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Content tagged with Semiconductors posted in February 2010
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Long range Bluetooth module offers 1000 meter range
Product News  
2/12/2010   Post a comment
2001 Electronic Components has made available a long range Bluetooth module, designated, WT41.
NEC to show quad-core Cortex-A9 processor
News & Analysis  
2/12/2010   Post a comment
NEC Electronics Corp. looks set to grab the lead in terms of high performance ARM processors at the Mobile World Congress in Barcelona next week with a quad-core Cortex-A9 design. The technology is due to showcased on the booth of ARM Holdings plc (Cambridge, England), the originator of the Cortex-A9 multiprocessing core.
Berkeley discusses progress in parallel programming
News & Analysis  
2/12/2010   6 comments
Researchers from the University of California at Berkeley gave an update on their work to find new programming models for tomorrow's many-core processors and announced two new research centers—one focused on low-power circuits and another on cloud computing.
IBM joins EU R&D project to slash chip design time
News & Analysis  
2/11/2010   Post a comment
IBM Research Lab in Haifa, Israel, announced it has joined the European research project DIAMOND (Diagnosis, Error Modeling and Correction for Reliable Systems Design) to provide integrated diagnosis and correction for spec, design and soft errors.
Infineon emphasizes power, China in 'new start'
News & Analysis  
2/11/2010   1 comment
Infineon Technologies AG (Munich, Germany) is set to drive itself forward by focusing on power semiconductors and the Chinese market, according to the text of speech given to shareholders by CEO Peter Bauer.
Wolfson unveils world's first digital audio hub solution for mobile phones
Product News  
2/11/2010   Post a comment
Wolfson Microelectronics is claiming the world's first digital audio hub solution for mobile phones.
Bosch launches fab for automotive semiconductors
News & Analysis  
2/11/2010   2 comments
Automotive supplier Robert Bosch GmbH (Gerlingen, Germany) currently is adding the finishing touches to its 200mm wafer fab in near-by Reutlingen.
UMC sees January sales drop 9% sequentially
News & Analysis  
2/11/2010   Post a comment
United Microelectronics Corp., the world's second largest foundry, had January sales of NT$8,600 million (about $268 million), a decrease of 9.25 percent from the December 2009 sales figure of NT$9,292 million (about $290 million).
Apple gets hefty margin on iPad cost
News & Analysis  
2/11/2010   2 comments
Apple Inc.'s total costs for the iPad consumer electronics device is less than 50 percent of the proposed retail price, according to iSuppli Corp., giving the OEM ample flexibility on pricing if demand trails expectations when the product debuts in the next few months.
Audio amplifier pair brings high-quality sound to the masses
Product News  
2/10/2010   Post a comment
Wolfson Microelectronics is offering two cost-effective audio amplifiers that provide high quality audio and low power consumption for optimal audio playback time due to highly efficient headphone and speaker drivers.
Tiny temp sensor boosts equipment reliability, energy savings
Product News  
2/10/2010   Post a comment
Semtech's highly integrated SX8733 temperature sensor monitors up to two temperature diodes and its own temperature, while its low-power design enables temperature monitoring of ASICs during sleep mode.
IDT launches PCIe Gen 2 system interconnect product line
Product News  
2/10/2010   1 comment
IDT (Integrated Device Technology Inc.) has started to sample a line of PCI Express (PCIe) Gen2 system interconnect switching products, featuring an advanced switch architecture to support multi-domain data and control plane connectivity for multi-root communications and embedded applications.
Intel, Renesas, Toshiba show mobile media chips
News & Analysis  
2/10/2010   1 comment
Toshiba described Wednesday (Feb 10) a novel mobile media processor it is now sampling using stacked custom DRAM, one of a handful of such devices discussed at the International Solid State Circuits Conference.
Digital audio playback IC delivers up to 30 s
Product News  
2/10/2010   Post a comment
Using flash memory to provide non-volatile audio playback of up to 30 seconds, the ChipCorder ISD2100 family of single-chip audio-grade ICs offers up to 32-kHz sampling and can operate without a microcontroller.
S3 Group and Texas Instruments claim first Continua certified platform for telehealth devices
News & Analysis  
2/10/2010   Post a comment
Texas Instruments Incorporated (TI) and S3 Group, a connected healthcare technology solutions company, have developed the first Continua Certified USB-enabled platform for building agent healthcare devices.
Toshiba mulls $8.9 billion NAND flash fab
News & Analysis  
2/10/2010   Post a comment
Toshiba is planning to build an 800 billion yen (about $8.9 billion) wafer fab to increase its manufacturing capacity in NAND flash memories, according to a number of reports that cited the Nikkei business daily as their source.
Ozmo hires veteran as CEO
News & Analysis  
2/10/2010   Post a comment
Ozmo Devices Inc. (Palo Alto, Calif.), a provider of Wi-Fi Personal Area Network (Wi-Fi PAN) chips, has recruited Bill McLean to serve as chief executive officer.
