Breaking News
News Analysis
Content tagged with Semiconductors posted in March 2007
<<   <   Page 2 / 7   >   >>
XFP transceiver module targets 80 km long reach apps
Product News  
3/27/2007   Post a comment
EMCORE has developed a 1550 nm DWDM XFP optical transceiver module for long reach - greater than 80 km - WAN and long haul telecommunications applications.
Chirp modulation to drive location standard
News & Analysis  
3/27/2007   Post a comment
Standard setting organizations ISO and the IEC have jump-started a new standard for real time locating systems based on chirp spread spectrum (CSS) technology.
Single-chip GPS device targets mainstream mobile phones
Product News  
3/27/2007   Post a comment
TI has introduced a single-chip device that is expected to drive GPS applications into mainstream mobile phones. Built on TI's DRP single-chip technology, the NaviLink 5.0 solution comes in a 25 mm2 package.
May start for TSMC's 55-nm prototyping service
News & Analysis  
3/27/2007   Post a comment
Leading foundry Taiwan Semiconductor Manufacturing Company, Ltd. will start running its 55-nm process technology on a prototype basis in May, initially planning to offer it on a bi-monthly basis.
Symbian extends ARM support, launches OS v9.5
News & Analysis  
3/27/2007   Post a comment
Symbian Ltd has ported its mobile operating system to ARM's Cortex-A8 processor which is running on Texas Instruments' OMAP3430 applications processor. The OS supplier also revealed it has started shipping the latest version of its software, Symbian OS v9.5, which offers improved memory usage and integrated push e-mail support.
Sequans' WiMAX chip delivers 2X2 MIMO
Product News  
3/27/2007   Post a comment
The SQN1130 consumes 280 mW in active mode and delivers throughput of over 30 Mbps.
Silicon Image rolls 2nd-generation SteelVines
Product News  
3/26/2007   Post a comment
Silicon Image announced the availability of a second generation of SteelVine storage processors that are, according to the company, designed to give motherboard and storage appliance manufacturers a more powerful and cost-effective solution, with lower power requirements and a smaller footprint.
Touch-sensing ICs target medical touch-panel applications
Product News  
3/26/2007   Post a comment
Omron Electronic Components developed the B6TS application-ready touch-sensing IC family which measures floating capacitance through most touch-panel materials. They are suitable for use in medical products that need to withstand disinfectant cleaning, impervious to liquids and operated by personnel wearing surgical gloves.
Mantaro Networks Joins Nallatech's Channel Partner Program
News & Analysis  
3/26/2007   Post a comment
Nallatech (high performance FPGA-based computing solutions) is partnering with Mantaro Networks to offer solutions to the U.S. defense and military markets.
MathStar Collaborates with LG Electronics
News & Analysis  
3/26/2007   Post a comment
Mathstar and LG Electronics are collaboration to provide a technology solution for delivery of HD programming to hotel HDTVs.
3.125-Gbits/s LVDS buffers reduce jitter
Product News  
3/26/2007   Post a comment
National added three signal-conditioning buffers to its LVDS product portfolio that offer transmit pre-emphasis and receive equalization for jitter performance up to 3.125-Gbits/s, while using less power than previous-generation devices.
Memory subsystem combines key benefits of NOR, NAND and RAM
Product News  
3/26/2007   Post a comment
Aimed at embedded applications, SST's All-in-OneMemory memory subsystem blends key benefits of NOR, NAND, and RAM in a unified architecture that offers multi-gigabyte of execute-in-place code storage.
Clock multiplier provides any-rate frequency synthesis
Product News  
3/26/2007   Post a comment
Check out Silicon Laboratories' jitter-attenuating clock multiplier IC line that's capable of generating any output frequency from 2 kHz to 945 MHz and selecting frequencies to 1.4 GHz from any input frequency between 2 kHz and 710 MHz. The devices' ultra-low jitter generation rivals traditional analog PLLs built discretely using expensive voltage-controlled crystal oscillators (VCXOs) or voltage-controlled SAW oscillators (VCSOs).
Single-cell Li-Ion/Li-Polymer chargers are USB compatible
Product News  
3/26/2007   Post a comment
Microchip's Li-Ion/Li-Polymer charge-management controllers are USB compatible and come with integrated current sense, pass transistor and reverse battery protection onboard to enable smaller, more cost-effective designs.
EML driver IC sampling for 10-Gbits/s optical communication
Product News  
3/26/2007   Post a comment
Check out Oki's latest driver IC. The chip maker houses this device in a 4-mm x 4-mm small ceramic package and manufactures it using its advanced GaAs process that helps it achieve low power consumption of 0.45-W at 2.3V-pp amplitude.
ST houses serial EEPROMs in tiny 2 x 3mm MLP8 packages
Product News  
3/26/2007   Post a comment
