How best to reduce power on future ICs News & Analysis 2/21/2012 19 comments Excessive power consumption has become the chief roadblock to further scaling of semiconductors, threatening to stall advancement in all electronics sectors—everything from further miniaturizing mobile devices to revving supercomputers.
Job ad discloses SanDisk resistive RAM program News & Analysis 2/20/2012 16 comments Flash memory vendor SanDisk is looking for a director of processing engineering management for a 3-D resistive RAM team based in Milpitas. A job ad for the position was posted in SanDisk's website dated Feb. 15, 2012.
Carlo Ferro of ST appointed COO at ST-Ericsson News & Analysis 2/20/2012 Post a comment Carlo Ferro, chief financial officer at European chip company STMicroelectronics NV, has been assigned chief operating officer at troubled subsidiary ST-Ericsson. The move is intended to support efforts to turn the loss making ST-Ericsson around.
Samsung chip lowers cost of LTE, says analyst News & Analysis 2/18/2012 4 comments A disassembly of the Samsung Galaxy Nexus i515 mobile phone conducted by ABI Research recently has revealed an LTE baseband chip that is estimated to be half the cost of a previous version, the market research firm said.
Applied sees strong capital spending by foundries News & Analysis 2/17/2012 Post a comment Chip equipment vendor Applied Materials reported quarterly results that exceeded analysts' expectations and said it continues to see strong capital investment from chip makers, led by foundries, that it expects to lift its sales in the current quarter.
Tower turns in record sales, growth in 2011 News & Analysis 2/16/2012 1 comment For the full year of 2011 specialist foundry Tower Semiconductor Ltd. has reported record revenues of $611 million, up 20 percent over revenues of 2010 and well ahead of the overall semiconductor industry's annual growth of 0.4 percent.
Tower bids to build wafer fab in India News & Analysis 2/16/2012 21 comments Tower Semiconductor Ltd., an Israel-based foundry chipmaker that trades under the name TowerJazz, has said it has signed a binding memorandum of understanding with an unnamed Indian infrastructure company, to build and operate a 300-mm wafer fab in India.
MEMC posts $1.5 billion Q4 loss News & Analysis 2/16/2012 Post a comment Silicon wafer maker MEMC Electronic Materials reported a $1.5 billion fourth quarter net loss, dragged down by charges related to the restructuring the company announced last year.
SanDisk launches SSD memory for PCs Product News 2/15/2012 12 comments SanDisk Corp. has announced the X100 solid-state drive (SSD) for use in desktop, notebook and thin laptop computers. The unit is available in capacities up to 512-Gbyte and comes with a 6-Gbyte per second SATA interface and it comes in a 2.5-inches form-factor but at only 9.5-mm or 7-mm deep.
MRAM startup raises $36 million VC fund News & Analysis 2/15/2012 3 comments Spin Transfer Technologies Inc., a startup pursing the development of a type of magnetic random access memory, has raised $36 million in a series A funding round led by Allied Minds Inc. and Invesco Asset Management.
Qimonda admin hits Infineon with $2.25 billion demand News & Analysis 2/15/2012 2 comments The insolvency administrator of Qimonda AG, the former DRAM-making subsidiary of chipmaker Infineon Technologies AG (Munich, Germany), has filed a request for payment of at least 1.71 billion euro (about $2.25 billion) in a lawsuit pending in a Munich District Court.
Darkhorse litho technologies stay in NGL race News & Analysis 2/15/2012 15 comments The continually slipping target date for insertion of extreme ultraviolet lithography into volume production has enabled several other intriguing lithography technologies to hang around the next-generation lithography race, which not long ago was considered all but over.
Counterfeit parts putting military at risk News & Analysis 2/15/2012 18 comments Counterfeit parts are increasingly finding their way into mission critical military and healthcare equipment, with the number of fake electronic parts soaring dramatically over the past couple of years, according to market research organization IHS iSuppli.
Firm claims patent infringement by Intel, IBM, Micron News & Analysis 2/15/2012 4 comments Atomic Precision Systems, a little-known semiconductor equipment vendor specializing in deposition technology, has filed a patent infringement suit against Intel, IBM and Micron Technology claiming that they willfully infringed on an atomic layer deposition patent held by APS, according to a statement issued b the company's law firm.
Energy Conversion Devices files for bankruptcy News & Analysis 2/14/2012 12 comments Solar equipment maker Energy Conversion Devices said it filed for Chapter 11 bankruptcy protection and announced plans to sale several assets, including its wholly owned subsidiary United Solar Ovonic and its minority stake in Ovonyx.
Broadcom brings 802.11ac to enterprise space News & Analysis 2/14/2012 1 comment Broadcom is extending its push for 802.11ac (“5G WiFi”) into the enterprise and carrier space with the launch of its 3 x 3 BCM43460 system-on-chip, which it claims is three times faster and six times more power efficient than previous generation 802.11an devices.
TI announces five radio combo chip News & Analysis 2/13/2012 8 comments Texas Instruments has announced the next generation of its WiLink combo chips, the WiLink 8.0 product family; a collection of 45-nanometer single-chip offerings integrating up to five radios on the same piece of silicon.
NI tips 2012 ATE trends outlook News & Analysis 2/13/2012 Post a comment National Instruments released its 2012 outlook for automated test equipment, which shares findings of the company's research into the latest test and measurement technologies and methodologies.
ASML Brion rolls mask optimization software News & Analysis 2/13/2012 Post a comment Lithography tool vendor ASML's Brion Technologies division announced a mask optimization software tool purports to offer seamless use of multiple optical proximity correction techniques in a single mask tapeout.
Battle-hardened veterans of the electronics industry have heard of the “connected car” so often that they assume it’s a done deal. But do we really know what it takes to get a car connected and what its future entails? Join EE Times editor Junko Yoshida as she moderates a panel of movers and shakers in the connected car business. Executives from Cisco, Siemens and NXP will share ideas, plans and hopes for connected cars and their future. After the first 30 minutes of the radio show, our listeners will have the opportunity to ask questions via live online chat.