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Content tagged with Semiconductors posted in February 2002
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IBM will steer PowerPC into mobile mart
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2/28/2002   Post a comment
IBM intends to take its PowerPC processor architecture to the mobile sector and into "head-to-head competition with Intel" and that company's Xscale processor, John Kelly III, senior vice president of IBM's Technology Group, said this week.
Researchers challenge conventional FPGA approaches
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2/28/2002   Post a comment
Researchers from leading universities and programmable-logic companies gathered at FPGA2002 this week to poke holes in the conventional wisdom that has guided field-programmable gate array design since its inception.
Cell phone chips integrate DSP, Xscale processor
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2/28/2002   Post a comment
Integrated baseband chips are being developed for 2.5G and 3G cell phones that merge Intel Corp.'s 400-MHz PXA250 Xscale processor, 400-MHz Micro Signal Architecture DSP and enough on-board flash to handle all DSP and applications code. The company hopes the parts, made in Intel's 0.13-micron process and being worked on at its R&D lab in Israel, can help recreate in the cellular world the kind of high-volume platform Intel and Microsoft forged with the PC.
New heat dissipation methods unveiled by Intel
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2/28/2002   Post a comment
SAN FRANCISCO -- Intel Corp. has developed a new heat sink and fan to dissipate more than 50% more heat from more powerful processors, the Intel Developers Forum was told this week.
Infineon's new VDSL chip sets support ATM, packet transmissions
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2/28/2002   Post a comment
MUNICH -- Infineon Technologies AG today announced plans to introduced a new chip-set series for 4-band very-high-bit rate digital subscriber line (VDSL) networks with support for asynchronous transfer mode (ATM) and packet-over-VDSL communications.
Opti sales surge on last-time buys as its weighs liquidation plan
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2/28/2002   Post a comment
MOUNTAIN VIEW, Calif.--Still reconsidering a plan to liquidate itself, Opti Inc. here posted a net income of $381,000 on revenues of $2.5 million in the fourth quarter of 2001. The company's sales surged 98% on a sequential basis from the third quarter of 2001 because of an increase in last-time buys of PC chip sets, said Opti's chief executive officer.
STMicro collaborates with APT to offer Serial ATA chip solutions
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2/28/2002   Post a comment
GENEVA--STMicroelectronics today announced it was jumping into the race to develop new chips for the high-speed Serial ATA interface to storage peripherals and hard-disk drives by striking a product-design alliance with APT Technologies Inc. of Santa Cruz, Calif.
Gain enters analog IC market with physical-layer transceiver for USB 2.0
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2/27/2002   Post a comment
SAN FRANCISCO -- Gain Technology Corp. rolled out its first analog front-end interface chip for high-speed USB peripherals during the Intel Developer Forum here this week. The GT3200 is compliant with the USB 2.0 Transceiver Macrocell Interface (UTMI) specification, said Gain, which is based in Tucson, Ariz.
Five chip suppliers form DMT-VDSL initiative for interoperable devices
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2/27/2002   Post a comment
SAN JOSE -- An alliance of five chip suppliers--Alcatel Microelectronics, GlobespanVirata, Ikanos, STMicroelectronics, and Zarlink--today announced an initiative to create interoperable semiconductors for broadband VDSL communications using Discrete Multi-Tone (DMT) line coding technology.
Simtek receives patent for metal-programmed gate arrays
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2/27/2002   Post a comment
COLORADO SPRINGS, Colo. -- Simtek Corp. here today announced it has received a U.S. patent for technology used to customize programmable gate arrays with one metal layer.
DRAM contract, spot prices show steady rise
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2/27/2002   Post a comment
Spot prices for DRAMs have risen rapidly since Samsung Electronics Co. Ltd. and Hynix Semiconductor Inc. increased DRAM contract prices.
IMP's profit turnaround continues despite drop in sales
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2/27/2002   Post a comment
SAN JOSE -- Analog chip maker IMP Inc. here increased its profitability in the last fiscal quarter after staging a dramatic turnaround in 2001. The company this week reported a net profit of $17,000 in the fiscal quarter, ended Dec. 31, compared to a loss of $1.2 million in the period last year.
