Symbian extends ARM support, launches OS v9.5 News & Analysis 3/27/2007 Post a comment Symbian Ltd has ported its mobile operating system to ARM's Cortex-A8 processor which is running on Texas Instruments' OMAP3430 applications processor. The OS supplier also revealed it has started shipping the latest version of its software, Symbian OS v9.5, which offers improved memory usage and integrated push e-mail support.
Silicon Image rolls 2nd-generation SteelVines Product News 3/26/2007 Post a comment Silicon Image announced the availability of a second generation of SteelVine storage processors that are, according to the company, designed to give motherboard and storage appliance manufacturers a more powerful and cost-effective solution, with lower power requirements and a smaller footprint.
Touch-sensing ICs target medical touch-panel applications Product News 3/26/2007 Post a comment Omron Electronic Components developed the B6TS application-ready touch-sensing IC family which measures floating capacitance through most touch-panel materials. They are suitable for use in medical products that need to withstand disinfectant cleaning, impervious to liquids and operated by personnel wearing surgical gloves.
3.125-Gbits/s LVDS buffers reduce jitter Product News 3/26/2007 Post a comment National added three signal-conditioning buffers to its LVDS product portfolio that offer transmit pre-emphasis and receive equalization for jitter performance up to 3.125-Gbits/s, while using less power than previous-generation devices.
Clock multiplier provides any-rate frequency synthesis Product News 3/26/2007 Post a comment Check out Silicon Laboratories' jitter-attenuating clock multiplier IC line that's capable of generating any output frequency from 2 kHz to 945 MHz and selecting frequencies to 1.4 GHz from any input frequency between 2 kHz and 710 MHz. The devices' ultra-low jitter generation rivals traditional analog PLLs built discretely using expensive voltage-controlled crystal oscillators (VCXOs) or voltage-controlled SAW oscillators (VCSOs).
Intel confirms $2.5 billion fab in China News & Analysis 3/26/2007 Post a comment Intel Corp. confirmed Monday that it will build a $2.5 billion, 300mm wafer fab in the northern Chinese city of Dalian. Fab 68 will begin construction later this year and is expected to go online in 2010, using 90-nanometer technology to "initially" make chipsets, the company said.
NXP makes a net loss, sees weak outlook weak News & Analysis 3/26/2007 Post a comment NXP BV, the chip company created by the spinoff of Philips Semiconductors, achieved sales of 4.96 billion euro (about $6.58 million) in the year to Dec. 31, 2006, but a large loss in the fourth quarter produced a 611 million euro (about $810 million) net loss for the year.
Power-management ICs integrate charger Product News 3/26/2007 Post a comment Maxim Integrated Products' latest power-management ICs integrate a USB/AC-adapter linear charger and Smart Power Selector for portable devices powered by rechargeable single-cell Li+ batteries.
Pre-standard PoE chips let switches drive 36-watts Product News 3/23/2007 Post a comment Microsemi has developed what it claims is the industry's first pre-standard IEEE802.3at Power over Ethernet (PoE) integrated product family, delivering 36 watts of power for devices ranging from video screen phones and WiMAX transmitters to pan-tilt-zoom cameras, thin-clients and laptop computers.
Micron, Qimonda beat Samsung to DDR3 Product News 3/23/2007 Post a comment Memory chip makers Qimonda AG and Micron Technology have delivered samples of next-generation DDR3 DRAM ahead of Samsung Electronics, the DRAM market and technology leader, according to chip analysis firm Semiconductor Insights.
Execs upbeat about ICs, China News & Analysis 3/23/2007 Post a comment Semiconductor executives are feeling positive about the near-term prospects for the global IC industry, expecting revenue gains to exceed 10 percent this year, according to a survey from KPMG.
NXP advances TV-on-mobile functions in handsets Product News 3/23/2007 Post a comment NXP Semiconductors introduced the NXP TV-on-mobile HotPlug system product that combines everything an OEM needs to implement TVoM functions in advanced mobile systems, including hardware, DVB-H and DVB-T software stacks and security.
Video switch matrix reduces board space Product News 3/23/2007 Post a comment Fairchild's FMS6502 is an 8-input, 6-output video switch matrix tailored for consumer and industrial video applications such as automotive in-cabin entertainment systems, HDTVs, flat panel displays and A/V receivers.
Apax sells majority stake in wafer reclaimer News & Analysis 3/23/2007 Post a comment Private equity group Apax Partners, the largest shareholder in Pure Wafer plc, which provides silicon wafer reclaim services for chip manufacturers, has disposed of its 49.9 percent stake to institutional investors at £3 per share.
Updated: Court rules on Qualcomm standards behavior News & Analysis 3/22/2007 Post a comment A federal district court has adopted a unanimous jury finding that Qualcomm violated its duty to disclose patents to an industry standards body and thereby waived its rights to enforce two patents the company alleged covered the H.264 video compression standard, according to a statement released by rival Broadcom.
NXP readies ultra small 802.11b/g package Product News 3/22/2007 Post a comment NXP Semiconductors is about to start sampling a single-package 81-pin TFBGA Wi-Fi chip that it says is the smallest device yet for 802.11 b/g connectivity as well as offering very low power drain.
For low-power design, speak two languages News & Analysis 3/22/2007 Post a comment It's looking like the impasse between camps supporting Common Power Format and Unified Power Format means that chip designers will need to familiarize themselves with both or hope that translators can make the task easier.
Hynix-SanDisk: what it means News & Analysis 3/22/2007 Post a comment Opinions are already rolling in on what the Hynix-SanDisk settlement of patent disputes and agreement to form a joint venture will mean for the industry.
Voltage-to-current converter delivers up to 36 mA Product News 3/21/2007 Post a comment Texas Instruments released a voltage-to-current converter/transmitter designed for standard 0-20 mA and 4-20 mA analog signals, as well as 5-25 mA signals and voltage outputs. The XTR111 can deliver current up to 36 mA and includes output error detection and output disable.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Are the design challenges the same as with embedded systems, but with a little developer- and IT-skills added in? What do engineers need to know? Rick Merritt talks with two experts about the tools and best options for designing IoT devices in 2016. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.