IBM will steer PowerPC into mobile mart News & Analysis 2/28/2002 Post a comment IBM intends to take its PowerPC processor architecture to the mobile sector and into "head-to-head competition with Intel" and that company's Xscale processor, John Kelly III, senior vice president of IBM's Technology Group, said this week.
Cell phone chips integrate DSP, Xscale processor News & Analysis 2/28/2002 Post a comment Integrated baseband chips are being developed for 2.5G and 3G cell phones that merge Intel Corp.'s 400-MHz PXA250 Xscale processor, 400-MHz Micro Signal Architecture DSP and enough on-board flash to handle all DSP and applications code. The company hopes the parts, made in Intel's 0.13-micron process and being worked on at its R&D lab in Israel, can help recreate in the cellular world the kind of high-volume platform Intel and Microsoft forged with the PC.
Opti sales surge on last-time buys as its weighs liquidation plan News & Analysis 2/28/2002 Post a comment MOUNTAIN VIEW, Calif.--Still reconsidering a plan to liquidate itself, Opti Inc. here posted a net income of $381,000 on revenues of $2.5 million in the fourth quarter of 2001. The company's sales surged 98% on a sequential basis from the third quarter of 2001 because of an increase in last-time buys of PC chip sets, said Opti's chief executive officer.
IMP's profit turnaround continues despite drop in sales News & Analysis 2/27/2002 Post a comment SAN JOSE -- Analog chip maker IMP Inc. here increased its profitability in the last fiscal quarter after staging a dramatic turnaround in 2001. The company this week reported a net profit of $17,000 in the fiscal quarter, ended Dec. 31, compared to a loss of $1.2 million in the period last year.
Intel works toward ramp of 90-nm process in 2003 News & Analysis 2/27/2002 Post a comment SAN FRANCISCO -- In a move to keep up in the IC technology race, Intel Corp. plans to soon announce its 90-nm (0.09-micron) process for use in high-speed microprocessors, flash memories, and other chips, said company executives at the Intel Developer Forum (IDF) here.
Conexant shows Bluetooth-enabled digital camera platform News & Analysis 2/26/2002 Post a comment ORLANDO, Fla. -- Conexant Systems Inc. here at a photography trade show demonstrated a Bluetooth-enabled digital still camera platform. The digital camera platform is the first to include support for wireless transmissions via Bluetooth connections, said the Newport Beach, Calif., company.
AMD demos 64-bit Hammer's ability to run 64- and 32-bit software News & Analysis 2/26/2002 Post a comment SAN FRANCISCO--In an attempt to steal some of the spotlight from its archrival, Advanced Micro Devices Inc. here today held the first public demonstration of its 64-bit "Hammer" processor while much of the industry's attention was focused at the Intel Developer Forum in San Francisco.
Intel launches net processors running at 22,400 MIPS News & Analysis 2/26/2002 Post a comment AN FRANCISCO -- In a move to corner the network processor market, Intel Corp. here today announced a line of new products, including a 1.4-GHz part that supports Rambus Inc.'s RDRAM memories and runs at an eye-popping 22,400 million of instructions per second (MIPS).
Intel targets 'modular infrastructure' shift in communications systems News & Analysis 2/26/2002 Post a comment SAN FRANCISCO -- The year-and-a-half slump in communications markets is causing a sea of change in the industry, prompting systems houses to shift product development strategies from proprietary ASIC designs to standard ICs and a "modular infrastructure" business model, said Intel Corp.'s top networking executive during briefing with journalists on Monday evening.
Intel ships first 0.13-micron processors made on 300-mm wafers News & Analysis 2/25/2002 Post a comment SANTA CLARA, Calif.--As predicted earlier this year, Intel Corp. today announced it has completed first production of microprocessors on 300-mm diameter wafers using a 0.13-micron process technology. Intel claimed it is the first chip maker to produce and ship "production level processors" on 0.13-micron technology using 300-mm (12-inch) silicon substrates.
Broadcom's ServerWorks launches Xeon chip set for DDR memory News & Analysis 2/25/2002 Post a comment SAN FRANCISCO -- ServerWorks Corp. today announced an optimized chip set for Intel Corp.'s Xeon processors using a new architecture supporting 3.2-gigabyte-per-second memory bandwidth--a 50% increase over an existing chip-set solution for Pentium III platforms, said the company at the Intel Developer Forum here.