Tiny packaging for all SPI and I²C devices, up to 64-Kbits, saves space and cost for high-end portable applications.
Intel confirms $2.5 billion fab in China
News & Analysis  
3/26/2007   Post a comment
Intel Corp. confirmed Monday that it will build a $2.5 billion, 300mm wafer fab in the northern Chinese city of Dalian. Fab 68 will begin construction later this year and is expected to go online in 2010, using 90-nanometer technology to "initially" make chipsets, the company said.
NXP makes a net loss, sees weak outlook weak
News & Analysis  
3/26/2007   Post a comment
NXP BV, the chip company created by the spinoff of Philips Semiconductors, achieved sales of 4.96 billion euro (about $6.58 million) in the year to Dec. 31, 2006, but a large loss in the fourth quarter produced a 611 million euro (about $810 million) net loss for the year.
SST combines advantages of NAND, NOR and RAM
Product News  
3/26/2007   Post a comment
All-in-OneMemory technology consists of a memory controller with built-in user NOR, NAND flash and random-access memory (RAM), all housed in a single package.
BenQ rejects $634M claim from bankrupt mobile unit
News & Analysis  
3/26/2007   Post a comment
Taiwan consumer electronics maker BenQ Corp. has rejected claims that it owes $634 million to creditors of its bankrupt German mobile phone unit.
SMIC scouting private equity infusion, report says
News & Analysis  
3/26/2007   Post a comment
Rumors swirl that Chinese foundry Semiconductor Manufacturing International Corp. is trying to stir interest in the private equity community for a 20 percent stake in its struggling business.
Intel confirms $2.5 billion fab in China
News & Analysis  
3/26/2007   Post a comment
Intel Corp. confirmed Monday that it will build a 300mm wafer fab in the northern Chinese city of Dalian.
Power-management ICs integrate charger
Product News  
3/26/2007   Post a comment
Maxim Integrated Products' latest power-management ICs integrate a USB/AC-adapter linear charger and Smart Power Selector for portable devices powered by rechargeable single-cell Li+ batteries.
Intel already has US gov't approval on China fab
News & Analysis  
3/25/2007   Post a comment
Intel Corp. has already obtained permission from the US government to build an advanced fab in China, according to a source familiar with the company's plan.
QuickLogic's ArcticLink - programmable devices tailored for the mobile market
Product News  
3/23/2007   Post a comment
Fully integrated host controllers provide multiple connectivity options; programmable fabric supports additional peripheral connectivity provides maximum design flexibility.
Digital controllers provide control for on-off temperature, time/temperature applications
Product News  
3/23/2007   Post a comment
Zytron Control Products launched the Series 1900 of digital controllers which provide control for on-off temperature, time/temperature and timing control applications.
Pre-standard PoE chips let switches drive 36-watts
Product News  
3/23/2007   Post a comment
Microsemi has developed what it claims is the industry's first pre-standard IEEE802.3at Power over Ethernet (PoE) integrated product family, delivering 36 watts of power for devices ranging from video screen phones and WiMAX transmitters to pan-tilt-zoom cameras, thin-clients and laptop computers.
Memory macros configured for mobile handset displays
Product News  
3/23/2007   Post a comment
Aimed at mobile handset displays, MoSys' 1T-SRAM dual-port display memory macros are used as the display buffer memory mounted on the display or on the connecting cable to help reduce EMI and power consumption.
Micron, Qimonda beat Samsung to DDR3
Product News  
3/23/2007   Post a comment
Memory chip makers Qimonda AG and Micron Technology have delivered samples of next-generation DDR3 DRAM ahead of Samsung Electronics, the DRAM market and technology leader, according to chip analysis firm Semiconductor Insights.
Execs upbeat about ICs, China
News & Analysis  
3/23/2007   Post a comment
Semiconductor executives are feeling positive about the near-term prospects for the global IC industry, expecting revenue gains to exceed 10 percent this year, according to a survey from KPMG.
WLAN chip packaged in small form-factor TFBGA
Product News  
3/23/2007   Post a comment
Aimed at handheld applications such as feature phones and smartphones, handheld game consoles and PDAs, NXP Semiconductor housed its latest WLAN chip in an 81-pin TFBGA.
NXP advances TV-on-mobile functions in handsets
Product News  
3/23/2007   Post a comment
NXP Semiconductors introduced the NXP TV-on-mobile HotPlug system product that combines everything an OEM needs to implement TVoM functions in advanced mobile systems, including hardware, DVB-H and DVB-T software stacks and security.
Video switch matrix reduces board space
Product News  
3/23/2007   Post a comment
Fairchild's FMS6502 is an 8-input, 6-output video switch matrix tailored for consumer and industrial video applications such as automotive in-cabin entertainment systems, HDTVs, flat panel displays and A/V receivers.
