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Content tagged with Semiconductors posted in February 2012
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Elpida posts big loss, denies Micron deal
News & Analysis  
2/3/2012   5 comments
Elpida Memory President Yukio Sakamoto reportedly downplayed talk of a possible merger with Micron Technology in the wake of his company reporting another huge quarterly loss.
New H-PSOF power-electronics packaging touts high-current capability and high efficiency
Product News  
2/2/2012   Post a comment
Automotive power transistors for hybrid and electric vehicles are first available products.
CMOS timing startup raises $2.3 million
News & Analysis  
2/2/2012   3 comments
EoSemi Ltd. (Congleton, England), a developer of CMOS replacements for quartz oscillators, has announced it has secured a $2.3 million (Ł1.5milion) second tranche of funding.
ST STCF04 LED flash/torch controller
Product News  
2/2/2012   Post a comment
ST's supercapacitor LED flash/torch controller upgrades conventional camera module architecture to deliver floodlight-strength flash power.
Texas Instruments DS1xxDF410 and DS1xxRT410 quad-channel retimers
Product News  
2/2/2012   Post a comment
TI claims its latest advanced signal conditioners deliver industry's highest performance at lowest power.
FPGA-based dual motor control kit from Microsemi and TRINAMIC
Product News  
2/2/2012   1 comment
Solution includes SmartFusion mixed-signal FPGA (with embedded microcontroller) evaluation kit and motor control daughter board kit...
ZMDI ZSPM401x DC/DC converters
Product News  
2/2/2012   Post a comment
ZMDI's latest DC/DC converters target consumer and communications applications.
TI LM5017 synchronous buck regulator
Product News  
2/2/2012   Post a comment
TI's family of highly integrated, pin-compatible ICs reduces PCB area and improves reliability in high-voltage applications.
TSMC plans 3-D IC assembly launch early in 2013
News & Analysis  
2/2/2012   7 comments
Leading IC foundry Taiwan Semiconductor Manufacturing Co. Ltd. plans to announce 3-D IC assembly service as a general offering at the beginning of 2013, according to Maria Marced, president of TSMC Europe.
Cadence a billion dollar company once again
News & Analysis  
2/2/2012   1 comment
Cadence Design Systems said its sales for 2011 topped $1 billion for the first time since 2008, as fourth quarter sales and profit beat analysts' expectations.
U.S. probes Qualcomm's foreign business practices
News & Analysis  
2/2/2012   2 comments
Qualcomm reported record quarterly results that beat analysts' expectations, but revealed the the U.S. Dept. of Justice has begun a preliminary investigation into the company's compliance with law governing foreign business practices by U.S. companies.
Plextor SSD offers high performance
Product News  
2/1/2012   Post a comment
Plextor has released its M3 Pro Series solid state drive (SSD) with enhanced sequential and random read/write speeds and with features such as 24nm Toggle Flash and firmware updates.
Microchip and Digilent unveil PIC32-based Cerebot development boards
Product News  
2/1/2012   1 comment
Users can develop a wide range of 32-bit microcontroller apps using Arduino-compatible chipKIT MPIDE, or Microchip’s MPLAB X IDE and MPLAB C Compiler
New versions of Wi-Fi expected to boost tablets
News & Analysis  
2/1/2012   4 comments
Chip makers and consumer electronics manufacturers are working to improve the tablet user experience within the home, turning to newer versions of Wi-Fi to improve connectivity and the ability to stream content from tablets to TVs, according af Broadcom executive.
Mali graphics to lead in smart TVs, says ARM's East
News & Analysis  
2/1/2012   2 comments
Mali graphics technology from IP licensor ARM Holdings plc shipped in tens of millions of partners' chips in 2011, and will do even better in 2012, particularly in digital televisions, according to CEO Warren East.
Broadcom beats estimates
News & Analysis  
2/1/2012   Post a comment
Chip vendor Broadcom reported fourth quarter results and gave first quarter guidance that beat analysts' expectations.
Lines blurring between digital, analog design worlds
News & Analysis  
2/1/2012   7 comments
Lines are blurring between the once distinct areas of digital and analog design, necessitating new tools and new ways of design collaboration, according to a panel of experts at the DesignCon 2012 conference.
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As data rates begin to move beyond 25 Gbps channels, new problems arise. Getting to 50 Gbps channels might not be possible with the traditional NRZ (2-level) signaling. PAM4 lets data rates double with only a small increase in channel bandwidth by sending two bits per symbol. But, it brings new measurement and analysis problems. Signal integrity sage Ransom Stephens will explain how PAM4 differs from NRZ and what to expect in design, measurement, and signal analysis.

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