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Content tagged with Semiconductors posted in February 2008
<<   <   Page 5 / 5
Intel, SanDisk, ST, Toshiba tip next-gen memories
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2/6/2008   Post a comment
The next-generation memory race continues to enfold, as several more vendors are jumping out of the starting blocks.
CPU designers debate multi-core future
News & Analysis  
2/6/2008   1 comment
Microprocessor engineers agree multi-core design is the wave of the future, but they differ widely on how to implement them and surmount the many challenges they pose based on a panel at the International Solid State Circuits Conference that gathered senior chip designers from Advanced Micro Devices, IBM, Intel, Renesas, Sun Microsystems and startup Tilera.
Altera's Stratix III FPGAs win 2008 DesignVision Award
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2/6/2008   Post a comment
Altera's high-end FPGA family recognized for its innovative programmable power technology, selectable core voltage, and DDR3 memory interface.
Mobile TV heats up (again) with Broadcom's 65-nm SOC
Product News  
2/6/2008   1 comment
The oft-hyped mobile TV market is re-emerging with a vengeance at the Mobile World Congress as Broadcom joins the fray with the industry's first single-chip DVB-T/DVB-H system-on-chip based on 65-nm CMOS process technology.
Xilinx and the Mobile World Congress 2008
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2/6/2008   Post a comment
Xilinx will be unveiling solutions for mobile phone base stations at the Mobile World Congress in Barcelona, February 11-14, 2008.
64-bit RFID tag could replace bar codes
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2/6/2008   Post a comment
Researchers from the European Holst Center said their 64-bit, inductively-coupled, passive RFID tag achieved a record 780-bit/second data readout.
Lattice captures DesignVision award for its LatticeXP2 FPGAs and design tools
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2/6/2008   Post a comment
International Engineering Consortium recognizes Lattice's advanced technology achievements in FPGA hardware and design software.
ISSCC shrinks 11n, Wimax and Bluetooth
Product News  
2/6/2008   1 comment
The cost of the latest Wi-Fi and Bluetooth links are headed south, and WiMax may come to a cellphone near you soon based on papers from Atheros and STMicroelectronics at the International Solid State Circuits Conference.
1.8V video amplifier automatically adjusts power consumption
Product News  
2/6/2008   Post a comment
Maxim Integrated Products has introduced the MAX9516 video amplifier, which detects and reports the presence of a video load and reduces power consumption when the load is not present.
400kHz rise time accelerator improves I²C/SMBus system reliability
Product News  
2/6/2008   Post a comment
Linear's rist time accelerator provides a wide supply voltage range, low power shutdown mode, strong pull-up current, tight bus hold-off threshold, voltage improved ESD ruggedness and reduced package size.
Chip combines upconverter, crest factor reduction, pre-distortion
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2/6/2008   Post a comment
The Texas Instruments GC5322 device increases the efficiency of multi-carrier power amplifiers (PAs) in the RF transmit signal chain and eliminates the need for more costly high-performance RF power amplifier components.
TI rolls infrastructure platform for HSPA+
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2/6/2008   Post a comment
Texas Instruments has announced an HSPA+ upgrade for its base station development platform. Based on the TCI6488 DSP, the platform offers updated WCDMA RAC software.
Kit does digital filtering for wideband signal repeaters
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2/6/2008   Post a comment
Texas Instruments today introduced a four-channel wideband digital repeater evaluation module that isolates up to four non-contiguous spectrum bands. The TSW4100 also offers a digital filter design tool for wireless basestations.
TI delivers single chip baseband solution
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2/6/2008   Post a comment
The TCI648 is TI's first first DSP to combine PHY and MAC processing on a single chip. It targets cellular infrastructure applications such as HSPA/HSPA+, LTE and WiMAX Wave 2.
Engineers grapple with digital radio at ISSCC
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2/5/2008   Post a comment
Lowering cellphone costs by integrating radio components was a big theme for engineers at the International Solid-State Circuits Conference where several big cellphone chip makers described their current integrated digital RF devices and others showed different techniques to eliminate external passive components.
TI reveals details of 45-nm process
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2/5/2008   Post a comment
Texas Instruments described how it lowered power by 63 percent and increased performance by 55 percent for its DSPs at the 45-nm node at the International Solid-State Circuits Conference.
Wireless front end remains an integration challenge
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2/5/2008   Post a comment
A panel at the International Solid Sate Circuits Conference examined potential solutions for integrating wireless interfaces onto a chip.
At ISSCC, IMEC details ADC, 60-GHz wireless developments
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2/5/2008   Post a comment
At the International Solid State Circuit Conference, IMEC researchers detailed their latest feats in data conversion and wireless 60-GHz.
TI, MIT team to design ultra-low voltage chip
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2/5/2008   Post a comment
A new version of a Texas Instruments low-power microcontroller that implements an experimental design technique conceived at the Massachusetts Institute of Technology promises another 10-fold cut in power consumption.
