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Content tagged with Semiconductors posted in February 2012
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Digital Core Design launches world’s fastest 80C51 CPU
Product News  
2/21/2012   4 comments
Digital Core Design has introduced what the company claims to be the world’s most advanced 80C51 architecture.
Tensilica offers BBE32UE core for low-power LTE
Product News  
2/21/2012   2 comments
Tensilica Corp. (Santa Clara, Calif.) has produced another core in its ConnX series, the BBE32UE, which is optimized for software programmable LTE-Advanced user equipment.
Tabula’s next-gen FPGAs to use Intel’s 22nm process featuring 3-D tri-gate transistors
News & Analysis  
2/21/2012   1 comment
At the Ethernet Technology Summit, Tabula’s VP of Manufacturing Technology will discuss the boundaries that traditional FPGA fabrics face as they try to keep pace with exploding bandwidth demands.
New Ceva DSP powers LTE and Wi-Fi 802.11ac reference architectures
Product News  
2/21/2012   Post a comment
Ceva introduces a new DSP platform and incorporates it into two reference platforms to demonstrate its capabilities…
How best to reduce power on future ICs
News & Analysis  
2/21/2012   19 comments
Excessive power consumption has become the chief roadblock to further scaling of semiconductors, threatening to stall advancement in all electronics sectors—everything from further miniaturizing mobile devices to revving supercomputers.
Xilinx plan to strut their stuff at Embedded World 2012
News & Analysis  
2/21/2012   Post a comment
The latest technologies and expanding ecosystem will help developers create sharper new products in shorter timeframes, leveraging programmable systems integration
AMD first to count on Cyclos low-power clock IP
News & Analysis  
2/21/2012   11 comments
Advanced Micro Devices Inc. has achieved the first commercial implementation of resonant clock mesh technology licensed from startup company Cyclos Semiconductor Inc.
January chip sales fell 15% year-on-year, says analyst
News & Analysis  
2/21/2012   1 comment
A number of factors are likely to have contributed to soft January chip sales according to Bruce Diesen, an analyst at Carnegie Group (Oslo, Norway).
Thermal Diffusivity Sensors: Temperature Sensors that Scale
News & Analysis  
2/21/2012   Post a comment
Thermal diffusivity based sensors are the future according to professor Kofi Makinwa of Delft University of Technology, speaking at the ISSCC on Monday.
Maxim’s processors boast new noise reduction and echo cancellation capabilities
Product News  
2/20/2012   Post a comment
Acoustic Technologies' noise reduction and echo cancellation software is now available on Maxim's MAX98095 based on Tensilica's HiFi audio/voice DSPs
MediaTek launches new MT6575 Android platform
Product News  
2/20/2012   Post a comment
New MT6575 Android platform from MediaTek addresses the growing market for entry to mid-level smartphones.
Job ad discloses SanDisk resistive RAM program
News & Analysis  
2/20/2012   16 comments
Flash memory vendor SanDisk is looking for a director of processing engineering management for a 3-D resistive RAM team based in Milpitas. A job ad for the position was posted in SanDisk's website dated Feb. 15, 2012.
Huawei places $6-billion chip order with U.S.
News & Analysis  
2/20/2012   16 comments
Avago, Broadcom and Qualcomm have been awarded three-year chip deals by Huawei Technologies Co. Ltd. worth $6 billion.
Carlo Ferro of ST appointed COO at ST-Ericsson
News & Analysis  
2/20/2012   Post a comment
Carlo Ferro, chief financial officer at European chip company STMicroelectronics NV, has been assigned chief operating officer at troubled subsidiary ST-Ericsson. The move is intended to support efforts to turn the loss making ST-Ericsson around.
Samsung chip lowers cost of LTE, says analyst
News & Analysis  
2/18/2012   4 comments
A disassembly of the Samsung Galaxy Nexus i515 mobile phone conducted by ABI Research recently has revealed an LTE baseband chip that is estimated to be half the cost of a previous version, the market research firm said.
Test problems grow as chip integration increases
News & Analysis  
2/18/2012   6 comments
As the level of chip and component integration increases, so too does the problem testing the ever more intricate products, with engineers struggling to keep up.
Engineers propose nanogrids, smarter switches
News & Analysis  
2/17/2012   9 comments
One engineer called for distributed nanogrids as an alternative to a central electric utility and another proposed more power efficient switches at a meeting of the Ethernet Alliance.
ZiiLabs samples 100-core, HEVC-ready Android SoC
Product News  
2/17/2012   3 comments
ZiiLabs, a fabless chip subsidiary of multimedia hardware company Creative Technology Ltd. (Singapore), has begun sampling its ZMS-40 media processor optimized for Android platforms.
