SPIE: EUV sources behind schedule News & Analysis 2/28/2011 4 comments Extreme ultraviolet (EUV) lithography is making progress, but the power source for the technology is behind schedule, warned keynote speakers at the SPIE Advanced Lithography conference here.
CUDA 4.0 aims to ease parallel programming News & Analysis 2/28/2011 Post a comment Version 4.0 of Nvidia's CUDA toolkit for developing parallel applications using the company's graphics processors includes new features designed to make parallel programming easier and enable more developers to port their applications to graphics processor units.
Synopsys says IP supports PCIe 3.0 News & Analysis 2/28/2011 Post a comment EDA and IP vendor Synopsys its DesignWare IP supports the final version of the PCI Express 3.0 base specification recently released by the PCI Special Interest Group.
ISS: ST's Bozotti cheers for European chips News & Analysis 2/28/2011 10 comments Carlo Bozotti, president and chief executive officer of STMicroelectronics, provided a keynote address to the Industry Strategy Symposium (ISS Europe) held here by industry body SEMI, which contained a commitment to European chip making – but only just.
Startup rolls complementary litho News & Analysis 2/28/2011 6 comments At the SPIE Advanced Lithography conference here, maskless startup Multibeam Corp. will outline more details about its ongoing efforts to commercialize its so-called Complementary E-Beam Lithography (CEBL) technology in the market.
Nvidia, Atmel, STMicro found in Motorola Xoom News & Analysis 2/26/2011 19 comments In addition to a dual-core Tegra 2 applications processor from Nvidia, Motorola Mobility's Xoom media tablet includes a four-chip touch screen controller solution from Atmel and MEMS sensors from AKM Semiconductor, Kionx, STMicroelectronics and Bosch Sensortec, according to IHS iSuppli.
Change shuffles PCB EDA vendor rankings News & Analysis 2/25/2011 8 comments Zuken vaulted to the No. 2 position in sales among providers of printed circuit board EDA tools as the result of a clarification of the firm's revenues, according to Gary Smith EDA.
IR to buy CHiL for $75 million News & Analysis 2/25/2011 Post a comment International Rectifier Corp. has agreed to acquire CHiL Semiconductor Corp. (CHiL) for $75 million in cash, subject to working capital adjustments.
On Semi to expand Oregon fab News & Analysis 2/24/2011 8 comments On Semiconductor Corp. plans to invest more than $30 million to expand capacity and capabilities at its 8-inch wafer manufacturing facility in Gresham, Oregon.
Mentor beats estimates, eyes $1 billion mark News & Analysis 2/24/2011 5 comments EDA vendors Mentor Graphics and Magma Design Automation reported quarterly results that beat consensus analysts' expectations, with Mentor posting record annual revenue and saying it expects to become a $1 billion company in the current fiscal year.
Applied beats Street News & Analysis 2/24/2011 Post a comment Applied Materials Inc. reported sales of $2.69 billion for the first quarter, compared to $2.89 billion in the previous quarter and $1.85 billion a year ago.
CEA-Leti, spinoff form maskless lab News & Analysis 2/24/2011 Post a comment CEA-Leti and a spinoff, Aselta Nanographics, are creating a joint lab to develop e-beam proximity effects correction solutions for both mask writing and maskless lithography applications.
Firm: Kick out Zoran's board News & Analysis 2/24/2011 4 comments Hedge fund Ramius LLC has recommended that shareholders of Zoran Corp. consent on Ramius' proxy move to remove three incumbent directors and elect Ramius nominees to the Zoran board.
Entegris, IBM form partnership News & Analysis 2/24/2011 Post a comment Entegris Inc. has announced a joint development agreement with IBM to develop and test new filtration techniques for use in advanced semiconductor manufacturing.
JEDEC announces standard for flash storage News & Analysis 2/24/2011 3 comments JEDEC Solid State Technology Association, formerly known as the Joint Electron Devices Engineering Council, has published a standard on the use of flash memory for solid-state storage in mobile devices such as smart phones and tablet computers.
PC processor market to grow 10% in 2011, says IDC News & Analysis 2/24/2011 Post a comment Worldwide PC microprocessor shipments fell in the fourth quarter, down 4 percent sequentially and down 21 percent compared with 4Q09, according to market research firm International Data Corp. For the full year 2010, however, worldwide PC microprocessor unit shipments grew 17.1 percent, while revenue increased 26.7 percent to $36.3 billion, the firm said.
Consortium claims SiGe frequency record News & Analysis 2/24/2011 1 comment The European Union's DotFive project has produced a silicon germanium chip set that it claims has the world's highest frequency of operation in the history silicon germanium.
U.S. back on top in IPOs News & Analysis 2/24/2011 1 comment After a surge in IPOs by companies in the Asia-Pacific in 2010, the U.S. has regained the lead in IPOs so far in 2011 with 24 already executed, according to financial research and services provider Renaissance Capital.
Ramtron hurt by IBM foundry delays News & Analysis 2/24/2011 6 comments Amid problems with its foundry ramp with IBM Corp., Ramtron International Corp., a supplier of nonvolatile ferroelectric random access memory (FRAM), reported total revenue of $16.1 million for the fourth quarter of 2010, compared with total revenue of $14.4 million for the same quarter last year.
IMEC, Renesas tip reconfigurable transceiver News & Analysis 2/23/2011 Post a comment At this week’s International Solid-State Circuit Conference (ISSCC) here, IMEC and Renesas Electronics Corp. presented a paper on a highly-linear reconfigurable transceiver that eliminates the need for surface acoustic wave (SAW) filters.
ChipMOS narrows focus News & Analysis 2/23/2011 Post a comment Taiwan's ChipMOS Technologies Inc. will receive approximately $11.6 million in the sale of its idle, non-core assets, including six sets of Advantest T5377 and Advantest T5377S memory test systems, respectively, and a building located in Hsinchu Science Park, Taiwan.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.