January chip sales seen down 30% year-on-year News & Analysis 2/27/2009 Post a comment The three-month moving average of global chip sales is expected to come in at $15.1 billion for January, down from the $17.7 billion achieved in December 2008, according to analysts at Carnegie Group (Oslo, Norway).
Analyst weighs benefits of Nokia/Qualcomm link News & Analysis 2/27/2009 Post a comment Qualcomm is likely to see its position as the leading supplier of baseband chips for next generation mobile handsets enhanced following its recent deal with Nokia, but the jury is still very much out on just what market share gains it woud enjoy, according to market research group iSuppli.
Comment: Android beyond the phone News & Analysis 2/26/2009 Post a comment Look out, Redmond, I'm seeing signs that Google's Android could wind up in netbooks, digital picture frames and a host of embedded devices as a friendly, app-rich face for Linux.
250mA LDO withstands 80V input Product News 2/26/2009 Post a comment Linear Technology has announced a high reliability (MP) grade, wider temperature range version of the LT3013, a micropower LDO with input voltage capability up to 80V.
Audio network chip start-up nabs $6 million News & Analysis 2/26/2009 Post a comment BridgeCo Inc., the provider of processor IC and software platforms for home networking and Internet radio, has raised a further $6 million from its existing backers, bringing the total raised to $59 million.
Analyst: Trio dominated GaAs device market in '08 News & Analysis 2/26/2009 Post a comment The market for Gallium Arsenide devices grew by 9 percent in 2008, according to market research group Strategy Analytics, with early estimates showing that RFMD, Skyworks and TriQuint further consolidated their position in the sector.
Credit Watch: Chartered's survival hinges on Temasek News & Analysis 2/25/2009 Post a comment A major ratings agency has downgraded Chartered Semiconductor Manufacturing Co. Ltd.'s bonds further into junk territory but the Singapore foundry's remains a viable player in the wafer business because of the support it can count on from parent Temasek Holdings Pte Ltd.
Home networking groups edge toward G.hn News & Analysis 2/25/2009 1 comment Three ad hoc groups promoting competing networking standards have formed liaisons with the Home Grid Forum, another step toward industry support for the ITU G.hn effort to create a single wired standard for home networks over powerline, coax and telephone lines.
Sales up but losses widen at ARC News & Analysis 2/25/2009 Post a comment ARC international (St Albans, England) increased revenues by 18 percent to £17 million for the year ended December 2008, with revenues from royalties steaming ahead by 61 percent to £7.9 million compared with the previous year. Licensing revenues, however, were flat at £7.3 million as the company cautioned that uncertainty in the semiconductor industry might affect the timing of new licence revenues and royalty volumes this year.
HomePlug SoC set to debut at CeBIT News & Analysis 2/24/2009 Post a comment SPiDCOM Technologies, a fabless chip group focusing on ICs and Linux-based software bundles for broadband access and home networks, is set to unveil its next generation HomePlug AV SoC at CeBIT, in Hannover, which kicks off March 3rd.
Sinking stocks complicate high-tech recovery News & Analysis 2/24/2009 Post a comment Many high-tech stocks have fallen by as much as 80 percent to 90 percent in the last 12 months, crushing their market value and potentially complicating recovery efforts by these companies, some of which may need to tap the investment markets for funds as cash hoards become depleted.
Analysis: Japan's electronics giants face inevitable breakup News & Analysis 2/24/2009 Post a comment In order to survive what's now being billed as the worst global economic depression in decades, Japan's Big-5 high-tech companies will have to accelerate their reorganization efforts and merge, shutter or spin off non-profitable semiconductor, hard disk drive and system LSI businesses.
RFEL to sponsor DSP expertise courses News & Analysis 2/24/2009 Post a comment Signal processing based applications specialist RF Engines Ltd (Isle of Wight, England) is investing in the future by not only continuing to recruit engineers but has started sponsoring students focusing on MSc degrees at the University of York.
Marvell rolls plan for 'plugtop PCs' Product News 2/24/2009 Post a comment Marvell Technology Group Ltd. has announced a so-called Plug Computing initiative and a $99 developer's kit using its 1.2 GHz ARM-based processor to drive to its vision of a variety of "wall-warts" that build in its Sheeva CPU and act like embedded home computers.
Micron shutting 200-mm fab, cutting more jobs News & Analysis 2/23/2009 Post a comment Memory chip specialist Micron Technology will cut up to 2,000 jobs and phase out 200-mm wafer manufacturing operations at the company's Boise, Idaho headquarters in response to deteriorating economic conditions.
Groups extend 3-D stacking collaboration News & Analysis 2/23/2009 Post a comment French research group CEA-Léti (Grenoble) and Brewer Science (Rolla, MO), Inc. have extended their partnership on the development of 3-D chip stacking processes to create a common laboratory.
Torex : Voltage regulators offer low dropout voltage Product News 2/23/2009 Post a comment Available in the tiny USP-6C package (1.8 x 2.0 x 0.6 mm), as well as in standard SOT-25 and SOT-89-5 versions, the XC6220 Series of voltage regulators from Torex Semiconductor offer low dropout voltage – typically 20 mV with a 100 mA load.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Are the design challenges the same as with embedded systems, but with a little developer- and IT-skills added in? What do engineers need to know? Rick Merritt talks with two experts about the tools and best options for designing IoT devices in 2016. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.