qualcomm has announced that its Gobi 3000 embedded wireless product will be powering a new form of pay-as-you-go mobile broadband data service in HP laptops.
CAST introduced UDP hardware IP block
Product News  
12/15/2011   2 comments
UDP is a protocol used for video and audio streaming. CAST has released a hardware IP implementation of this for ASIC and FPGA
ST claims world first contactless wafer test
News & Analysis  
12/15/2011   9 comments
European chip company STMicroelectronics NV has said it has produced the first wafer on which the die were fully tested wirelessly and without the use of contact probes.
Report: Apple ups ante with Israel R&D center
News & Analysis  
12/15/2011   4 comments
Apple has employed a veteran technologist to help it set up an R&D center in Israel, according to a Globes report.
Rambus, ITRI to collaborate on 3-D packaging
News & Analysis  
12/15/2011   Post a comment
Rambus said it is engaging Taiwan's Industrial Technology Research Institute on the development of interconnect and 3-D packaging technologies.
Lam to buy Novellus in $3.3B, all-stock deal
News & Analysis  
12/15/2011   Post a comment
Lam Research signed an agreement to acquire rival semiconductor capital equipment maker Novellus Systems in an all-stock deal valued at about $3.3 billion.
CAN transceiver isolates signals to 5 kVrms, handles 125°C
Product News  
12/14/2011   Post a comment
ADM3054 from Analog Devices tackles industrial, automotive digital interface problems
Globalfoundries announces 20-nm chip tape out
News & Analysis  
12/14/2011   4 comments
ARM and Globalfoundries have announced the tape out of a 20nm chip and have demoed a Cortex-A9 SoC operating at more than 2.5GHz on 28nm technology.
Flexible substrates harness carbon
News & Analysis  
12/14/2011   1 comment
Carbon nanotube ink outperforms organic alternatives for future flexible electronics printed with ink jets, according to the U.S. Department of Energy's Lawrence Berkeley National Laboratory.
Gartner sees 20% drop in IC capex in 2012
News & Analysis  
12/14/2011   Post a comment
Market research firm Gartner said it expects global semiconductor capital spending to decline by 19.5 percent from this year's projected total, largely due to the slowing macroeconomic environment.
Qualcomm becomes Imagination Technologies licensee
News & Analysis  
12/14/2011   2 comments
Qualcomm has become a new Imagination Technologies licensee, along with MStar, Ricoh and Rockchip, joining existing partners like Sony, Intel, Mediatek, Renesas, Samsung, Sigma and Realtek.
Microsemi announces Libero SoC v10.0 IDE
Product News  
12/14/2011   1 comment
Next-generation solution streamlines customizable SoC design efforts
Broadcom raises fourth quarter revenue guidance
News & Analysis  
12/14/2011   1 comment
Wireless and broadband fabless chip company Broadcom Corp. has raised its financial guidance for the fourth quarter of 2011. The company has increased it net revenue guidance to high-end of the previous range to approximately $1.8 billion.
All members of Lattice’s MachX02 “Do-It-All” PLD family now in production
Product News  
12/14/2011   3 comments
New $29.99 evaluation kit enables easy access to production-qualified PLD technology…
STEC claims highest-endurance SSD
Product News  
12/14/2011   Post a comment
The company extends Its ZeusIOPS® SSD family and lays claim to the industry’s highest endurance MLC flash-based SSD for the data center
Page 1 / 3   >   >>


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