NEC to show quad-core Cortex-A9 processor News & Analysis 2/12/2010 Post a comment NEC Electronics Corp. looks set to grab the lead in terms of high performance ARM processors at the Mobile World Congress in Barcelona next week with a quad-core Cortex-A9 design. The technology is due to showcased on the booth of ARM Holdings plc (Cambridge, England), the originator of the Cortex-A9 multiprocessing core.
Berkeley discusses progress in parallel programming News & Analysis 2/12/2010 6 comments Researchers from the University of California at Berkeley gave an update on their work to find new programming models for tomorrow's many-core processors and announced two new research centers—one focused on low-power circuits and another on cloud computing.
IBM joins EU R&D project to slash chip design time News & Analysis 2/11/2010 Post a comment IBM Research Lab in Haifa, Israel, announced it has joined the European research project DIAMOND (Diagnosis, Error Modeling and Correction for Reliable Systems Design) to provide integrated diagnosis and correction for spec, design and soft errors.
Infineon emphasizes power, China in 'new start' News & Analysis 2/11/2010 1 comment Infineon Technologies AG (Munich, Germany) is set to drive itself forward by focusing on power semiconductors and the Chinese market, according to the text of speech given to shareholders by CEO Peter Bauer.
UMC sees January sales drop 9% sequentially News & Analysis 2/11/2010 Post a comment United Microelectronics Corp., the world's second largest foundry, had January sales of NT$8,600 million (about $268 million), a decrease of 9.25 percent from the December 2009 sales figure of NT$9,292 million (about $290 million).
Apple gets hefty margin on iPad cost News & Analysis 2/11/2010 2 comments Apple Inc.'s total costs for the iPad consumer electronics device is less than 50 percent of the proposed retail price, according to iSuppli Corp., giving the OEM ample flexibility on pricing if demand trails expectations when the product debuts in the next few months.
IDT launches PCIe Gen 2 system interconnect product line Product News 2/10/2010 1 comment IDT (Integrated Device Technology Inc.) has started to sample a line of PCI Express (PCIe) Gen2 system interconnect switching products, featuring an advanced switch architecture to support multi-domain data and control plane connectivity for multi-root communications and embedded applications.
Intel, Renesas, Toshiba show mobile media chips News & Analysis 2/10/2010 1 comment Toshiba described Wednesday (Feb 10) a novel mobile media processor it is now sampling using stacked custom DRAM, one of a handful of such devices discussed at the International Solid State Circuits Conference.
Digital audio playback IC delivers up to 30 s Product News 2/10/2010 Post a comment Using flash memory to provide non-volatile audio playback of up to 30 seconds, the ChipCorder ISD2100 family of single-chip audio-grade ICs offers up to 32-kHz sampling and can operate without a microcontroller.
Toshiba mulls $8.9 billion NAND flash fab News & Analysis 2/10/2010 Post a comment Toshiba is planning to build an 800 billion yen (about $8.9 billion) wafer fab to increase its manufacturing capacity in NAND flash memories, according to a number of reports that cited the Nikkei business daily as their source.
Ozmo hires veteran as CEO News & Analysis 2/10/2010 Post a comment Ozmo Devices Inc. (Palo Alto, Calif.), a provider of Wi-Fi Personal Area Network (Wi-Fi PAN) chips, has recruited Bill McLean to serve as chief executive officer.
Medtronic turns a light on brain implants News & Analysis 2/10/2010 Post a comment Medtronic has developed prototype implant that uses light to alter the behaviors of nerve cells in the human brain, one of a handful of papers at the International Solid State Circuits Conference seeking more refined electronic techniques to diagnose or apply therapies to neural conditions.
Nujira launches power-saving alliance at MWC News & Analysis 2/9/2010 Post a comment Mobile phone power amplifier specialist Nujira Ltd. (Cambridge, England) has announced the formation of an OpenET Alliance to develop and publish open specifications for envelope-tracking interfaces for 3G and 4G platforms.
Texas Instruments samples quad-radio chip News & Analysis 2/9/2010 Post a comment Texas Instruments Inc. (Dallas, Texas) has produced a wireless connectivity chip, intended to provide extra radios beside the main cellular channel needed on a mobile phone. The WiLink 7.0 (part numbers WL1281 and WL1283) offers wireless LAN 802.11n, GPS, Bluetooth and FM transmit and receive.