Analyst dissects Intel Haswell's transactional memory
News & Analysis  
2/17/2012   7 comments
Pushing forward into a new area for computer architecture, Intel is adopting transactional memory in its upcoming Haswell processors, taking the technology from academia into the mainstream, nearly two decades on.
Applied sees strong capital spending by foundries
News & Analysis  
2/17/2012   Post a comment
Chip equipment vendor Applied Materials reported quarterly results that exceeded analysts' expectations and said it continues to see strong capital investment from chip makers, led by foundries, that it expects to lift its sales in the current quarter.
Renesas V850E2/Fx4-L microcontroller series
Product News  
2/16/2012   2 comments
Renesas has developed a series of 32-bit microcontrollers aimed at automotive applications.
Maxim Integrated Products Inc. MAX14578E/MAX14578AE USB battery charger detectors
Product News  
2/16/2012   Post a comment
Maxim Integrated Products' port-detection devices comply with the USB Battery Charging Specification and work with proprietary power adapters.
Black Sand raises $10-million Series C
News & Analysis  
2/16/2012   Post a comment
Fabless chip company Black Sand Technologies Inc., which sells CMOS power amplifiers for 3G communications, has announced it has raised $10 million in a series C round of funding.
Cymer reports major progress on EUV power source
News & Analysis  
2/16/2012   5 comments
Cymer was set to reveal significant improvements in EUV source power, availability and dose control.
Tower turns in record sales, growth in 2011
News & Analysis  
2/16/2012   1 comment
For the full year of 2011 specialist foundry Tower Semiconductor Ltd. has reported record revenues of $611 million, up 20 percent over revenues of 2010 and well ahead of the overall semiconductor industry's annual growth of 0.4 percent.
Tower bids to build wafer fab in India
News & Analysis  
2/16/2012   21 comments
Tower Semiconductor Ltd., an Israel-based foundry chipmaker that trades under the name TowerJazz, has said it has signed a binding memorandum of understanding with an unnamed Indian infrastructure company, to build and operate a 300-mm wafer fab in India.
Lattice exhibiting at Mobile World Congress (Spain) and Embedded World (Germany)
News & Analysis  
2/16/2012   Post a comment
Exhibits, displays and demonstrations of programmable devices and design solutions that reduce costs, power, and design time
Blue Pearl’s EDA tools boast SystemVerilog and FPGA enhancements
Product News  
2/16/2012   1 comment
Demos at DVCon 28-29 February 2012 at the Doubletree Hotel, San Jose, California
MEMC posts $1.5 billion Q4 loss
News & Analysis  
2/16/2012   Post a comment
Silicon wafer maker MEMC Electronic Materials reported a $1.5 billion fourth quarter net loss, dragged down by charges related to the restructuring the company announced last year.
Nvidia beats street but lowers estimates
News & Analysis  
2/16/2012   1 comment
Graphics maker Nvidia remained pessimistic in its revenue forecast on Wednesday, despite beating analyst expectations for the fourth quarter.
Maxim Integrated Products MAX31722/MAX31723 are digital thermometers and thermostats
Product News  
2/15/2012   Post a comment
Maxim's latest devices are true temperature-to-digital converters that don't require additional components.
SanDisk launches SSD memory for PCs
Product News  
2/15/2012   12 comments
SanDisk Corp. has announced the X100 solid-state drive (SSD) for use in desktop, notebook and thin laptop computers. The unit is available in capacities up to 512-Gbyte and comes with a 6-Gbyte per second SATA interface and it comes in a 2.5-inches form-factor but at only 9.5-mm or 7-mm deep.
Report: Chip makers closed 49 fabs in three years
News & Analysis  
2/15/2012   3 comments
Semiconductor manufacturers closed 49 fabs between 2009 and 2011 in a paring of older capacity capable of processing 200-mm or smaller wafers, according to data from market research firm IC Insights.
MRAM startup raises $36 million VC fund
News & Analysis  
2/15/2012   3 comments
Spin Transfer Technologies Inc., a startup pursing the development of a type of magnetic random access memory, has raised $36 million in a series A funding round led by Allied Minds Inc. and Invesco Asset Management.
Qimonda admin hits Infineon with $2.25 billion demand
News & Analysis  
2/15/2012   2 comments
The insolvency administrator of Qimonda AG, the former DRAM-making subsidiary of chipmaker Infineon Technologies AG (Munich, Germany), has filed a request for payment of at least 1.71 billion euro (about $2.25 billion) in a lawsuit pending in a Munich District Court.
