MIT Research Looks to Extend Moore’s Law News & Analysis 2/28/2014 5 comments For years, the semiconductor world has waited for Moore’s Law to reach its limit. However, new research from MIT is showing how manufacturers can still shrink geometries past 20-nm cost effectively.
IBM Begins US Layoffs News & Analysis 2/27/2014 28 comments IBM began its first round of United States layoffs Thursday as part of a “global rebalancing” act that could save about $1 billion in costs. The restructuring process could see as many as 15,000 jobs being cut globally, including India, Brazil, and the European region
5G Spectrum Needed, Says Expert News & Analysis 2/26/2014 8 comments US regulators should open up 28-90 GHz bands for cellular applications, paving the way for a wireless renaissance, said a veteran researcher.
Intel, TSMC Revive EUV Hopes News & Analysis 2/25/2014 28 comments Intel and TSMC shared their latest efforts on extreme ultraviolet lithography, the technology they hope to use to make 7 nm and 10 nm chips.
LTE Built-In GM Cars: No Smartphones Required News & Analysis 2/25/2014 24 comments Smartphones are no longer the only platform hotly pursued by cellular operators eager to boost their revenue. Now, it’s cars. GM has partnered with AT&T, and Qualcomm launched 20nm LTE-A chipset for automotive.
Samsung Galaxy S5 Unveiled at MWC News & Analysis 2/24/2014 12 comments Samsung announced the next generation of its flagship smartphone, the Galaxy S5, at Mobile World Conference in Barcelona. The water and dust proof S5 has cat 4 LTE coverage and is designed to complement the company's new line of wearable devices.
Teenage CEO Speaks at EE Live! News & Analysis 2/24/2014 9 comments At 17, and chief executive of his own high-performance computer startup, Thomas Sohmers shares his views on Silicon Valley and more at EE Live!
Startup Stacks Chips Wirelessly News & Analysis 2/21/2014 28 comments ThruChip of Japan wants to license an inductive coupling method for linking 3D chip stacks wirelessly, saving costs and hassles of wired links.
Broadcom Chip Locates Wearables News & Analysis 2/21/2014 4 comments Broadcom announced a global navigation satellite system (GNSS) and sensor hub integrated SoC. The 40nm chip is designed for low-power, mass-market wearable devices and aims to fix issues associated with high cost, often inaccurate GPS systems.
Intel Drives Xeon to Big Data News & Analysis 2/19/2014 7 comments In an effort to increase data analysis power, Intel has achieved breakthrough computing speeds on its recently announced Xeon E7 v2 family of server processors. The Xeon processors can analyze large, diverse amounts of previously inaccessible data.
Wireless Charging Shift Ahead News & Analysis 2/18/2014 29 comments Several wireless charging solutions are in development or on the market, but consolidation is necessary before the technology can become ubiquitous.
Sonics' New IP for Low-Power SoCs Patented News & Analysis 2/18/2014 3 comments Sonics revealed the issuance of patent 8,601,288 "Intelligent Power Controller" from the US Patent Office. The hardware-based power-management IP lets SoC designers partition power domains and turn them on and off without software intervention.
Devices on Net to Top 6 Billion in 2014 News & Analysis 2/13/2014 13 comments A new IHS report shows that Internet-connected devices will surpass the 6 billion make in 2014, and devices with more versatility are replacing more traditional form factors.
Broadcom, Mediatek Dial Up LTE News & Analysis 2/13/2014 8 comments Two semi industry players vying for a larger share of the US market have announced LTE SoCs, increasing competition in the ongoing LTE rollout. Broadcom and MediaTek’s LTE solutions come in different forms but promise to make a sizeable dent.
Google Ramps Up Chip Design News & Analysis 2/12/2014 29 comments Evidence is mounting that Google is ramping up a broad and deep chip design capability, but its focus and timing are still unclear.
Google Cloud Needs Lower Latency News & Analysis 2/10/2014 8 comments A Google fellow asked engineers at ISSCC to come up with new techniques to reduce latencies to handle a rising tide of sensor data from wearables.
IBM’s Chip Unit on Chopping Block? News & Analysis 2/7/2014 49 comments Discussions about putting IBM’s semiconductor business on the chopping block have returned with a vengeance. IBM reportedly retained Goldman Sachs to look for possible buyers.
Power Week-in-Review: 10 EV Predictions News & Analysis 2/6/2014 2 comments This week, 10 market and technology predictions for electric vehicles in 2014, an energy harvester that continuously converts low-frequency vibration to electricity, a "proton flow" battery that could offer an economical hydrogen-based alternative to lithium, and a real-time AC power monitor IC.
Chips Break Sales Record in 2013 News & Analysis 2/5/2014 12 comments The semiconductor industry posted record sales in 2013, climbing 4.8% to reach $305.6 billion. The Semiconductor Industry Association (SIA) announced that global sales in December 2013 were the strongest on record at $26.6 billion.
Government OKs Car-to-Car Talk News & Analysis 2/5/2014 23 comments In announcing vehicle-to-vehicle (V2V) communication technology Monday, the US Dept. of Transportation pledged to “begin taking steps to enable” V2V for light vehicles. But it stopped short of proposing rulemaking.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Are the design challenges the same as with embedded systems, but with a little developer- and IT-skills added in? What do engineers need to know? Rick Merritt talks with two experts about the tools and best options for designing IoT devices in 2016. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.