Low glitch, 16-bit DAC dissipates 1.5 mW at 2.7 V Product News 3/30/2007 Post a comment Texas Instruments introduced a series of digital-to-analog converters (DACs) with an integrated precision reference. The DAC8560 is a 16-bit, single-channel DAC featuring low glitch (0.15 nV-s), low-power (1.5 mW at 2.7 V), an internal reference with 2 ppm/°C temperature drift and ±0.004 percent initial accuracy.
Omron Semi to launch foundry services News & Analysis 3/30/2007 Post a comment Japan's Omron Corp. Friday (March 30) completed its acquisition of Seiko Epson's chip fab, Yasu Semiconductor Corp., which it plans to relaunch as a foundry for nonvolatile memory and logic.
PMC-Sierra shuts R&D sites News & Analysis 3/30/2007 Post a comment Comms-chip supplier PMC-Sierra Inc. is cutting 175 jobs -- or 15 percent of its total work force -- and is closing two design centers amid a slowdown in its business.
LED driver powers small- and mid-size LCDs Product News 3/30/2007 Post a comment Sipex has released a 4-channel low side LED driver for powering small- and mid-size LCD modules that use LEDs for backlighting. The SP7616 is designed to drive LEDs in series from input voltages as high as 30 V.
Kingston rolls 2-Gbyte microSD dual adapter pack Product News 3/30/2007 Post a comment Kingston Technology released a 2-Gbyte microSD card with mini- and standard-size Secure Digital (SD) adapters to maximize microSD card compatibility and interoperability between mobile phones, digital cameras and portable media devices.
Data-parallel DSP aimed at cost-sensitive video surveillance apps Product News 3/30/2007 Post a comment At just $29 each in low-volume quantities, Stream Processors is bringing designers building power- and price-sensitive video surveillance systems that need the flexibility of software programmability a data-parallel DSP that delivers programmable performance of 16,000 MMACs while consuming less than 0.1 milliwatt per MMAC.
Fake components delay designs in Israel News & Analysis 3/29/2007 Post a comment Israeli designers, fed up with long component lead times, are buying counterfeits from China, sources said. The result is a high failure rate of designs, and lost sales at several companies.
REVIEW: 300-mV input-voltage boost converter throttles micro-fuel cells Product News 3/29/2007 Post a comment Chip maker Texas Instruments is debuting an ultra-low-input DC-to-DC boost converter IC that promises to let portables operate from new energy sources such as micro-fuel cells. TI's power circuit can let you build converters that operate with input voltages lower than 300-mV. eeProductCenter Senior Technical Editor Alex Mendelsohn reports.
SanDisk launches 4-Gbyte memory stick micro card Product News 3/29/2007 Post a comment SanDisk expanded its Memory Stick Micro (M2) line by introducing a 4-Gbyte card that has the capacity to hold up to 1,000 songs, 2,000 high-resolution photos or 20 hours of MPEG4 video, making it compatible with Sony Ericsson's latest generation of slim line, multimedia mobile handsets.
Fake components delay designs in Israel News & Analysis 3/29/2007 Post a comment Fake components are delaying several design projects in Israel. According to sources who spoke with EETimes Europe , the fake components, mostly from China, will lead to lost sales at several companies due to the delays.
Dual-band PA module targets entry-level handset sector Product News 3/29/2007 Post a comment RF Micro Devices designed its latest PowerStar power amplifier for manufacturers of dual-band handsets for the growing entry level and replacement markets. The GSM/GPRS PA dual-band module features improved isolation, harmonic performance and cross-band, helping to reduce RF complexity and increase design flexibility related to antenna and switch selection.
IQE looks to solar future as it reports losses News & Analysis 3/29/2007 Post a comment Epitaxial wafer and substrate foundry IQE increased sales by 55.2 percent in the year to 31 December 2006 to £32.4 million ($64 million), and wafer starts by just over 60 percent to 250,000 units, but still made operating losses of £4.2 million ($8.2 million). The company also said it is on track to begin limited pilot production of material for solar cells by the end of this year.
Ethernet upgrades to be sole data center net News & Analysis 3/29/2007 Post a comment Broadcom, IBM, Intel and others are in an early development stage with Converged Enhanced Ethernet (CEE), an interconnect that in addition to improved data networking could take on jobs handled by Fibre Channel and Infiniband, creating a single technology to link all systems in the data center.
EMCORE demos tunable SFF transponder for 10-Gigabit applications Product News 3/28/2007 Post a comment EMCORE has released a full band tunable long reach SFF transponder for 10-Gigabit applications. Marking the company's expansion into the 10 Gbits/s telecommunications market, the ETU-9C00-SFF is believed to be the first commercially available transponder to integrate full band tuning at 50-GHz channel spacing in the 300-pin SFF package.
Intel to begin 45-nm production in second half News & Analysis 3/28/2007 Post a comment Intel said its 45-nanometer Penryn family of processors would be in production during the second half of 2007. The company also provided a sneak peak at its next-generation 45-nm processor, codenamed Nehalem, which is set for production in 2008.
Bay Microsystems ships 40-Gbits/s network processor Product News 3/28/2007 Post a comment Bay Microsystems is shipping in sample quantities Chesapeake, a network processor and multimedia traffic manager capable of 40-Gbits/s line-rate performance with the capacity to accommodate the full spectrum of packet-based services, including carrier class Metro Ethernet, MPLS, IPv4/v6, pseudo-wire as well as legacy (POS, PPP).
MIPS licenses ST, expands China R&D center News & Analysis 3/28/2007 Post a comment STMicroelectronics has become the latest chip company to take a license for MIPS Technologies' 64-bit architecture core. ST will initially use the core as part of a project in cooperation with the Chinese Institute of Computing Technologies.
ARC scores major licensing deals in Asia Product News 3/28/2007 Post a comment ARC International has sealed licensing agreements with several Asia-based semiconductor companies who will use its configurable processor IP in SoCs targeted at applications such as multimedia devices VoIP phones, and flash memory devices.
Xilinx testing out China training program News & Analysis 3/28/2007 Post a comment Xilinx Inc. is spinning up an experimental training program in China that aims to train 1,000 IC and system designers in the coming year to help seed local innovation and to win loyalty for its products.
Low power TI boost converter targets solar cells News & Analysis 3/28/2007 Post a comment Texas Instruments has started sampling a 0.3V input power management chip with a 0.5V start-up that will enable portable electronic end-equipment to draw power from new energy sources, such as solar and micro-fuel cells.
Keynote: How multicore will reshape computing News & Analysis 3/28/2007 Post a comment Anant Agarwal, MIT professor and keynote speaker at the Multicore Expo, described how multicore architectures will force developers to rethink resource size selection, methods of connecting cores, and programming models.
RF Magic rolls DVB-C silicon tuner Product News 3/27/2007 Post a comment Fabless RF system-on-chip vendor RF Magic Inc. has unveiled a single-chip silicon tuner developed specifically for applications compliant with the digital video broadcasting over cable (DVB-C) standard in use in Europe, Asia, Australia and South Africa.
QMLV-qualified dual amplifier eliminates 1/F noise in satellite apps Product News 3/27/2007 Post a comment National's first dual amplifier in its new family of precision operational amplifiers QMLV-qualified for space-level applications uses patented techniques to measure and continually correct the input offset error voltage, while eliminating the unwanted 1/f voltage and current noise present in traditional amplifiers.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Are the design challenges the same as with embedded systems, but with a little developer- and IT-skills added in? What do engineers need to know? Rick Merritt talks with two experts about the tools and best options for designing IoT devices in 2016. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.