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Content tagged with Semiconductors posted in February 2010
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MCUs - Renesas MCUs for advanced driver assistance system apps boast small size and low cost
News & Analysis  
2/27/2010   Post a comment
Renesas MCUs for driver assistance systems include compact 13 mm - 13 mm package, large-capacity memory, 4-channel CAN, 2-channel FlexRay and are designed for popularly priced vehicles.
6-channel system managers with nonvolatile fault memory facilitate diagnostics
Product News  
2/26/2010   Post a comment
Maxim Integrated Products' MAX16067/MAX16068 integrate nonvolatile fault registers to facilitate failure analysis and are available with an easy-to-use graphical configuration tool that simplifies diagnostics and configuration.
Adjunct SOC for power amplifier performs complex signal processing in RF domain
Product News  
2/25/2010   Post a comment
Scintera has developed a power amplifier linearization SoC that performs complex signal processing in the RF domain, resulting in low-power consumption, wide signal bandwidth, and broad frequency operation.
ST beefs up SPEAr MPU line
Product News  
2/25/2010   Post a comment
STMicroelectronics has added four new devices to its SPEAr microprocessor family, targeting embedded-control applications across market segments from computer peripherals and communication to industrial automation.
Opinion: Microchip must raise SST offer again
News & Analysis  
2/24/2010   1 comment
Microchip Technology Inc. will have to significantly raise its offer for Silicon Storage Technology Inc., perhaps up to $4.00 per share from the current price of $3.00 if it wants to gain control of the company and end a brewing bidding war with a private equity firm.
Mil/aero group foresees shift to optical in 2012
News & Analysis  
2/24/2010   1 comment
The VITA Standards Organization, a leading standards group for military and aerospace markets, will announce as early as next week a call for participation in a group to explore the feasibility of deploying in 2012 products with optical backplanes and system interconnects.
Samsung is mass producing 4-Gbit DDR3 DRAM
Product News  
2/24/2010   3 comments
Memory chip vendor Samsung Electronics Co., Ltd., has announced it has begun mass production of a 4-Gbit DDR3 devices using 40-nm process technology.
Altera transitions its 40nm Arria II GX FPGAs to production
Product News  
2/24/2010   Post a comment
Altera announced it is shipping in volume production the first members of its 40nm Arria II GX FPGA family specifically targeting 3-Gbps transceiver applications
Global shipments of short range wireless ICs to exceed 2 billion units in 2010
News & Analysis  
2/24/2010   Post a comment
Global shipments of short range wireless ICs (Bluetooth, NFC, UWB, 802.15.4, Wi-Fi) are expected to surpass two billion units this year, increasing approximately 20 percent compared to 2009. Shipments are forecast to total five billion in 2014, according to new market data from ABI Research
Power management chip debuts with on-chip PMBus support
Product News  
2/23/2010   Post a comment
National has unveiled a system power management chip dubbed the LM25066 that is designed to reduce data center operating expenses and improve system reliability.
iPhone/iPod dock ref design enables bit-perfect audio streaming
Product News  
2/23/2010   1 comment
An iPhone/iPod dock reference design from XMOS eliminates analog audio processing components, reducing RF interference and enabling bit-perfect digital audio for highest fidelity audio performance.
Mid-year slump to limit chip market growth, says analyst
News & Analysis  
2/23/2010   Post a comment
A mid-year slump in the western economy is likely to inhibit consumer electronics spending and hold annual semiconductor revenue growth back at 11.2 percent in 2010, according to Robert Castellano of market research company The Information Network (New Tripoli, Pennsylvania).
TSMC, Dialog team on process for power management ICs
News & Analysis  
2/23/2010   Post a comment
Power management chip vendor Dialog Semiconductor plc (Kirchheim-unter-Teck, Germany) has announced it is working with foundry partner Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan) on a bipolar-CMOS-DMOS (BCD) manufacturing process technology tailored to power management ICs for portable devices.
BOARDS - 3.5" SBC with Intel Atom Processor N270 and DualView support saves energy
News & Analysis  
2/23/2010   Post a comment
Axiomtek's SBC84833 3.5-inch embedded board offers high reliability, excellent performance and power efficiency in small form factor.
Tiny RF switch delivers +67 dBm IIP3
Product News  
2/22/2010   Post a comment
Peregrine Semiconductor recently announced an SP4T RF switch that is designed using the company's green UltraCMOS silicon-on-sapphire process technology, yielding broadband RF performance to 3-GHz.
IEEE 802.3af/at-compliant PD interface controllers enable PoE+ powered devices
Product News  
2/22/2010   Post a comment
Maxim is offering IEEE 802.3af/at-compliant PD interface controllers that feature a 100V absolute maximum rating and built-in wall-adapter detection to simplify the design of PoE+ PDs.
ARM launches M4 signal-control MCU core
News & Analysis  
2/22/2010   2 comments
ARM Holdings plc (Cambridge, England) has announced the launch of the Cortex-M4 microcontroller core for use in digital signal control and that the core has been licensed by five companies including NXP, STMicroelectronics and Texas Instruments.
