Design team execs left Apple to form startup News & Analysis 2/4/2010 1 comment Amid the excitement over the A4 microprocessor designed in-house at Apple Inc. and used to power the iPad, it has emerged that a number of the internal design team have already left to form a startup.
Broadcom acquires Teknovus for $123 million Product News 2/3/2010 Post a comment Broadcom Corp. made it official Wednesday (Feb 3) it is spending $123 million to acquire startup Teknovus Inc. (Petaluma, Calif.) for its Ethernet passive optical networking technology chipsets and software.
Analysis: Microchip benefits from SST M&A blunder News & Analysis 2/3/2010 1 comment Silicon Storage Technology Inc. is being snapped up at a bargain price by Microchip Technology Inc., which will buy the company partly with the storage IC vendor's cash, gain many valuable patents, critical technology applications and a steady stream of licensing payments after stockholders rejected a prior offer that significantly undervalued the company.
Microchip to pay $273M for SST News & Analysis 2/3/2010 1 comment Microchip Technology Inc. said it has struck an agreement to pay approximately $273 million for Silicon Storage Technology Inc., which has also terminated a previous merger deal with a private equity investment group.
ARM, Giesecke & Devrient team to secure phone payments News & Analysis 2/3/2010 Post a comment Processor intellectual property licensor ARM Holdings plc (Cambridge, England) is collaborating with Giesecke & Devrient (Munich, Germany) and the two companies are going to demonstrate the combination of the Mobicore operating system running with ARM TrustZone hardware at the Mobile World Congress, in Barcelona.
Smallest Class-D audio amplifier reduces codec noise Product News 2/2/2010 Post a comment Texas Instruments Incorporated (TI) has introduced a 3.2-W, mono Class-D audio amp with an integrated digital-to-analog converter (DAC) noise filter that reduces codec noise by as much as 82 percent, compared to devices without this feature.
ARM lays out roadmap with three more cores Product News 2/2/2010 Post a comment ARM Holdings plans to launch three processor cores during 2010. The cores, codenamed Eagle, Heron and Merlin, all have lead licensing customers and deliveries of intellectual property will start either in 2010 or early in 2011 depending on the core, said ARM CEO Warren East.
MoSys tips memory chips in new silicon drive News & Analysis 2/2/2010 Post a comment MoSys Inc. said it will make memory chips using a novel high-speed interface for a broad range of networking and storage markets as the first of a planned family of standard parts for the company that is expanding beyond its roots as a supplier of silicon cores.
Dash7 sensor network alliance rolls working groups News & Analysis 2/2/2010 Post a comment The Dash7 Alliance, a coalition of organizations promoting a standard for wireless sensor networks based on the ISO18000-7 standard, has announced it now has more than 40 participating organizations, including leaders from the semiconductor, supply chain and RFID industries.
Samsung, Toshiba retain lead in Q4 NAND ranking News & Analysis 2/1/2010 Post a comment The six companies fighting for NAND flash memory market share retained their positions in the fourth quarter of 2009. Samsung and Toshiba led with market shares of 38.6 percent and 3.7 percent respectively, according market research company DRAMexchange.
Full-year chip sales fell 9% in 2009, says SIA News & Analysis 2/1/2010 1 comment Global semiconductor sales were $226.3 billion in 2009, a decline of 9 percent from 2008 when sales were $248.6 billion, according to the Semiconductor Industry Association (SIA). The full-year decline was as had been expected in the last month but much less than had been predicted in the first months of 2009.
Rumor mill: B'com, Cavium eye Teknovus acquisition News & Analysis 2/1/2010 1 comment Chatter in the rumor mill says Broadcom Corp. or Cavium Networks may be about to acquire startup Teknovus Inc. for its passive optical networking technology, just as Marvell is expected to roll out its first PON products this week.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.