Motorola integrates Kodak technology in CMOS sensor for video, camera systems News & Analysis 2/25/2002 Post a comment ORLANDO, Fla. - During a trade show here today, Motorola Inc. announced a new "camera-on-a-chip" sensor IC, based on what the company called "groundbreaking" wafer processing capabilities and patented photodiode and pixel design technology from Eastman Kodak Co. The second-generation ImageMOS VGA device also employs Motorola's patented image sensor technology.
Fuzzy logic comes into sharper focus News & Analysis 2/22/2002 Post a comment Ten years after the initial flurry of interest in fuzzy logic for embedded control, STMicroelectronics (ST) has decided to revisit the field with a hybrid microcontroller architecture the company has aimed at domestic appliances and industrial controls.
Fujitsu says four-stacked multi-chip package offers highest memory capacity News & Analysis 2/20/2002 Post a comment SAN JOSE -- Fujitsu Microelectronics America Inc. today said it was offering the industry's first four-stacked multi-chip package, which is designed to hold a pair of 64-megabit NOR-based flash memory devices, a 32-Mbit Fast Cycle RAM (FCRAM), and an 8-Mbit SRAM. The product offers the highest memory capacity available today for mobile systems designs, according to Fujitsu.
Germany's IHP plans 5-GHz wireless LAN processor with MIPS core News & Analysis 2/20/2002 Post a comment FRANKFURT (ODER), Germany-- In a move to create 5-GHz processors for wireless local area networks, Germany's Innovations for High Performance (IHP) microelectronics institute here today announced it will cooperate with MIPS Technologies Inc. in development of wireless broadband communications ICs.
Zoran processor filters foul language from kids in Sanyo DVD players News & Analysis 2/20/2002 Post a comment SANTA CLARA, Calif. -- Zoran Corp. here and Japan's Sanyo Group today announced a long-term strategic partnership in DVD chip technology, and separately, the Santa Clara company said it has delivered a new integrated circuit that improves parental control over what children hear in TV programming, compared to V-Chip technology.
Motorola announces 3G platform in new open cell-phone strategy News & Analysis 2/19/2002 Post a comment CANNES, France -- Motorola Inc. rolled out its promised third-generation cellular phone chip set and development platform at the 3GSM World Congress conference here. The 3G phone chip set's baseband processor is based on the StarCore DSP architecture, which was jointly developed by Motorola and Agere Systems Inc.
Microsoft supports smart phone platform based on TI's OMAP News & Analysis 2/19/2002 Post a comment CANNES, France -- In a move to play more of its cards in the next-generation "smart phone" marketplace, Microsoft Corp. today announced its Windows Powered Smartphone 2002 software is available on a DSP-based design reference platform from Texas Instruments Inc.
Microsoft, Intel try to set PDA/smart phone standards like they did in PCs News & Analysis 2/19/2002 Post a comment CANNES, France -- PC technology giants Microsoft Corp. and Intel Corp. today announced a joint initiative to develop reference design platforms for next-generation personal digital assistants (PDAs) and smart phones. The two companies said the lack of industry standards in wireless communications systems was holding back the spread of smart phones and next-generation PDAs.
Nokia, TI offer compete 2.5/3G platform for cell-phone makers News & Analysis 2/18/2002 Post a comment CANNES, France -- The race to provide packaged solutions for next-generation cellular phone handsets is heating up. Finland's Nokia Group and Texas Instruments Inc. today announced complete "open and standards-based" reference platforms for 2.5- and third-generation (3G) smart phones using Nokia's Series 60 terminal software and TI's OMAP integrated digital signal processor.
Tropian teams with Agilent and Silicon Labs to serve advanced GSM phones News & Analysis 2/18/2002 Post a comment CANNES, France--Prior to the opening of a cellular phone trade show here, Tropian Inc. today announced it was collaborating with Agilent Technologies Inc. to jointly demonstrate a radio-frequency transmitter for GSM/GPRS/Edge handsets. Silicon Valley-based Tropian also announced a partnership with Silicon Laboratories Inc. to offer the industry's first tri-band E-GPRS radio transceiver reference-design platform.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Are the design challenges the same as with embedded systems, but with a little developer- and IT-skills added in? What do engineers need to know? Rick Merritt talks with two experts about the tools and best options for designing IoT devices in 2016. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.