Chartered strikes mixed-signal IP alliance with VCX exchange News & Analysis 2/18/2002 Post a comment SINGAPORE -- In a move to increase its support and availability of third-party mixed-signal design cores for silicon foundry customers, Chartered Semiconductor Manufacturing Ltd. today announced an alliance with the online Virtual Component Exchange (VCX) to lower the cost of "hardening" intellectual property (IP) for ICs fabricated in Chartered's wafer fabs.
STMicro teams with U.K.-based CDT to develop drivers for LEP displays News & Analysis 2/15/2002 Post a comment GENEVA--STMicroelectronics today announced plans to develop device drivers for light emitting polymer (LEP) displays with U.K.-based Cambridge Display Technology Ltd. The two companies are targeting power-optimized and low-cost LEP drivers for portable applications, such as mobile phones, personal digital assistants (PDAs), and next-generation multimedia terminals.
MIPS rolls out faster 64-bit RISC core, promises 1-GHz at 0.10-micron process News & Analysis 2/14/2002 Post a comment MOUNTAIN VIEW, Calif. -- Raising the speed stakes in the embedded processor market, MIPS Technologies Inc. announced a new 600-MHz version of its 64-bit MIPS64 RISC core for 0.13-micron process technologies. The new superscalar 20Kc "hard" core is scalable to 1-GHz speeds when produced in next-generation 0.10-micron processes, according to MIPS Technologies.
Oki goes into production with SOI watch chips News & Analysis 2/14/2002 Post a comment Oki Semiconductor claims to be the first into the market with high-integration chips based on a fully depleted silicon-on-insulator (SOI) design, a technology earmarked by Intel for use in its processors about five years from now.
Philips develops one-chip stereo radio for embedded use in consumer products News & Analysis 2/11/2002 Post a comment EINDHOVEN, the Netherlands -- Philips Semiconductors today announced development of a single-chip implementation of stereo radio for European, U.S., and Japanese FM bands. The Dutch company said the breakthrough will enable low-cost FM radio receivers to be embedded in a range of portable consumer products, such as mobile phones, MP3 players, CD players, toys, and inexpensive promotional "giveaways."
AMD teams for 65nm and moves back into RISC News & Analysis 2/11/2002 Post a comment Chip maker AMD and foundry UMC are to build a 300mm fab in Singapore and work together on advanced process technologies for logic products. AMD has also bought Alchemy Semiconductor. The deal gives AMD access to an embedded RISC processor once again, a product line removed when the company moved away from its 29K architecture in the 1990s.
Altera claims fastest, largest PLDs with up to 40% speed improvement News & Analysis 2/11/2002 Post a comment SAN JOSE -- Altera Corp. today announced it has developed the industry's fastest and largest programmable logic devices with the launch of a new series, called Stratix, which offers up to 10 megabits of RAM and 114,140 logic elements on a chip. The new series will offer a 40% speed improvement over the company's previous generation of PLDs, said Altera.
Philips announces first 'fully-integrated' telematics processor News & Analysis 2/8/2002 Post a comment EINDHOVEN, the Netherlands -- Philips Semiconductors today said it is now sampling the first "full-integrated" telematics processor. The SAF3100 combines a microcontroller core, 12-channel GPS baseband circuitry, dual 14-bit analog-to-digital converter, embedded RAM, CAN-bus controller, and high-speed UARTs for interfacing to a cellular phone.
Intersil rolls out cascaded power controllers for DDR memories News & Analysis 2/7/2002 Post a comment IRVINE, Calif.--Intersil Corp. today said it was the first chip supplier to offer cascaded dual DDR memory power controllers for double-data rate SDRAMs. The Endura ISL6530 and ISL6531 dual pulse width modulation (PWM) regulators are aimed at powering DDR memories on computer motherboards and in systems.
Micron offers Q-Flash as alternative to Intel StrataFlash News & Analysis 2/6/2002 Post a comment BOISE, Idaho--Micron Technology Inc. today launched its first Q-Flash memory product, a 32-megabit even-sectored device, which the company said is an alternative to Intel Corp.'s StrataFlash for set-top boxes, cellular base stations, networking and automotive applications.
Motorola, Sega plan portable game interface for DragonBall processors News & Analysis 2/5/2002 Post a comment AUSTIN, Tex. -- Motorola Inc.'s semiconductor group and the company's Metrowerks development tool business today announced a partnership with Sega Corp. to develop an application programming interface (API) for portable games on personal digital assistants (PDAs) that are running the Palm OS operating system.
Philips, MobilEye to integrate car driver 'assistance' on chip News & Analysis 2/4/2002 Post a comment EINDHOVEN, the Netherlands -- Philips Semiconductors here and MobilEye B.V., also of the Netherlands, today announced a partnership to make system-on-chip solutions for automotive driver "assistance" applications, which the two companies said will be the first step towards development of "autonomous driving systems."
TI targets 0.09-micron process for production by mid-2003 News & Analysis 2/4/2002 Post a comment DALLAS -- Texas Instruments Inc. today announced it will launch a 0.09-micron logic process into production in the middle of 2003. TI said its next-generation CMOS process features transistors as small as 37 nm (0.037 micron), and it will enable the company to fabricate ICs with more than 400 million transistors on a chip.
Cirrus adds UMC as multi-year foundry source for advanced ICs News & Analysis 2/4/2002 Post a comment AUSTIN, Tex. -- Cirrus Logic Inc. today announced it has entered into a new multi-year foundry agreement to source advanced ICs from United Microelectronics Corp. in Taiwan. Under the pact, UMC will accelerate the availability of mixed-signal and other processes for Cirrus chip designs, based on features sizes down to 0.10 micron (100 nm).
300-mm pact means AMD shifts from Motorola to UMC as technology partner News & Analysis 2/1/2002 Post a comment SUNNYVALE, Calif. -- While Advanced Micro Devices Inc. here and silicon foundry supplier United Microelectronics Corp. move into a major manufacturing alliance for PC processors and 300-mm wafer processing, the two companies are also faced with restructuring and merging their R&D activities to implement 65-nm processes for a planned joint-venture fab in Singapore by 2005.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Are the design challenges the same as with embedded systems, but with a little developer- and IT-skills added in? What do engineers need to know? Rick Merritt talks with two experts about the tools and best options for designing IoT devices in 2016. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.