GaN transistors boost WiMAX power amplification by 50%
Product News  
3/23/2007   Post a comment
Cree Inc. is shipping sample quantities of three gallium nitride (GaN) high electron mobility transistors that provide linear power and efficiency for WiMAX and broadband wireless access applications operating between 2.3 GHz and 3.9 GHz.
Apax sells majority stake in wafer reclaimer
News & Analysis  
3/23/2007   Post a comment
Private equity group Apax Partners, the largest shareholder in Pure Wafer plc, which provides silicon wafer reclaim services for chip manufacturers, has disposed of its 49.9 percent stake to institutional investors at £3 per share.
US may back down on tech export policy
News & Analysis  
3/23/2007   Post a comment
The U.S. government is taking a second look at controversial plan to tighten export controls on technology shipped to China and is indicating that it may back down
Hua Hong NEC to boost capacity
News & Analysis  
3/23/2007   Post a comment
Foundry Hua Hong NEC Electronics Co. said it will increase capacity by 50 percent this year by adding to its 200-mm wafer lines.
Updated: Court rules on Qualcomm standards behavior
News & Analysis  
3/22/2007   Post a comment
A federal district court has adopted a unanimous jury finding that Qualcomm violated its duty to disclose patents to an industry standards body and thereby waived its rights to enforce two patents the company alleged covered the H.264 video compression standard, according to a statement released by rival Broadcom.
Dual-channel 150-mA LDO regulator targets portable applications
Product News  
3/22/2007   Post a comment
Sipex expanded its line of low-dropout (LDO) regulators with the introduction of a dual channel LDO, the SP6265. The 150 mA dual channel, CMOS LDO has been designed to meet the needs of space-critical portable consumer applications.
Mid-voltage power MOSFETS feature low switching losses
Product News  
3/22/2007   Post a comment
Aimed at high-power, low-voltage power conversion applications, IXYS releases a line of mid-voltage power MOSFETS with ratings from 55 to 100 volts in proprietary ISOPLUS i5-Pak packages.
NXP's 802.11 b/g SiP delivers small footprint
Product News  
3/22/2007   Post a comment
The BGM220 offers a small footprint and ultra-low power consumption in an 81-pin TFBGA package.
MediaTek pays $37 million for Japanese firm
News & Analysis  
3/22/2007   Post a comment
Taiwan's MediaTek Inc. will spend $37 million to acquire a controlling stake in a small Japanese designer of image processors for digital camcorders and digital still cameras.
NXP readies ultra small 802.11b/g package
Product News  
3/22/2007   Post a comment
NXP Semiconductors is about to start sampling a single-package 81-pin TFBGA Wi-Fi chip that it says is the smallest device yet for 802.11 b/g connectivity as well as offering very low power drain.
Applied Materials opening China R&D center
News & Analysis  
3/22/2007   Post a comment
Applied Materials Inc. is planning to invest $83 million to ramp up its first product development center in China, which opens Friday.
For low-power design, speak two languages
News & Analysis  
3/22/2007   Post a comment
It's looking like the impasse between camps supporting Common Power Format and Unified Power Format means that chip designers will need to familiarize themselves with both or hope that translators can make the task easier.
Hynix-SanDisk: what it means
News & Analysis  
3/22/2007   Post a comment
Opinions are already rolling in on what the Hynix-SanDisk settlement of patent disputes and agreement to form a joint venture will mean for the industry.
Voltage-to-current converter delivers up to 36 mA
Product News  
3/21/2007   Post a comment
Texas Instruments released a voltage-to-current converter/transmitter designed for standard 0-20 mA and 4-20 mA analog signals, as well as 5-25 mA signals and voltage outputs. The XTR111 can deliver current up to 36 mA and includes output error detection and output disable.
8-input, 6-output video switch targets consumer and industrial apps
Product News  
3/21/2007   1 comment
Fairchild Semiconductor introduced the FMS6502, an 8-input, 6-output video switch matrix suitable in consumer and industrial video applications including automotive in-cabin entertainment systems, HDTVs, flat panel displays and A/V receivers.
Intel leads $40M investment in Legend Silicon
News & Analysis  
3/21/2007   Post a comment
The venture capital arm of Intel led a Series D private equity investment of up to $40 million in digital broadcasting and broadband transmission IC vendor Legend Silicon.
Kit enables high-quality hands-free communication designs
Product News  
3/21/2007   Post a comment
Zarlink Semiconductor expanded its family of voice processing solutions with the ZL38005, a device enabling high-quality voice in hands-free communication systems, including speakerphones, home automation applications and car kits.
<<   <   Page 2 / 7   >   >>


