High-density, extended temperature FPGAs claim slots in automotive apps Product News 2/27/2004 Post a comment Almost every car that comes off the assembly line will make use of occupant safety systems, electronic engine control modules for camless engine control units (ECUs) and other under-the-hood powertrain management systems. But high end automotive electronics like navigation, speech recognition, passenger control and comfort systems, intelligent occupant sensors and heads-up displays may not have the volumes that justify an investment in ASICs. Here, the densities, features, and extended temperatu
StreetFighter product line attacks global ADSL market Product News 2/26/2004 Post a comment Centillium Communications unveiled its new StreetFighter line of Asymmetric Digital Subscriber Line chipsets for Customer Premise Equipment. The company says it provides all the key functional blocks required to implement an ADSL2/2-plus bridge, router or home gateway product.
DC/DCs on ceramic beat the heat News & Analysis 2/26/2004 Post a comment C&D Technologies' NCX10S series of single-output surface-mount DC/DC converters, relying on the benefits of its ceramic substrate, can deliver its full 10 watt output at temperatures up to +85°C without heatsinking. Its so-called "compliant-leg" technology ensures enhanced mechanical reliability by compensating for expansion and contraction caused by the different coefficients of thermal expansion between the converter substrate and the PC board onto which it is mounted.
Silicon thermistors provide more accurate temperature sensing, optimizing system performance News & Analysis 2/26/2004 Post a comment Andigilog announced the SiMISTOR family of linear and highly accurate silicon thermistors. The products, manufactured using mature CMOS processes, can replace traditional thermistors in high-volume cell phones, PCs and peripherals, PDAs, and consumer device applications. The family also displaces thermistors in traditional industrial applications, such as thermostats and portable medical devices.
Ultracaps available in 3F and 100F versions News & Analysis 2/26/2004 Post a comment NessCap Co. Ltd. has expanded its 2.7-volt ultracapacitor product offering with the addition of 3 farad (F) and 100F models. These components can be used as an energy source for a variety of applications including LED displays, remote control devices, toys, hand-held scanners, small printers, actuators and relays.
On the Design of Higher-order Shelf Filters " Part 2 of 3 News & Analysis 2/25/2004 Post a comment The design of higher-order shelf filters, says TI's Rusty Allred, requires use of uncommon mathematics and numerical techniques. This paper streamlines the approach while exploiting the power of Matlab to make the design of these filters more accessible. In part 1, Rusty reviews the theory behind a MatLab implementation. In part 2, here, Rusty describes some practical implementations " particularly the filter coefficients. In part 3, the "appendix," Rusty describes the mathematical underpinning
Asian automakers join FlexRay News & Analysis 2/25/2004 Post a comment The FlexRay Consortium has confirmed that Toyota, Nissan, Honda, and Hyundai Kia Motors have joined the consortium, thus putting the weight of the overwhelming majority of major automakers behind the FlexRay effort to create a common standard for automotive by-wire technology.
Intel's Barrett sees digital home products by end of year News & Analysis 2/25/2004 Post a comment Intel Corp. CEO Craig Barrett, again stressing interoperability among consumer electronics devices for the "digital home," said the Digital Home Working Group (DHWG) will deliver its first technical guidelines in the second quarter with first products expected later this year. From Tokyo, Yoshiko Hara reports.
Cisco Catalyst switches add power-over-Ethernet News & Analysis 2/24/2004 Post a comment Cisco Systems Inc. has expanded its support for the IEEE 802.3af power-over-Ethernet specification to include most models of its Catalyst switches, both chassis and stackable. New PoE products include the first Cisco line cards to support Gigabit Ethernet as well as 10/100 Ethernet. Loring Wirbel reports.
Samsung, Frontier develop DAB solution for mobiles News & Analysis 2/24/2004 Post a comment Tuner developer Samsung Electro-Mechanics and digital audio broadcast (DAB) chip provider Frontier Silicon are using this week's 3GSM World Congress here to show off a jointly developed DAB receiver module for mobile phone and PDA designs.
3G handsets not ready for prime time, says Vodafone chief News & Analysis 2/24/2004 Post a comment Arun Sarin, CEO of Vodafone, Europe's largest GSM mobile phone network, dampened slightly the excitement surrounding the announcement of GSM's one-billionth subscriber that product-quality deficiencies will delay the mass roll-out of new 3G handsets through most of 2004. David Benjamin's story is one of many reports rolling in from the GSM Congress in Cannes this week.
