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Content tagged with Semiconductors posted in March 2007
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TI's 350 MHz floating-point DSP targets audio processing,
Product News  
3/1/2007   Post a comment
The TMS320C6727B is a 350-MHz floating-point DSP developed by Texas Instruments for applications including audio conferencing, multi-channel audio systems, audio broadcast biometric and industrial solutions.
RS-485 transceivers operate off 3.3-V with 25 kV ESD protection
Product News  
3/1/2007   Post a comment
Linear Technology Corp. has introduced two families of 3.3-V RS-485. The LTC2854/LTC2855 devices have switchable, integrated termination, while the LTC2850/LTC2851/LTC2852 devices have industry-standard pinouts and support a maximum data rate of 20 Mbits/s.
DVB-S2 demodulator lowers set-top box design costs
Product News  
3/1/2007   Post a comment
For designers looking to reduce the cost of HDTV digital video recorder (DVR) satellite set-top boxes, ST is offering a dual DVB-S2 satellite TV demodulator that provides the functions of two of its predecessor chip in a single package.
Renesas invests in Chinese software partner
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3/1/2007   Post a comment
Renesas Technology Corp. is investing in a Chinese company in Xian in order to expand sales of systems-on-a-chip for audio/visual product applications.
TI rolls new version of Code Composer IDE
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3/1/2007   Post a comment
Texas Instruments rolled out version 3.3 of its Code Composer Studio Platinum integrated development environment, which the company claims raises multiprocessor support and analysis features to a higher level to meet the evolving needs of embedded system development.
Dual-channel device converts T1 data rates to fiber optic cable
Product News  
3/1/2007   Post a comment
Designed to switch T1 data rates to fiber optic cable, the Dual T1 media converter from Stratos Optical Technologies combines RJ45 interconnected T1 data with fiber optic HMA Expanded Beam technology to provide dual 1.544 Mbits/s data-rate media conversion from copper to fiber and back for tactical communication applications.
Quickfilter expands distribution channels in Europe, Israel
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3/1/2007   Post a comment
Texas-based fabless semiconductor company Quickfilter Technologies, Inc. announced it has signed two distinct distribution agreements with Norwegian Nortelco Electronics AS and with Israeli Amtronics Startronics.
Private equity woos STATS ChipPAC
News & Analysis  
3/1/2007   Post a comment
Singapore's Temasek Holdings launches $1.6 billion bid to take STATS ChipPAC private.
BenQ plans niche attack on cell phones
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3/1/2007   Post a comment
After high hopes of being a handset giant, the tattered remains of BenQ-Siemens will be sold off on eBay. But the company is already planning a comeback, focusing on products that have worked in the past.
Singapore's UTAC bets growth on acquisitions, alliances
News & Analysis  
3/1/2007   Post a comment
Recent acquisitions help assembly house UTAC turn in a strong 2006 performance
AMD tips quad-core performance
Product News  
3/1/2007   Post a comment
Advanced Micro Devices upcoming Barcelona quad-core processor will sport floating-point performance 42 percent higher than Intel's current top-of-the line CPU, the Xeon X5355 also known as Clovertown.
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What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Are the design challenges the same as with embedded systems, but with a little developer- and IT-skills added in? What do engineers need to know? Rick Merritt talks with two experts about the tools and best options for designing IoT devices in 2016. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.
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