Intel works toward ramp of 90-nm process in 2003
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2/27/2002   Post a comment
SAN FRANCISCO -- In a move to keep up in the IC technology race, Intel Corp. plans to soon announce its 90-nm (0.09-micron) process for use in high-speed microprocessors, flash memories, and other chips, said company executives at the Intel Developer Forum (IDF) here.
Conexant shows Bluetooth-enabled digital camera platform
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2/26/2002   Post a comment
ORLANDO, Fla. -- Conexant Systems Inc. here at a photography trade show demonstrated a Bluetooth-enabled digital still camera platform. The digital camera platform is the first to include support for wireless transmissions via Bluetooth connections, said the Newport Beach, Calif., company.
AMD demos 64-bit Hammer's ability to run 64- and 32-bit software
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2/26/2002   Post a comment
SAN FRANCISCO--In an attempt to steal some of the spotlight from its archrival, Advanced Micro Devices Inc. here today held the first public demonstration of its 64-bit "Hammer" processor while much of the industry's attention was focused at the Intel Developer Forum in San Francisco.
Intel launches net processors running at 22,400 MIPS
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2/26/2002   Post a comment
AN FRANCISCO -- In a move to corner the network processor market, Intel Corp. here today announced a line of new products, including a 1.4-GHz part that supports Rambus Inc.'s RDRAM memories and runs at an eye-popping 22,400 million of instructions per second (MIPS).
On Semi to add 6-inch fab line to plant in Slovakia for power devices
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2/26/2002   Post a comment
PIESTANY, Slovakia-- On Semiconductor Corp. today announced plans to expand its chip-processing facility here with the addition of a second wafer-fab line to produce low-voltage MOS power devices.
RF Solutions, Ellipsis to develop wireless LAN chip sets for multiple standards
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2/26/2002   Post a comment
NORCROSS, Ga. -- RF Solutions Inc. and Ellipsis Digital Systems Inc. today announced a partnership to develop a chip set for dual-band, multi-protocol wireless local area networks (WLANs) supporting 2.4 and 5-GHz standards.
Zarlink adds flexible TDM switch chip for 8K-by-8K channels in networks
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2/26/2002   Post a comment
OTTAWA -- Zarlink Semiconductor Inc. today expanded its high-density non-blocking time-division multiplexing (TDM) chip offering for switching 8,192-by-8,192 channels of voice/data traffic in next-generation networking systems.
Philips, STMicro to bundle hardware/software platforms for digital TV, set-top boxes
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2/26/2002   Post a comment
EINDHOVEN, the Netherlands -- Royal Philips Electronics N.V. and STMicroelectronics today announced an agreement to jointly develop platform products for set-top boxes and digital television sets. The alliance will apply Philips' software for multimedia home platforms and STMicroelectronics' single-chip digital decoder to provide new turnkey solutions.
Intel targets 'modular infrastructure' shift in communications systems
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2/26/2002   Post a comment
SAN FRANCISCO -- The year-and-a-half slump in communications markets is causing a sea of change in the industry, prompting systems houses to shift product development strategies from proprietary ASIC designs to standard ICs and a "modular infrastructure" business model, said Intel Corp.'s top networking executive during briefing with journalists on Monday evening.
Intel ships first 0.13-micron processors made on 300-mm wafers
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2/25/2002   Post a comment
SANTA CLARA, Calif.--As predicted earlier this year, Intel Corp. today announced it has completed first production of microprocessors on 300-mm diameter wafers using a 0.13-micron process technology. Intel claimed it is the first chip maker to produce and ship "production level processors" on 0.13-micron technology using 300-mm (12-inch) silicon substrates.
IBM tailors SiGe foundry processes for wireless chip applications
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2/25/2002   Post a comment
EAST FISHKILL, N.Y. -- IBM Corp. today announced two new versions of its existing silicon-germanium (SiGe) process technologies for foundry services in wireless ICs.
Broadcom's ServerWorks launches Xeon chip set for DDR memory
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2/25/2002   Post a comment
SAN FRANCISCO -- ServerWorks Corp. today announced an optimized chip set for Intel Corp.'s Xeon processors using a new architecture supporting 3.2-gigabyte-per-second memory bandwidth--a 50% increase over an existing chip-set solution for Pentium III platforms, said the company at the Intel Developer Forum here.