Keynoter says chips will someday mimic human brain
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2/5/2008   Post a comment
Tomorrow's semiconductors will mimic the human brain to solve problems in novel ways, according to Jeff Hawkins whose startup Numenta is shipping tools to create smart algorithms that learn the same way as the human neocortex.
Startup puts wireless monitor on a band-aid
Product News  
2/5/2008   Post a comment
Sometime next year nurses may put active band-aids on hospital patients to wireless monitor as many as three vital signs thanks to a new chip described by startup Toumaz Technology at the International Solid State Circuits Conference.
NEC-Intel sets sights on benchmark PMICs for mobiles
News & Analysis  
2/4/2008   Post a comment
Touting a new era in highly integrated power management ICs (PMICs) that can be delivered in record time, NEC Electronics (Kawasaki, Japan) and its U.S. subsidiary NEC Electronics America have teamed with Intel Corporation to develop benchmark-level chips for advanced mobile Internet devices (MIDs).
Analog IC incorporates adjustable resistor technology
Product News  
2/4/2008   Post a comment
Microbridge Technologies has introduced the industry's first active analog circuit to incorporate the company's passive, polysilicon adjustable resistor technology.
Flash memory/RAM devices target entry-level handsets
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2/4/2008   Post a comment
SST has expanded the company's family of high-performance flash memory/RAM combination memory products with the introduction of the 34WA series of 1.8-V ComboMemory devices.
IMEC tapes out SDR platform
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2/4/2008   Post a comment
IMEC has taped out its flexible-air-interface (FLAI) baseband platform for software defined radio (SDR).
GaAs MMIC chipset packaging uses surface-mount technology
Product News  
2/4/2008   Post a comment
Mimix Broadband's latest receiver delivers a 3.5 dB noise figure, and its transmitter provides a linear, variable gain.
PicoChip, MimoOn team for LTE ref design
Product News  
2/4/2008   Post a comment
picoChip has teamed with MimoOn (Duisburg, Germany), a start-up focusing on IP for MIMO technologies, for an end-to-end LTE reference design. The companies plan to demonstrate the platform, which shares many commonalities with WiMAX designs, at next week's Mobile World Congress in Barcelona, Spain.
Freescale to pay $100M for SigmaTel
News & Analysis  
2/4/2008   Post a comment
Freescale Semiconductor Inc. has agreed to pay $100 million for SigmaTel Inc., to broaden its offerings in the consumer electronics market as the company looks for growth beyond the wireless IC market.
Music player IC improves audio quality, playtime on portables
Product News  
2/4/2008   Post a comment
The AS3532 audio subsystem IC from austriamicrosystems brings high-definition audio and sub-5-mW decompression/playback of MP3, WMA and AAC files to portable media players and mobile phones.
Swedish start-up details programmable WiMax baseband chip
Product News  
2/4/2008   Post a comment
At the International Solid State Circuits Conference here this week a Swedish start-up will detail a fully programmable baseband processor for mobile wireless applications.
AMS brings hi-def audio to mobile devices
Product News  
2/4/2008   Post a comment
With the launch of a new high-definition audio player chip family, Austriamicrosystems (AMS) enables handset designers to set new standards for audio quality in mobile devices. With the chips, the company follows the usage trend towards lossless audio formats.
Lattice : Upgraded FPGA design tool suite offers powerful enhancements
Product News  
2/4/2008   Post a comment
Lattice Semiconductor has announced the Service Pack 2 for Version 7.0 of its ispLEVER‚ FPGA design tool suite.
Poll: It's the economy again, stupid
News & Analysis  
2/4/2008   Post a comment
Fifty-six percent of respondents said the economy was the most important of nine business and tech issues in the U.S. presidential campaign, in an informal poll conducted by EE Times.
Multi-sensor interface chip consumes 30-µW of power
Product News  
2/3/2008   Post a comment
ZMD launched the first member of its MULti-Sensor IC (MUSiC) semiconductor family—the ZMD21013, which is a low-power multi-channel device aimed at microcontroller-based mobile electronic products.
New memory cards offer 50 percent faster read and write speed, 32GB capacity
Product News  
2/1/2008   Post a comment
Giving photo enthusiasts the freedom to take more pictures and shoot more video, SanDisk Corporation increased both capacities and speeds in its SanDisk Ultra II line with the introduction of 32- and 16-gigabyte (GB)1 SDHC cards and an 8GB SDHC Plus card.
Analysis: Phone spinoff could be beginning of the end for Motorola
News & Analysis  
2/1/2008   1 comment
Motorola Inc.'s decision to explore the possibility of spinning of its loss-making handset division might result in the break up of the entire company and the eventually demise of another American icon.
<<   <   Page 5 / 5


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