Intel, Inside make NFC deal News & Analysis 12/14/2011 9 comments Inside Secure SA, a fabless supplier of near field communications (NFC) chips, has signed a technology transfer agreement to provide Intel Corp. with NFC designs and technologies.
Nvidia releases CUDA compiler source code News & Analysis 12/14/2011 4 comments Nvidia siad it would provide the source code for its CUDA low-level virtual machine-based compiler to academic researchers and software-tool vendors, a move the chip firm said would more easily add GPU support for more programming languages and support CUDA applications on alternative processor architectures.
FormFactor, Sequans cut Q4 outlooks News & Analysis 12/14/2011 1 comment Wafer probe card maker FormFactor and chip vendor Sequans Communications became the latest chip industry players to lower their sales targets for the fourth quarter, citing difficult market conditions.
TI releases tiny power management ICs News & Analysis 12/13/2011 2 comments Texas Instruments has unveiled what it claims to be the smallest power management ICs (PMICs) for solid state drives (SSDs), hybrid drives and other Flash memory applications.
Researchers: Carbon better than copper for TSVs News & Analysis 12/12/2011 6 comments Three-dimensional chip stacks are better connected with through-silicon-vias filled with carbon nanotubes instead of copper, according to researchers at Chalmers University of Technology in Gothenburg, Sweden.
CSR guts Zoran's DTV chip business News & Analysis 12/12/2011 8 comments Chip maker CSR plc said it would discontinue investment in the digital TV and silicon tuner product lines it recently acquired when it bought Zoran and lay off about 800 employees by the end of the second quarter of 2012.
Lattice to buy SiliconBlue for $62 million News & Analysis 12/9/2011 8 comments FPGA company Lattice Semiconductor Corp. has announced it plans to acquire SiliconBlue Technologies Inc., a startup that has specialized in low-power FPGAs, for $62 million in cash.
Crocus signs SMIC to make magnetic memory News & Analysis 12/9/2011 Post a comment Crocus Technology Inc., a vendor of magnetic RAMs, has signed a technology development and wafer manufacturing agreement with Semiconductor Manufacturing International Corp., China's most advanced semiconductor foundry.
Intel takes a seat on the board of NFC Forum News & Analysis 12/9/2011 1 comment The NFC Forum, an industry association that promotes the use of Near Field Communication technology, has announced that Intel has upgraded its membership to become a sponsor of the organization with the benefit of a seat on the NFC board of directors.
SMIC to pay Elpida $21M in settlement News & Analysis 12/9/2011 Post a comment Chinese foundry SMIC will pay Japanese memory chip vendor Eplida Memory $21 million to settle all pending arbitration claims and counterclaims relating to the firms' amended 2007 wafer supply agreement, SMIC said.
Gartner cuts 2012 chip market forecast News & Analysis 12/8/2011 1 comment Gartner reduced its forecast for the 2012 global semiconductor market, saying it now expects the market to reach $309 billion, a 2.2 percent increase from the projected total this year.
MEMC slashes jobs, outlook News & Analysis 12/8/2011 Post a comment Silicon wafer supplier MEMC Electronic Materials said it would eliminate more than 1,300 jobs, or about 20 percent of the company's global workforce, as part of a series of restructuring actions to be taken this month and in the first quarter of 2012.
MEMS chip enables battery-free sensors News & Analysis 12/7/2011 6 comments Belgian research institute IMEC described a MEMS chip that can harvest energy from vibrations inside car tires allowing a tire pressure monitoring systems to run battery-free.
TI engineers elected as IEEE Fellows News & Analysis 12/7/2011 2 comments Three engineers from Texas Instruments have been elected as IEEE Fellows for “extraordinary accomplishments” in the semiconductor space and their contributions to the electrical engineering community.
Rambus co-founder exits board, takes leave News & Analysis 12/7/2011 2 comments Mark Horowitz, co-founder of technology licensor Rambus, will step down from the company's board of directors and take a two-year leave of absence from his role as the company's chief scientist.
Intel, Photronics back multi-beam litho firm News & Analysis 12/7/2011 2 comments Intel's venture capital arm and photomask vendor Photronics have each invested an undisclosed amount in IMS Nanofabrication AG, an Austrian firm developing direct-write lithography technology, IMS said.
Report: McAfee cuts jobs News & Analysis 12/7/2011 1 comment Security software maker McAfee, a subsidiary of chip giant Intel, cut about 250 jobs, or roughly 3 percent of its workforce, according to a report by the Reuters news service.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Are the design challenges the same as with embedded systems, but with a little developer- and IT-skills added in? What do engineers need to know? Rick Merritt talks with two experts about the tools and best options for designing IoT devices in 2016. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.