Flash Poll
EE Life
Frankenstein's Fix, Teardowns, Sideshows, Design Contests, Reader Content & More
Rishabh N. Mahajani, High School Senior and Future Engineer

Future Engineers: Don’t 'Trip Up' on Your College Road Trip
Rishabh N. Mahajani, High School Senior and Future Engineer
7 comments
A future engineer shares his impressions of a recent tour of top schools and offers advice on making the most of the time-honored tradition of the college road trip.

Max Maxfield

Juggling a Cornucopia of Projects
Max Maxfield
20 comments
I feel like I'm juggling a lot of hobby projects at the moment. The problem is that I can't juggle. Actually, that's not strictly true -- I can juggle ten fine china dinner plates, but ...

Larry Desjardin

Engineers Should Study Finance: 5 Reasons Why
Larry Desjardin
41 comments
I'm a big proponent of engineers learning financial basics. Why? Because engineers are making decisions all the time, in multiple ways. Having a good financial understanding guides these ...

Karen Field

July Cartoon Caption Contest: Let's Talk Some Trash
Karen Field
151 comments
Steve Jobs allegedly got his start by dumpster diving with the Computer Club at Homestead High in the early 1970s.

Top Comments of the Week
Like Us on Facebook
EE Times on Twitter
EE Times Twitter Feed

Datasheets.com Parts Search

185 million searchable parts
(please enter a part number or hit search to begin)