CPU designers debate multi-core future News & Analysis 2/6/2008 1 comment Microprocessor engineers agree multi-core design is the wave of the future, but they differ widely on how to implement them and surmount the many challenges they pose based on a panel at the International Solid State Circuits Conference that gathered senior chip designers from Advanced Micro Devices, IBM, Intel, Renesas, Sun Microsystems and startup Tilera.
Mobile TV heats up (again) with Broadcom's 65-nm SOC Product News 2/6/2008 1 comment The oft-hyped mobile TV market is re-emerging with a vengeance at the Mobile World Congress as Broadcom joins the fray with the industry's first single-chip DVB-T/DVB-H system-on-chip based on 65-nm CMOS process technology.
ISSCC shrinks 11n, Wimax and Bluetooth Product News 2/6/2008 1 comment The cost of the latest Wi-Fi and Bluetooth links are headed south, and WiMax may come to a cellphone near you soon based on papers from Atheros and STMicroelectronics at the International Solid State Circuits Conference.
Engineers grapple with digital radio at ISSCC News & Analysis 2/5/2008 Post a comment Lowering cellphone costs by integrating radio components was a big theme for engineers at the International Solid-State Circuits Conference where several big cellphone chip makers described their current integrated digital RF devices and others showed different techniques to eliminate external passive components.
TI reveals details of 45-nm process Product News 2/5/2008 Post a comment Texas Instruments described how it lowered power by 63 percent and increased performance by 55 percent for its DSPs at the 45-nm node at the International Solid-State Circuits Conference.
TI, MIT team to design ultra-low voltage chip News & Analysis 2/5/2008 Post a comment A new version of a Texas Instruments low-power microcontroller that implements an experimental design technique conceived at the Massachusetts Institute of Technology promises another 10-fold cut in power consumption.
Startup puts wireless monitor on a band-aid Product News 2/5/2008 Post a comment Sometime next year nurses may put active band-aids on hospital patients to wireless monitor as many as three vital signs thanks to a new chip described by startup Toumaz Technology at the International Solid State Circuits Conference.
NEC-Intel sets sights on benchmark PMICs for mobiles News & Analysis 2/4/2008 Post a comment Touting a new era in highly integrated power management ICs (PMICs) that can be delivered in record time, NEC Electronics (Kawasaki, Japan) and its U.S. subsidiary NEC Electronics America have teamed with Intel Corporation to develop benchmark-level chips for advanced mobile Internet devices (MIDs).
PicoChip, MimoOn team for LTE ref design Product News 2/4/2008 Post a comment picoChip has teamed with MimoOn (Duisburg, Germany), a start-up focusing on IP for MIMO technologies, for an end-to-end LTE reference design.
The companies plan to demonstrate the platform, which shares many commonalities with WiMAX designs, at next week's Mobile World Congress in Barcelona, Spain.
Freescale to pay $100M for SigmaTel News & Analysis 2/4/2008 Post a comment Freescale Semiconductor Inc. has agreed to pay $100 million for SigmaTel Inc., to broaden its offerings in the consumer electronics market as the company looks for growth beyond the wireless IC market.
AMS brings hi-def audio to mobile devices Product News 2/4/2008 Post a comment With the launch of a new high-definition audio player chip family, Austriamicrosystems (AMS) enables handset designers to set new standards for audio quality in mobile devices. With the chips, the company follows the usage trend towards lossless audio formats.
Poll: It's the economy again, stupid News & Analysis 2/4/2008 Post a comment Fifty-six percent of respondents said the economy was the most important of nine business and tech issues in the U.S. presidential campaign, in an informal poll conducted by EE Times.
A Book For All Reasons Bernard Cole1 Comment Robert Oshana's recent book "Software Engineering for Embedded Systems (Newnes/Elsevier)," written and edited with Mark Kraeling, is a 'book for all reasons.' At almost 1,200 pages, it ...