Zoran fires back at hedge fund News & Analysis 2/23/2011 Post a comment Zoran Corp. has responded to Ramius LLC's claim that the previously announced merger with CSR plc "may undervalue Zoran," and its question as to whether the transaction "was the result of a full and fair sale process to maximize value for all Zoran shareholders."
Millimeter-scale all-in-one computers debut News & Analysis 2/23/2011 4 comments Researchers from the University of Michigan debuted what they billed as the world's first all-in-one, millimeter-sized processor at the International Solid-State Circuits Conference in San Francisco.
Tough years seen ahead for NOR flash News & Analysis 2/23/2011 3 comments After a booming 2010, NOR flash memory revenue is expected to decline by nearly 6 percent to $4.8 billion in 2011, signaling the beginning of difficult years ahead marked by declining prices, according to IHS iSuppli.
SEMI book-to-bill slips News & Analysis 2/22/2011 Post a comment North America-based manufacturers of semiconductor equipment posted a book-to-bill ratio of 0.85 in January, down from 0.90 in December, according to SEMI.
Firms push to extend mobile DRAM spec News & Analysis 2/22/2011 Post a comment There is a proposed standard to extend mobile DRAM technology to higher speeds-a move that could push out competing next-generation efforts from MIPI, Rambus, Silicon Image and the 3-D chip community.
Western Digital grabs disk drive lead News & Analysis 2/22/2011 5 comments The hard disk drive market recorded growth of 17.1 percent in unit shipments to reach 653.5 million units in 2010, according to The Information Network. Western Digital Corp. took from long-time market leader Seagate Technology plc.
Hedge fund says CSR deal undervalues Zoran News & Analysis 2/22/2011 Post a comment The subsidiary of activist hedge fund Ramius that has been pushing its own slate of directors to take over the board of Zoran expressed concern that a $679 million stock deal for Zoran to merge with CSR may undervalue Zoran.
Report: TSMC wins key 40-, 28-nm deals News & Analysis 2/22/2011 10 comments Taiwan Semiconductor Manufacturing Co. Ltd. (TSMC) is fighting back against rival Globalfoundries Inc. and winning key contracts from Advanced Micro Devices (AMD) for its 40-nm and 28-nm manufacturing process technologies, according to a Taiwan Economic News report.
Panel debates keeping up with 'Gene's Law' News & Analysis 2/22/2011 8 comments After two decades of dramatic improvement in the energy efficiency of circuits, the semiconductor industry will need to explore new circuit structures, architectures, materials and other items to continue to keep pace, according to a panel of experts at ISSCC.
Samsung CEO: Four challenges seen for ICs News & Analysis 2/22/2011 5 comments At the 2011 International Solid-State Circuits Conference (ISSCC) here, Oh-Hyun Kwon, president of Samsung Electronics Co. Ltd.’s semiconductor business, outlined four challenges for next-generation IC design and scaling.
Researcher describes 'smart' orthodontics News & Analysis 2/21/2011 2 comments A team of German researchers is developing "intelligent" orthodontic brackets with integrated stress sensors to enable orthodontists to measure the forces being exerted on individual teeth.
Samsung CEO: Headwinds hinder PRAM News & Analysis 2/21/2011 11 comments At the 2011 International Solid-State Circuits Conference (ISSCC) here, Samsung Electronics Co. Ltd. will describe more details about its 1-Gbit, 58-nm phase-change memory (PRAM) technology.
Samsung CEO: Green fab tools wanted News & Analysis 2/21/2011 Post a comment At the 2011 International Solid-State Circuits Conference (ISSCC) here, Oh-Hyun Kwon, president of Samsung Electronics Co. Ltd.’s semiconductor business, urged fab tool vendors to take more steps to reduce energy consumption.
Samsung takes DRAM 512-pins wide News & Analysis 2/21/2011 7 comments Samsung Electronics Co. Ltd. has announced the development of a 1-Gbit DRAM with a 512-pin wide I/O interface intended for mobile applications such as smart phones and tablet computers.
Study: foundries provide more IP than IP vendors News & Analysis 2/21/2011 7 comments Chip foundries provide more design intellectual property (IP) to fabless chip companies than the IP core licensors whose principal business it is, according to the 2010 fabless ecosystem survey conducted by a university professor for the Global Semiconductor Alliance.
Update: MIT, TI tip 28-nm app processor News & Analysis 2/21/2011 5 comments At the 2011 International Solid-State Circuits Conference (ISSCC) here, Texas Instruments Inc. and the Massachusetts Institute of Technology (MIT) will outline what could be a major breakthrough in the gap between performance demands and battery capacity in the mobile space.
ISSCC: Toshiba rolls flip-flop News & Analysis 2/20/2011 2 comments Toshiba Corp. has developed a new flip-flop circuit using 40-nm CMOS process that will reduce power consumption in mobile equipment.
2011 GSMA Mobile Innovation Award News & Analysis 2/20/2011 Post a comment EDMI and Sierra Wireless are pleased to announce that the two companies were awarded the GSMA Global Mobile Award for Best Mobile Innovation for Utilities at the 2011 Mobile World Congress in Barcelona.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.