Junctionless transistor could simplify chip making, say researchers
News & Analysis  
2/22/2010   Post a comment
In a move that could revolutionize nanoelectronics manufacturing and the semiconductor industry, scientists at the Tyndall National Institute (Cork, Ireland) have designed and fabricated what they claim is the world's first junctionless transistor.
SOFTWARE TOOLS - Embedded Workbench for ARM 5.41 achieves 13% performance improvement
Product News  
2/20/2010   Post a comment
The latest release of IAR Systems' Embedded Workbench for ARM is highly optimized for code size and increased execution speed. The company states it performs up to 13 percent better on CoreMark benchmarks for Cortex-M0 compared to the previous version of IAR Embedded Workbench.
Analysts: Five observations on mobile from MWC
News & Analysis  
2/19/2010   Post a comment
Apple and software are in the driver's seat in the mobile market but platform fragmentation may be ahead, according to analysts from Barclay's Capital who shared their observations from the Mobile World Congress in Barcelona this week.
SOFTWARE TOOLS - SYSGO ELinOS supports TI's OMAP35x evaluation module
News & Analysis  
2/19/2010   Post a comment
SYSGO has launched ELinOS 5.0, a Linux operating system that supports the Texas Instruments OMAP35x Evaluation Module. The new SYSGO support package combines high performance and minimal power levels with industrial grade Linux in a single chip. The package enables rapid development of reliable long-lived applications.
TSMC/Mapper: Multiple e-beam tech to become litho standard
News & Analysis  
2/19/2010   3 comments
After months of collaboration, foundry chip supplier Taiwan Semiconductor Manufacturing Co. Ltd. (TSMC) and Mapper Lithography BV (Delft, Netherlands) claimed that Mapper's tool located on TSMC's Fab 12 GigaFab is printing features so far unachievable with current immersion lithography technology.
NEC launches 14 new 8-bit MCUs for automotive dashboard applications
Product News  
2/19/2010   Post a comment
NEC Electronics announced the availability of 14 new all flash microcontrollers, the 78K0/Dx2 product series that includes a wide range of peripherals with either 80 or 64 pins and memory capacity ranging from 60 down to 24 kilobytes
DSPs - HiFi EP audio IP core uses 40 percent less power
News & Analysis  
2/18/2010   Post a comment
Tensilica's new HiFi IP audio DSP core reduces power requirements by up to 40 percent. It is designed for high quality audio in home entertainment and smartphone apps.
SMSC acquires wireless audio IC vendor
News & Analysis  
2/18/2010   Post a comment
Mixed-signal IC vendor SMSC said it acquired Kleer Semiconductor, a maker of chips for wireless audio. Financial terms of the agreement were not disclosed.
Intel lab explores nanoscale power storage
News & Analysis  
2/18/2010   1 comment
Intel researchers are exploring nanoscale materials that could be used to create ultracapacitors with a greater energy density than today's lithium ion batteries as part of work in a new lab dedicated to work on microgrids.
Dual Output, multiphase step-down DC/DC controller operates with power blocks & DrMOS devices
Product News  
2/17/2010   Post a comment
Linear Technology Corporation introduces the LTC3860, a dual output synchronous step-down DC/DC controller with multiphase operation, differential output voltage sensing and high frequency operation.
PLX fires up 8 GHz PCI Express chip
News & Analysis  
2/17/2010   Post a comment
PLX Technology, Inc. announced it has working PCI Express Gen 3 silicon that it will demo to key customers before the end of March and aims to sample a range of PCIe Gen 3 switches made in 40nm process technology before the end of the year, starting with server and storage switches sampling before July.
WIRELESS: Transcede processors serve 3G/4G/LTE mobile infrastructure
Product News  
2/17/2010   Post a comment
Transcede application-specific SoCs from Mindspeed reduce system power, complexity and cost while boosting performance for 3G/4G/LTE mobile infrastructure.
Analyst boosts forecast for PC processor sales
Product News  
2/17/2010   Post a comment
Growth in unit sales of PC processors and PC servers will be stronger than expected this year, according to a report by Wall Street Analyst firm Barclays Capital, however, the firm forecasts declines in the average selling prices of the chips for the next two years.
U.S.: Fake parts threaten electronic market
News & Analysis  
2/17/2010   8 comments
Electronic parts counterfeiters are taking advantage of numerous loopholes within the industry supply chain to infiltrate the system and pose a significant threat to the entire market, according to a U.S. government finding.
ZeroG chief executive joins GainSpan
News & Analysis  
2/17/2010   Post a comment
Greg Winner has been named chief executive of embedded Wi-Fi chip startup GainSpan Corp., fresh from closing a deal in January to sell its competitor startup ZeroG to Microchip Technology Inc.
Intel joins RPX patent defense pool
News & Analysis  
2/16/2010   Post a comment
Intel Corp. has joined the patent aggregation service of RPX Corp., a move the startup claims comes at a time when patent suits are on the rise.