Darkhorse litho technologies stay in NGL race
News & Analysis  
2/15/2012   15 comments
The continually slipping target date for insertion of extreme ultraviolet lithography into volume production has enabled several other intriguing lithography technologies to hang around the next-generation lithography race, which not long ago was considered all but over.
Counterfeit parts putting military at risk
News & Analysis  
2/15/2012   18 comments
Counterfeit parts are increasingly finding their way into mission critical military and healthcare equipment, with the number of fake electronic parts soaring dramatically over the past couple of years, according to market research organization IHS iSuppli.
Firm claims patent infringement by Intel, IBM, Micron
News & Analysis  
2/15/2012   4 comments
Atomic Precision Systems, a little-known semiconductor equipment vendor specializing in deposition technology, has filed a patent infringement suit against Intel, IBM and Micron Technology claiming that they willfully infringed on an atomic layer deposition patent held by APS, according to a statement issued b the company's law firm.
Energy Conversion Devices files for bankruptcy
News & Analysis  
2/14/2012   12 comments
Solar equipment maker Energy Conversion Devices said it filed for Chapter 11 bankruptcy protection and announced plans to sale several assets, including its wholly owned subsidiary United Solar Ovonic and its minority stake in Ovonyx.
Analyst ranks chip markets by 2012 growth prediction
News & Analysis  
2/14/2012   Post a comment
With numerous changes from 2011, some 27 IC product areas out of 33 defined by WSTS will see market growth in 2012, according to market research firm IC Insights.
MediaTek launches platform for low-end Android phones
Product News  
2/14/2012   4 comments
Fabless chip company MediaTek has announced the availability of a hardware and software platform for the creation of mid- and entry-level Android smartphones.
Terasic introduces stackable Stratix IV FPGA platform
Product News  
2/14/2012   1 comment
The new TR4 platform is tailored for flexibility with its high number of available I/O pins, high speed, and low-power.
Lattice has shipped more than 20 million programmable mixed-signal devices
News & Analysis  
2/14/2012   Post a comment
Programmable mixed-signal devices lower cost and improve time-to-market
Free webinar: Implementing on-chip digital ADCs and DACs in FPGAs
News & Analysis  
2/14/2012   Post a comment
Microsemi and Stellamar are hosting a webinar to discuss the challenges of effectively integrating analog functions into digital FPGAs.
Synopsys tips 28-nm HDMI 1.4 PHY IP
News & Analysis  
2/14/2012   Post a comment
EDA and IP vendor Synopsys announced the immediate availability of DesignWare HDMI 1.4 PHY IP in advanced 28-nm processes for multiple leading foundries.
Broadcom brings 802.11ac to enterprise space
News & Analysis  
2/14/2012   1 comment
Broadcom is extending its push for 802.11ac (“5G WiFi”) into the enterprise and carrier space with the launch of its 3 x 3 BCM43460 system-on-chip, which it claims is three times faster and six times more power efficient than previous generation 802.11an devices.
U.S., E.U. regulators clear Google's Moto buy
News & Analysis  
2/13/2012   3 comments
Regulatory agencies from the U.S. and the European Union gave the thumbs up to Google's proposed $12.5 billion acquisition of Motorola Mobility.
TI announces five radio combo chip
News & Analysis  
2/13/2012   8 comments
Texas Instruments has announced the next generation of its WiLink combo chips, the WiLink 8.0 product family; a collection of 45-nanometer single-chip offerings integrating up to five radios on the same piece of silicon.
NI tips 2012 ATE trends outlook
News & Analysis  
2/13/2012   Post a comment
National Instruments released its 2012 outlook for automated test equipment, which shares findings of the company's research into the latest test and measurement technologies and methodologies.
ASML Brion rolls mask optimization software
News & Analysis  
2/13/2012   Post a comment
Lithography tool vendor ASML's Brion Technologies division announced a mask optimization software tool purports to offer seamless use of multiple optical proximity correction techniques in a single mask tapeout.
<<   <   Page 2 / 4   >   >>


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Glen Chenier
Post a comment
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Future Engineers: Don’t 'Trip Up' on Your College Road Trip
Rishabh N. Mahajani, High School Senior and Future Engineer
10 comments
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Larry Desjardin

Engineers Should Study Finance: 5 Reasons Why
Larry Desjardin
41 comments
I'm a big proponent of engineers learning financial basics. Why? Because engineers are making decisions all the time, in multiple ways. Having a good financial understanding guides these ...

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