LSI, Seagate team up to make first Serial ATA interface chip for PC drives
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2/25/2002   Post a comment
SAN FRANCISCO -- LSI Logic Corp. and disk-drive maker Seagate Technology LCC today announced plans to develop a "breakthrough" Serial ATA interface for next-generation desktop PC hard disk drives.
Motorola integrates Kodak technology in CMOS sensor for video, camera systems
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2/25/2002   Post a comment
ORLANDO, Fla. - During a trade show here today, Motorola Inc. announced a new "camera-on-a-chip" sensor IC, based on what the company called "groundbreaking" wafer processing capabilities and patented photodiode and pixel design technology from Eastman Kodak Co. The second-generation ImageMOS VGA device also employs Motorola's patented image sensor technology.
Cypress and Taiwan's ProMOS to develop one-transistor pseudo-SRAM products
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2/25/2002   Post a comment
SAN JOSE -- Cypress Semiconductor Corp. here today announced a partnership with ProMOS Technology Inc. of Taiwan to develop one-transistor (1T) cell technology for pseudo-SRAM products used in cellular phones and other mobile applications.
Fuzzy logic comes into sharper focus
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2/22/2002   Post a comment
Ten years after the initial flurry of interest in fuzzy logic for embedded control, STMicroelectronics (ST) has decided to revisit the field with a hybrid microcontroller architecture the company has aimed at domestic appliances and industrial controls.
Xilinx ups revenue guidance to 10% sequential growth in quarter
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2/21/2002   Post a comment
SAN JOSE -- Xilinx Inc. today became the latest chip supplier to bump up its revenue estimates for the current fiscal quarter. The company said it now expects a 10% sequential increase in revenues from $228.8 million in the last fiscal quarter, ended Dec. 31.
Intersil, Cisco to offer 54-Mbit wireless LAN client reference designs
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2/21/2002   Post a comment
IRVINE, Calif.-- Intersil Corp. and Cisco Systems Inc. today announced collaboration on high-speed wireless LAN client adapter reference designs, which help other companies make system products based on the IEEE 802.11g draft standard.
Fabless ASIC startup eSilicon raises $6 million in funding
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2/21/2002   Post a comment
SANTA CLARA, Calif. -- eSilicon Corp., a fabless chip supplier of ASICs, today announced that it has secured $6 million in funding from a number of investors.
STMicro, Imagination Technologies aim alliance at mobile multimedia applications
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2/21/2002   Post a comment
CANNES, France -- During the 3GSM World Congress conference here today, STMicroelectronics and U.K.-based Imagination Technologies Group announced plans to cooperate in development of system-on-chip platforms for mobile multimedia systems.
Fifo memories get DDR treatment
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2/21/2002   Post a comment
First it was SRAMs for communications, then DRAMs for PCs. Now fifo memories have been given the double-data rate (DDR) treatment.
Fujitsu says four-stacked multi-chip package offers highest memory capacity
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2/20/2002   Post a comment
SAN JOSE -- Fujitsu Microelectronics America Inc. today said it was offering the industry's first four-stacked multi-chip package, which is designed to hold a pair of 64-megabit NOR-based flash memory devices, a 32-Mbit Fast Cycle RAM (FCRAM), and an 8-Mbit SRAM. The product offers the highest memory capacity available today for mobile systems designs, according to Fujitsu.
Microchip increases EEPROM densities in tiny 8-lead package
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2/20/2002   Post a comment
CHANDLER, Ariz. -- Microchip Technology Inc. today announced it has extended the use of a tiny 8-lead micro small outline package (MSOP) for use in serial EEPROMs with densities of 32- and 64 kilobits.
Germany's IHP plans 5-GHz wireless LAN processor with MIPS core
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2/20/2002   Post a comment
FRANKFURT (ODER), Germany-- In a move to create 5-GHz processors for wireless local area networks, Germany's Innovations for High Performance (IHP) microelectronics institute here today announced it will cooperate with MIPS Technologies Inc. in development of wireless broadband communications ICs.