EPA proposes power supply efficiency spec News & Analysis 2/24/2004 Post a comment The U.S. Environmental Protection Administration announced Monday (Feb.23) it would draft a proposal for efficiency specifications and a test procedure for single-voltage external ac/dc supplies, in a move to convince the power supply industry to develop more energy-efficient products. From the Apec conference in Anaheim, Spencer Chin filed this report.
QuickSilver's silicon-to-go News & Analysis 2/24/2004 Post a comment This detailed look at QuickSilver's adaptive computing machine (ACM) technology shows how you can bring algorithms into silicon, using a toolset and IP available under a modified open-source license.
Smallest, lowest power DAB module to date makes debut at 3G in Cannes Product News 2/24/2004 Post a comment Samsung Electro-Mechanics, a provider of electronic tuners, and Frontier Silicon, a supplier of DAB chips, have announced the two companies have cooperated to develop a miniature low power DAB receiver module specifically targeted for integration into mobile phone handsets and other communications devices.
ARM-based MCU family adds flash, support for CAN automotive bus Product News 2/24/2004 Post a comment Philips Semiconductors has added more memory and a new level of support for the automotive and industrial CAN bus to its ARM7 TDMI-based LPC2000 family of 32-bit microcontrollers. New parts are rolling out with operating frequencies up to 60 MHz, power consumption lower than many 8-bit MCUs and price tags starting near $5 in quantity.
Low-noise op amps offer rail-to-rail outputs and 3V operation Product News 2/24/2004 Post a comment Catch up on two families of operational amplifiers recently introduced by Linear Technologies and reviewed by editor Paul O'Shea. These devices consume only 50% as much power as competitive devices and deliver ultra low noise performance, rail-to-rail outputs and fully specified 3.3V operation.
Synopsys acquires MoSys in $432M deal News & Analysis 2/24/2004 Post a comment Moving aggressively towards becoming a broad-ranging provider of silicon intellectual property (IP), Synopsys Inc. Monday (Feb. 23) announced its pending acquisition of embedded memory provider Monolithic System Technology (MoSys) and its completed acquisition of fabless semiconductor vendor Accelerant Networks. Valued at $432 million in stock and cash, the MoSys acquisition is among the most expensive in EDA history.
Clock generators support XDR memory systems Product News 2/23/2004 Post a comment A cross-licensing agreement between Texas Instruments and Rambus will result in a new line of XCG clock generators. Get ready for fast data transfers in next-generation consumer, networking, and PC computing systems, the companies say.
TI sees partnerships as key to success in DSPs Product News 2/23/2004 Post a comment Message from TI's Developers Conference: Texas Instruments Inc. will need to form even tighter relationships with tool vendors, software developers and systems manufacturers to stay in front of requirements for its next-generation digital signal processors, according to the company's next president and chief executive officer.
A quick primer on strained silicon News & Analysis 2/23/2004 Post a comment What exactly is strained silcon? MIT professor Gene Fitzgerald explains three categories: standard CMOS, selective source-drain technology and wafer-scale strained-silicon technology.
Silicon thermistors provide more accurate temperature sensing, optimizing system performance Product News 2/22/2004 Post a comment Andigilog announced the SiMISTOR family of linear and highly accurate silicon thermistors. The products, manufactured using mature CMOS processes, can replace traditional thermistors in high-volume cell phones, PCs and peripherals, PDAs, and consumer device applications. The family also displaces thermistors in traditional industrial applications, such as thermostats and portable medical devices.
Low-cost amplifier provides headroom to prevent audio holes Product News 2/20/2004 Post a comment Philips introduces the TDA8947J amplifier to provide manufacturers of audio applications a low cost solution for high performance audio. It features the patented overload protection and enables headroom to prevent audio holes under extreme conditions such as low load impedances.
Avnet and Xilinx partner to deliver ATCA development platform Product News 2/19/2004 Post a comment Avnet Cilicon, a division of Avnet Inc. and Xilinx Inc. launched a new Advanced Telecom Computing Architecture (ATCA) Development Platform Program at the Intel Developer Forum this week that enables rapid deployment of Xilinx's new programmable AdvancedTCA solution for product development.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Are the design challenges the same as with embedded systems, but with a little developer- and IT-skills added in? What do engineers need to know? Rick Merritt talks with two experts about the tools and best options for designing IoT devices in 2016. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.