Imagination unfazed by Samsung's Mali move
News & Analysis  
2/16/2010   Post a comment
Graphics core licensor Imagination Technologies Group plc (Kings Langley, England) has stated that it expects to have continued success with Samsung Electronics Co. Ltd., despite the latter's uptake of graphics from archrival ARM Holdings plc (Cambridge, England).
Qimonda R&D equipment up for auction
News & Analysis  
2/16/2010   Post a comment
Approximately 650 lots of automatic test equipment, assembly and packaging and test and measurement instruments formerly used by Qimonda at a site in Munich, Germany, for DRAM R&D are due to go under the hammer on Wednesday Feb. 24.
Six new femtocell customers take up picoChip's picoXcell SoC
Product News  
2/16/2010   Post a comment
PicoChip has announced that Alpha Networks, Argela, Askey, C&S Micro, Contela and Zyxel are the latest customers to use picoChip's PC302 picoXcell™ SoC in HSPA+ femtocell designs.
Deserializer display bridge chip connects advanced baseband or application processors to displays with parallel interfaces
Product News  
2/16/2010   Post a comment
Toshiba Electronics Europe has unveiled a new deserializer display bridge chip that connects the baseband or application processors used in smart phones, which use Mobile Industry Processor Interface-Display Serial Interfaces (MIPI-DSI), to displays with legacy parallel interfaces.
Multi-band multi-standard transceiver with fully integrated ADC and DAC targets femtocell applications
Product News  
2/16/2010   Post a comment
Lime Microsystems has announced the LMS6002D, a multi-band multi-standard RF transceiver IC designed for small cell base stations and femtocells, featuring integrated high performance dual ADC and DAC.
Nokia and Intel create open Linux platform called MeeGo for mobile computing
Product News  
2/16/2010   Post a comment
Nokia and Intel have announced the merger of Maemo and Moblin to create MeeGo, a Linux-based software platform designed to work across a range of hardware architectures and devices including mobile computers, netbooks, tablets, mediaphones, connected TVs and in-vehicle infotainment systems.
Six things that surprised us at ISSCC
News & Analysis  
2/16/2010   1 comment
The pervasive focus on power management, the lack of papers on nanotechnology and software and the slow recovery of attendance were among the surprises for EE Times editors at the 2001 ISSCC last week.
Infineon aims Android phones at high volume
News & Analysis  
2/15/2010   Post a comment
Infineon Technologies AG (Munich, Germany) has announced the availability of the XMM6181 reference design, which is intended to help engineers create entry-level Android smartphones.
TI samples OMAP 4, but only to big players
News & Analysis  
2/15/2010   Post a comment
Texas Instruments is sampling its OMAP 4 application processor implemented on a 45-nm manufacturing process technology, the company said at the Mobile World Congress. But added the caveat that OMAP 4 is only intended for high-volume OEMs and ODMs and the part will not be sold through distributors.
HARDWARE TOOLS - ChipWrights' hardware dev kit speeds design of video processing apps
Product News  
2/15/2010   Post a comment
A new hardware development kit from ChipWrights, Inc., is based on the CW5631 system-on-chip (SoC), which is used for the design of multimedia applications.
Samsung bets on ARM's Mali for graphics
News & Analysis  
2/15/2010   Post a comment
Samsung Electronics Co. Ltd. has announced that it is adopting the Mali graphics processor architecture from ARM Holdings plc (Cambridge, England) for its future graphics-enabled system-on-chip (SoC) ICs as well as for its ASIC and foundry business.
Energy-efficient 3-axis accelerometer enables faster and more accurate motion detection
Product News  
2/15/2010   Post a comment
Freescale Semiconductor has introduced its MMA8450Q accelerometer, a highly accurate, power-efficient solution that extends battery life for smart mobile devices and captures precise movement via highly sensitive gesture and orientation detection capabilities.
RF configurable power core covers multiband, multi-mode cellular air interface standards
Product News  
2/15/2010   Post a comment
RFMD launched its PowerSmart power platforms, based on a new RF configurable power core for increased functional efficiency and delivering state-of-the-art processing for all known cellular communications modulation schemes
GlobalFoundries, ARM tip 28-nm process for mobile
News & Analysis  
2/15/2010   Post a comment
GlobalFoundries Inc. (Sunnyvale, Calif.) and ARM Holdings plc (Cambridge, England) have announced some details of 28-nm manufacturing process technologies for wireless products. They also claim to have a mobile SoC "platform" based on the Cortex-A9 processor core.
ESC: Multicore ecosystem still evolving
News & Analysis  
2/12/2010   Post a comment
Still grappling with the challenges associated with moving to multicore architectures, software developers continue to struggle with basic questions, including not only how best to move to multicore but also whether or not it makes sense to do so for a given application.
Ceva launches programmable HD video processor
News & Analysis  
2/12/2010   Post a comment
DSP core licensor Ceva Inc. is due to unveil a software-programmable multimedia video processor architecture at the Mobile World Congress in Barcelona next week.
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