Zoran processor filters foul language from kids in Sanyo DVD players
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2/20/2002   Post a comment
SANTA CLARA, Calif. -- Zoran Corp. here and Japan's Sanyo Group today announced a long-term strategic partnership in DVD chip technology, and separately, the Santa Clara company said it has delivered a new integrated circuit that improves parental control over what children hear in TV programming, compared to V-Chip technology.
AMD buys Alchemy Semi with $50 million cash payment
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2/19/2002   Post a comment
SUNNYVALE, Calif.--Advanced Micro Devices Inc. today said it completed the previously announced purchase of Alchemy Semiconductor Inc. by paying $50 million in cash to Alchemy shareholders and creditors.
Motorola announces 3G platform in new open cell-phone strategy
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2/19/2002   Post a comment
CANNES, France -- Motorola Inc. rolled out its promised third-generation cellular phone chip set and development platform at the 3GSM World Congress conference here. The 3G phone chip set's baseband processor is based on the StarCore DSP architecture, which was jointly developed by Motorola and Agere Systems Inc.
Microsoft supports smart phone platform based on TI's OMAP
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2/19/2002   Post a comment
CANNES, France -- In a move to play more of its cards in the next-generation "smart phone" marketplace, Microsoft Corp. today announced its Windows Powered Smartphone 2002 software is available on a DSP-based design reference platform from Texas Instruments Inc.
Philips Semi to use TriQuint as InGaP chip foundry under new alliance
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2/19/2002   Post a comment
HILLSBORO, Ore.-- Philips Semiconductors of the Netherlands today announced a manufacturing partnership with TriQuint Semiconductor Inc. here, which will fabricate indium-gallium-phosphide (InGaP) heterojunction bipolar transistors (HBTs) on 150-mm wafers under a new foundry agreement.
Microsoft, Intel try to set PDA/smart phone standards like they did in PCs
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2/19/2002   Post a comment
CANNES, France -- PC technology giants Microsoft Corp. and Intel Corp. today announced a joint initiative to develop reference design platforms for next-generation personal digital assistants (PDAs) and smart phones. The two companies said the lack of industry standards in wireless communications systems was holding back the spread of smart phones and next-generation PDAs.
Nokia, TI offer compete 2.5/3G platform for cell-phone makers
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2/18/2002   Post a comment
CANNES, France -- The race to provide packaged solutions for next-generation cellular phone handsets is heating up. Finland's Nokia Group and Texas Instruments Inc. today announced complete "open and standards-based" reference platforms for 2.5- and third-generation (3G) smart phones using Nokia's Series 60 terminal software and TI's OMAP integrated digital signal processor.
Phoenix and Standard Microsystems collaborate in PC security chips
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2/18/2002   Post a comment
SAN JOSE -- Embedded software supplier Phoenix Technologies Ltd. today announced a partnership with Standard Microsystems Corp. to enhance built-in PC security with new tamper-resistant silicon hardware that stores protective device keys and related data.
Tropian teams with Agilent and Silicon Labs to serve advanced GSM phones
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2/18/2002   Post a comment
CANNES, France--Prior to the opening of a cellular phone trade show here, Tropian Inc. today announced it was collaborating with Agilent Technologies Inc. to jointly demonstrate a radio-frequency transmitter for GSM/GPRS/Edge handsets. Silicon Valley-based Tropian also announced a partnership with Silicon Laboratories Inc. to offer the industry's first tri-band E-GPRS radio transceiver reference-design platform.
Analog Devices aims mixed-signal DSPs at high-precision embedded control
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2/18/2002   Post a comment
NORWOOD, Mass. -- Aiming to expand its reach in embedded control applications, Analog Devices Inc. today introduced a new family of mixed-signal DSP chips, which combines a C-programmable digital signal processor core and high-performance analog functions.
IDT rolls out first DDR FIFOs for high-speed systems and networks
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2/18/2002   Post a comment
SANTA CLARA, Calif. -- Integrated Device Technology Inc. today announced the industry's first FIFO memory chips with high-speed double-data rate (DDR) interfaces for clock frequencies up to 250 MHz and data rates up to 40 gigabits per second.
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