Lattice moves away from high-end FPGAs News & Analysis 2/23/2009 Post a comment After a period of losses and competitive pressures, Lattice Semiconductor Corp. is refining its focus and moving away from the high-end of the field-programmable gate array (FPGAs) race.
AxisNT touts efficiency gains of tripe mode PA module News & Analysis 2/23/2009 Post a comment Wireless infrastructure group Axis Network Technology (Aylesbury, England) has started sampling a triple mode power amplifier module and IP linearization solution that, it says, offers a 45 percent final stage efficiency for UMTS 64QAM systems at 2.1GHz.
ARM preps tiny core for low-power microcontrollers Product News 2/23/2009 2 comments With help from lead partner and licensee NXP, ARM Holdings plc has designed a very low gate-count ARM processor core suitable for use in microcontrollers aimed at ultra-low power applications. Chips are expected to ship from licensees before the end of 2009.
Analysis: Will Synopsys take over the world? News & Analysis 2/20/2009 1 comment While competitors stumble amid the downturn, Synopsys is firing on all cylinders and beating analyst expectations with revenue and profit. Executives say Synopsys' financial strength will drive future marketshare gains. But do customers want an EDA market with one dominant player?
Zilog vend sa division wireless control News & Analysis 2/20/2009 Post a comment Maxim et Universal Electronics Incorporated ont racheté ensemble l'activité "Wireless Control" de Zilog ce qui ne laissera que les microcontrôleurs standard dans ce qui fut le pionnier des microprocesseurs avec le Z80.
Hyperstone : 32-Bit MCU suits cost-sensitive applications Product News 2/20/2009 Post a comment Hyperstone has introduced the high-performance E2 – 32-bit RISC/DSP microcontroller with additional on-chip highlights such as programmable serial communication engine, an analog to digital converter and 32 kBytes on chip (I-RAM) complemented by an external memory and peripheral interface controller.
Updated: NAND capex seen dropping 59% in 2009 News & Analysis 2/19/2009 2 comments Total NAND flash memory manufacturing capex is expected to fall by 59 percent in 2009 after decreasing by 28 percent in 2008, according to an analysis by DRAMeXchange, a memory clearing house.
WCDMA power amplifiers with integrated directional couplers News & Analysis 2/19/2009 Post a comment kyworks Solutions has introduced a family of single and dual-band WCDMA power amplifiers (PA) for universal mobile telecommunications system (UMTS) applications that integrate the directional coupler, significantly reducing the phone board footprint and bill-of-material costs.
Vanishing 'goodwill' erodes high-tech asset value News & Analysis 2/19/2009 1 comment High-tech corporate assets have fallen sharply across the industry in recent quarters as businesses remove chunks of increasingly worthless goodwill intangible assets from their balance sheets and as cash utilization accelerate due to payouts to laid off employees and requirements for funding a variety of additional reorganization actions.
ADI accelerating fab consolidation as sales fall News & Analysis 2/18/2009 Post a comment Analog Devices will accelerate plans to consolidate its two remaining U.S. fabs into one facility as part of an effort to permanently reduce spending in the face of further projected revenue decline of 5 to 15 percent this quarter, the company said. Revenue from ADI's most recent quarter declined 28 percent sequentially.
Recession seen slowing embedded modem growth News & Analysis 2/18/2009 Post a comment More than 35 million cellular modems for laptops and netbooks shipped in 2008, 10 percent of which were embedded in the computers, according to market research firm ABI Research. The firm expects the number of embedded modems to double to 7 million units in 2009, fewer than it had previously forecast.
High-end clusters a bright spot in downturn News & Analysis 2/18/2009 Post a comment The high performance computing market will decline 5.4 percent in 2009, but remain one of the most resilient sectors in information technology through the recession, according to the latest forecast from International Data Corp.
Economic realities to impact LTE roll-out News & Analysis 2/18/2009 Post a comment Fourth generation networks and specifically LTE (Long Term Evolution) may be one of the major talking points here at the Mobile World Congress, but the messages are unclear about what their impact will be in the short term.
Analyst bullish on Broadcom's cellular business News & Analysis 2/17/2009 Post a comment The announcement that Broadcom will be a supplier to some of Nokia's next generation high-speed packet access-based handsets continues a pattern of recent design wins that should position Broadcom to gain share in the cellular handset market in years to come, according to Craig Berger, an analyst with FBR Capital Markets.
LED driver claims flickerless dimming Product News 2/17/2009 Post a comment Responding to a significant number of requests for a TRIAC dimmable LED driver, National Semiconductor has introduced a constant-current controller that enables uniform dimming of LEDS without flicker.
LSI rolls multicore strategy Product News 2/17/2009 Post a comment LSI Corp. rolled out at the Mobile World Congress a new multicore strategy behind an upcoming family of chips targeting wireless infrastructure gear, mixing and matching its portfolio of cores and on-chip interconnects from recent acquisitions to create new standard products and ASIC offerings.
Convertisseur 0,32V pour cellule solaire News & Analysis 2/17/2009 Post a comment Freescale Semiconductor a présenté une technologie de conversion de puissance fonctionnant dès 0,32V et conçue pour les applications photovoltaïques. Le convertisseur continu/continu fournit un voltage de sortie de 4 V.
Mellanox bridges data center nets News & Analysis 2/17/2009 Post a comment Mellanox Technologies, Ltd. will jump into the market for multi-protocol bridging chips and systems with its BridgeX chip and a family of gateway systems based on it supporting 40Gb/s InfiniBand, 10 Gigabit Ethernet and 8Gb/s Fibre Channel.
Capacitive sensor measurement made simple Product News 2/17/2009 2 comments Interfacing to MEMS transducers, such as those that sense acceleration, pressure, altitude, humidity, rain, level and gas, e2v's CPIC2.0 ic has been designed to ease the process of sensor data acquisition.
Qualcomm, Nokia start making up Product News 2/17/2009 Post a comment Both ST-Ericsson and Qualcomm Inc. have revealed partnership programmes with Nokia based round reference platforms that will use the Symbian Foundation's software.
SDR solution targets GSM/EDGE base stations Product News 2/16/2009 Post a comment Octasic today announced Vocallo BTS, its Software Defined Radio platform for GSM, EDGE and EDGE Evolution base stations. The platform implements a complete Layer 1 solution for up to 12 GSM carriers or 6 EDGE carriers or any combination.
TI unveils multi-core OMAP 4 Product News 2/16/2009 Post a comment Texas Instruments has expanded its popular OMAP mobile applications platform and processors, with the fourth generation set to be the first devices that use ARM's Cortex-A9 MPCores.
Startup aims Wi-Fi at embedded systems Product News 2/16/2009 Post a comment Startup ZeroG Wireless officially throws its hat into the ring of competitors trying to bring Wi-Fi to embedded systems with a new chip and module that could bring 802.11b connectivity to new lows in cost, size and power consumption.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Are the design challenges the same as with embedded systems, but with a little developer- and IT-skills added in? What do engineers need to know? Rick Merritt talks with two experts about the tools and best options for designing IoT devices in 2016. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.