NEC Electronics targets 3D graphics processing with the EMMA Mobile EV SoCs
Product News  
2/10/2010   Post a comment
NEC Electronics announced the EMMA Mobile EV SoCs, designed for full HD portable audio-visual devices delivering 3D graphics processing capability
Audio processor with Bluetooth connectivity from CSR
News & Analysis  
2/10/2010   Post a comment
The CSR7810 is what CSR claims to be the industry's first audio processor with Bluetooth connectivity readily integrated for handsets implementing noise cancellation.
Medtronic turns a light on brain implants
News & Analysis  
2/10/2010   Post a comment
Medtronic has developed prototype implant that uses light to alter the behaviors of nerve cells in the human brain, one of a handful of papers at the International Solid State Circuits Conference seeking more refined electronic techniques to diagnose or apply therapies to neural conditions.
Single-key capacitive touch controllers target portables
Product News  
2/9/2010   Post a comment
Atmel's new line of single-key touch controllers offers faster response time, low current consumption and low noise to enable next-generation designs.
1.7V digital potentiometers bring digital control, calibration to power-sensitive apps
Product News  
2/9/2010   Post a comment
Maxim Integrated Products' MAX5391-MAX5393 operate from an industry-low 1.7V, allowing designers to enjoy the benefits of digital potentiometers in low-voltage systems.
Chip links hit 20 Gbits/s, power lows at ISSCC
News & Analysis  
2/9/2010   Post a comment
Researchers showed advances driving wider, faster and lower power chip-to-chip interconnects in a session at the International Solid State Circuits Conference.
Low-pin-count MCUs with on-chip flash memory
News & Analysis  
2/9/2010   Post a comment
Renesas Technology Europe announced its R8C/Mx Series of low-pin-count MCUs with on-chip flash memory, offering power consumption among the lowest in the industry and improved functions including timers
Nujira launches power-saving alliance at MWC
News & Analysis  
2/9/2010   Post a comment
Mobile phone power amplifier specialist Nujira Ltd. (Cambridge, England) has announced the formation of an OpenET Alliance to develop and publish open specifications for envelope-tracking interfaces for 3G and 4G platforms.
Texas Instruments samples quad-radio chip
News & Analysis  
2/9/2010   Post a comment
Texas Instruments Inc. (Dallas, Texas) has produced a wireless connectivity chip, intended to provide extra radios beside the main cellular channel needed on a mobile phone. The WiLink 7.0 (part numbers WL1281 and WL1283) offers wireless LAN 802.11n, GPS, Bluetooth and FM transmit and receive.
Hynix, Samsung push NAND flash below 30-nm
News & Analysis  
2/9/2010   Post a comment
Competition is hotting up in NAND flash memory as South Korea's Hynix Semiconductor Inc. has claimed it has used a 26-nm manufacturing process technology to produce a device with a capacity of 64-Gbits, according to reports. And local rival Samsung has said it is aiming to have a 27-nm NAND flash memory in production in the second quarter of 2010, according to another report.
ST-Ericsson likes its odds in race to smarter smartphones
News & Analysis  
2/9/2010   Post a comment
On the eve of Mobile World Congress in Barcelona, Spain, wireless chip joint venture ST-Ericsson (Geneva) outlined the main trends in the mobile handset market for 2010 and detailed how the company aligns its business strategy with market opportunities.
Rambus unveils its Mobile XDR memory architecture for mobile products
News & Analysis  
2/9/2010   1 comment
Rambus announced its Mobile XDR memory architecture for next-generation mobile products, combining high-bandwidth and low-power
Ikanos partners with picoChip to advance the Femtocell market
News & Analysis  
2/9/2010   Post a comment
Ikanos Communications and picoChip announced a strategic relationship to advance the integration of smart mobile devices into the home network.
Single mode Bluetooth low energy module
Product News  
2/9/2010   Post a comment
The Insight SiP ISP091201 is a completely self-contained Bluetooth low energy SiP module that includes Nordic's MicroBlue nRF8001 connectivity-on-chip solution, integrating the radio, baseband and software stack plus an integrated antenna, 16MHz crystal and 15 supporting passive components.
ARM hints at graphics success with Samsung deal
News & Analysis  
2/9/2010   Post a comment
ARM Holdings plc (Cambridge, England) signed up two licenses for its Mali graphics cores in its fourth quarter bringing the total number of Mali licenses signed to 27, and giving the company enough encouragement to boast of signings that include Samsung Electronics Co. Ltd.
ISSCC: IBM back in network processor game
News & Analysis  
2/9/2010   Post a comment
Claiming it sees a new opportunity where server and networking chips converge, IBM Corp. unveiled what it hopes will be the first of a new line of wire-speed processors that essentially puts it back into the network processing business.