Hynix, Samsung push NAND flash below 30-nm News & Analysis 2/9/2010 Post a comment Competition is hotting up in NAND flash memory as South Korea's Hynix Semiconductor Inc. has claimed it has used a 26-nm manufacturing process technology to produce a device with a capacity of 64-Gbits, according to reports. And local rival Samsung has said it is aiming to have a 27-nm NAND flash memory in production in the second quarter of 2010, according to another report.
Single mode Bluetooth low energy module Product News 2/9/2010 Post a comment The Insight SiP ISP091201 is a completely self-contained Bluetooth low energy SiP module that includes Nordic's MicroBlue nRF8001 connectivity-on-chip solution, integrating the radio, baseband and software stack plus an integrated antenna, 16MHz crystal and 15 supporting passive components.
ARM hints at graphics success with Samsung deal News & Analysis 2/9/2010 Post a comment ARM Holdings plc (Cambridge, England) signed up two licenses for its Mali graphics cores in its fourth quarter bringing the total number of Mali licenses signed to 27, and giving the company enough encouragement to boast of signings that include Samsung Electronics Co. Ltd.
ISSCC: IBM back in network processor game News & Analysis 2/9/2010 Post a comment Claiming it sees a new opportunity where server and networking chips converge, IBM Corp. unveiled what it hopes will be the first of a new line of wire-speed processors that essentially puts it back into the network processing business.
ISSCC keynoter wants 100X power efficiency improvement News & Analysis 2/8/2010 Post a comment Power efficiency is the single biggest challenge facing the mobile handset industry, and collaboration and co-design are needed to enable the industry to deliver a 100X improvement in power efficiency for mobile devices, according to a keynote presentation at the International Solid State Circuits Conference.
ISSCC: Intel has edge over AMD, for now News & Analysis 2/8/2010 5 comments Intel Corp. has a significant, if temporary, edge over archrival Advanced Micro Devices based on news and papers emerging here Monday at the International Solid State Circuits Conference where Intel launched a 32nm six core server processor and described an existing x86/graphics chip.
Low-power DSP core targets portable apps Product News 2/8/2010 Post a comment Tensilica has developed the HiFi EP DSP, a superset of the HiFi 2 architecture optimized for simultaneous multi-channel codec support and continuously expanding audio pre- and post-processing.
Ceva, MimoOn to demonstrate LTE platform at MWC News & Analysis 2/8/2010 Post a comment LTE software company MimoOn GmbH (Duisberg, Germany) and Ceva Inc. (San Jose, Calif.) have announced that a joint demonstration of an LTE user equipment PHY platform is set to take place at the Mobile World Congress in Barcelona, Spain.
ST opens Taiwan office News & Analysis 2/8/2010 Post a comment After a 25-year presence in Taiwan, European chipmaker STMicroelectronics NV announced it has opened an office at the Neihu Science Park in Taipei.
An analyst's 10 reasons to be cheerful News & Analysis 2/8/2010 Post a comment Bill McClean, analyst with IC Insights Inc. (Scottsdale, Ariz.) has provided ten reasons that support the idea that 2010 could be between a good and a great year for the semiconductor industry.
Engineers explore life beyond 10 Gbit links News & Analysis 2/8/2010 1 comment Electronics engineers are bumping up against the limits of their tools and techniques—and perhaps even physics--to keep pace with the rapidly expanding needs of an Internet-driven society as they coalesce around a move to 25 Gbit/second chips and ponder what comes next.
Metering chips feature isolated sensing technology Product News 2/7/2010 Post a comment Teridian Semiconductor has begun sampling its fourth generation residential smart metering integrated circuits (ICs) that eliminate costly current transformers and associated copper wiring in 2-element residential meters, with up to class 0.2-accuracy.
CSEM offers transceiver-with-DSP for wireless networks Product News 2/4/2010 Post a comment Centre Suisse d'Electronique et de Microtechnique (Neuchatel, Switzerland) has produced a one-volt RF transceiver with an integrated DSP tailored for portable wireless communications in such things as wireless sensor networks and body area networks.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Are the design challenges the same as with embedded systems, but with a little developer- and IT-skills added in? What do engineers need to know? Rick Merritt talks with two experts about the tools and best options for designing IoT devices in 2016. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.