Renesas MCUs integrate capacitive touch sensor Product News 2/7/2011 1 comment The R8C/3NT group of microcontrollers from Renesas Electronics integrate on a single chip a capacitive touch sensor circuit and a flash MCU making them suitable for products such as smartphones, mobile phones, e-book readers, digital cameras, and handheld game consoles.
Nanolasers grown on silicon News & Analysis 2/6/2011 8 comments University of California at Berkeley researchers say they have developed a method for growing indium gallium arsenide nano-lasers directly on silicon substrates, potentially paving the way for chips with integrated optical photonics.
Intel developing IT security game-changer is premature News & Analysis 2/5/2011 1 comment Security lifecycle specialist Tufin Technologies says that reports of Intel developing an `IT security game-changer' that will reportedly stop zero-day security attacks should be tempered with the reality that many company PCs in use today will still be in active use in five years' time.
Inside enables bio-metrics for NFC News & Analysis 2/4/2011 9 comments Inside Secure SA, a supplier of contactless smartcard chips, has announced the availability of biometric matching capabilities for its SecuRead NFC component.
Cadence beats estimates, sees growth ahead News & Analysis 2/2/2011 3 comments EDA vendor Cadence Design Systems reported sales for the fourth quarter of 2010 that beat analyst expectations, despite posting a net loss on accounting charges, and the company issued an outlook calling for further growth.
Gallium nitride boosted into high-power realm News & Analysis 2/2/2011 7 comments By implanting a neutral species (argon) alongside the termination contacts for gallium nitride diodes, their power handling capabilities can boosted from 300 to 1,650 volts, according to researchers.
Cadence exec: EDA must create 'breakaway value' News & Analysis 2/2/2011 5 comments As if EDA companies don't have enough on their plates John Bruggeman, chief marketing officer with Cadence Design Systems, reckons they should be asking chip companies what more they can do to help them be profitable.
Bilayer gate solves plastic transistor woes News & Analysis 2/1/2011 6 comments Georgia Institute of Technology researchers say they have developed a method for stacking two gate dielectric materials that cancel out the drawbacks of each, resulting in relatively fast, stable plastic transistors with high current carrying capabilities.
New material for semis said to beat silicon News & Analysis 2/1/2011 18 comments A new semiconductor material called molybdenite is claimed to be 100,000 times lower power than silicon, plus will allow the fabrication of much smaller transistors, according to researchers at Switzerland's Ecole Polytechnique Federale de Lausanne.
Toumaz offers radio to beat Bluetooth, ZigBee Product News 2/1/2011 12 comments Toumaz Ltd., a company that applied low-power transistor design techniques to circuits mainly for medical applications, has launched the TZ1053 Telran transceiver and claims it offers considerably lower power consumption than Bluetooth Low Power and ZigBee.
As data rates begin to move beyond 25 Gbps channels, new problems arise. Getting to 50 Gbps channels might not be possible with the traditional NRZ (2-level) signaling. PAM4 lets data rates double with only a small increase in channel bandwidth by sending two bits per symbol. But, it brings new measurement and analysis problems. Signal integrity sage Ransom Stephens will explain how PAM4 differs from NRZ and what to expect in design, measurement, and signal analysis.
January 2016 Cartoon Caption ContestBob's punishment for missing his deadline was to be tied to his chair tantalizingly close to a disconnected cable, with one hand superglued to his desk and another to his chin, while the pages from his wall calendar were slowly torn away.122 comments