IBM's Power7 systems expand lead over Itanium
News & Analysis  
2/8/2010   Post a comment
IBM Corp. rolled out its first systems using its new Power7 processor, widening its lead over competitors and stealing thunder from Intel and Hewlett-Packard who announced a new Itanium processor.
ISSCC keynoter wants 100X power efficiency improvement
News & Analysis  
2/8/2010   Post a comment
Power efficiency is the single biggest challenge facing the mobile handset industry, and collaboration and co-design are needed to enable the industry to deliver a 100X improvement in power efficiency for mobile devices, according to a keynote presentation at the International Solid State Circuits Conference.
ISSCC: Intel has edge over AMD, for now
News & Analysis  
2/8/2010   5 comments
Intel Corp. has a significant, if temporary, edge over archrival Advanced Micro Devices based on news and papers emerging here Monday at the International Solid State Circuits Conference where Intel launched a 32nm six core server processor and described an existing x86/graphics chip.
Intel rolls Tukwilla, nixes fully buffered DIMMs
News & Analysis  
2/8/2010   1 comment
After two years of delays due in part to DDR3 memory, Intel Corp. has launched Tukwilla, its Itanium 9300 server processor, and re-drawn the road map for its only chip not to use an x86 core.
IMS: Electric cars propel IC demand
News & Analysis  
2/8/2010   Post a comment
A new report from IMS Research forecasts that demand for electric vehicles will grow steadily throughout the decade.
Low-power DSP core targets portable apps
Product News  
2/8/2010   Post a comment
Tensilica has developed the HiFi EP DSP, a superset of the HiFi 2 architecture optimized for simultaneous multi-channel codec support and continuously expanding audio pre- and post-processing.
Micron, Nanya announce 42-nm DRAM process
News & Analysis  
2/8/2010   Post a comment
Micron Technology Inc. and Nanya Technology Corp. have unveiled a 42-nm DRAM process technology with copper metallization that has been used to produce a 2-Gbit DDR3 memory.
Ceva, MimoOn to demonstrate LTE platform at MWC
News & Analysis  
2/8/2010   Post a comment
LTE software company MimoOn GmbH (Duisberg, Germany) and Ceva Inc. (San Jose, Calif.) have announced that a joint demonstration of an LTE user equipment PHY platform is set to take place at the Mobile World Congress in Barcelona, Spain.
Number indicted in chip-spying case rises to 18, says report
News & Analysis  
2/8/2010   Post a comment
The number of people facing charges related to the passing of process technology secrets from Samsung Electronics Co. Ltd. to Hynix Semiconductor Inc. has risen to 18 according to a Sapa-AP report.
ST opens Taiwan office
News & Analysis  
2/8/2010   Post a comment
After a 25-year presence in Taiwan, European chipmaker STMicroelectronics NV announced it has opened an office at the Neihu Science Park in Taipei.
An analyst's 10 reasons to be cheerful
News & Analysis  
2/8/2010   Post a comment
Bill McClean, analyst with IC Insights Inc. (Scottsdale, Ariz.) has provided ten reasons that support the idea that 2010 could be between a good and a great year for the semiconductor industry.
Europe betting on payout from Intel Labs' gambit
News & Analysis  
2/8/2010   Post a comment
There is no doubt that the formation of Intel Labs Europe early in 2009 was a strategic initiative.
Engineers explore life beyond 10 Gbit links
News & Analysis  
2/8/2010   1 comment
Electronics engineers are bumping up against the limits of their tools and techniques—and perhaps even physics--to keep pace with the rapidly expanding needs of an Internet-driven society as they coalesce around a move to 25 Gbit/second chips and ponder what comes next.
Metering chips feature isolated sensing technology
Product News  
2/7/2010   Post a comment
Teridian Semiconductor has begun sampling its fourth generation residential smart metering integrated circuits (ICs) that eliminate costly current transformers and associated copper wiring in 2-element residential meters, with up to class 0.2-accuracy.
Power amplifier linearization SoC enables highly efficient broadband 3G and 4G networks
Product News  
2/5/2010   Post a comment
Scintera Networkshas made available its SC1887 adaptive RF power amplifier linearizer (RFPAL) system-on-chip (SoC).
Image processing SoC from NEC supports high-end camera functionality
Product News  
2/5/2010   Post a comment
NEC Electronics announced the camera engine 151 (CE151) SoC, an image processing device for camera phones that will provide clear and high-quality images comparable to that of digital-still cameras
CSEM offers transceiver-with-DSP for wireless networks
Product News  
2/4/2010   Post a comment
Centre Suisse d'Electronique et de Microtechnique (Neuchatel, Switzerland) has produced a one-volt RF transceiver with an integrated DSP tailored for portable wireless communications in such things as wireless sensor networks and body area networks.
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