NXP creditors ready to swap bonds worth $600M News & Analysis 3/24/2009 Post a comment NXP Semiconductor has received commitments from bondholders willing to exchange $600 million of its debts for new secured bonds, lifting the chip maker closer to its goals of cutting down high interest payments.
IQE boosts sales, profits News & Analysis 3/24/2009 Post a comment Semiconductor wafer supplier IQE plc (Cardiff, Wales) says inventories are coming to an end after a slow Q1 and expects increasing demand in the second quarter of the year as it reported a seven-fold jump in full-year operating profits.
Researchers team for organic electronics News & Analysis 3/24/2009 Post a comment OLED specialist Novaled AG (Dresden, Germany) has teamed with the Eindhoven, Netherlands based Holst Centre on the development and exploitation of Organic Thin Film Transistors (OTFT) using the Novaled PIN OLED technology and materials.
Cloud service battles videogame boxes News & Analysis 3/24/2009 Post a comment Armed with a proprietary compression technology, startup OnLive will launch this fall an online service that aims to rival the experience of dedicated videogame consoles, using ASIC-based algorithms to zip content from its remote servers to users on PCs, Macs or TVs in under 80 milliseconds.
NAND prices on the rebound, analyst says News & Analysis 3/23/2009 Post a comment Average selling prices for NAND flash memory parts have rebounded from a low of about 80 cents per gigabyte in the fourth quarter of 2008 and are currently close to covering cash costs, according to a memory industry analyst who cited cuts in capacity and fab utilization.
Mobile operators seal, extend network sharing deals News & Analysis 3/23/2009 Post a comment In a wide-ranging cost cutting deal that will have major implications for their equipment suppliers, and further down the chain for many component suppliers, Vodafone and Telefonica have confirmed they will pool their mobile networks in the U.K and said that the deal covers several other European countries.
NXP first to demo ARM Cortex-M0 silicon Product News 3/23/2009 Post a comment NXP Semiconductors (Eindhoven, the Netherlands) is using this week's Embedded Systems Conference in San Francisco to demonstrate what is says is the first functional ARM Cortex-M0 silicon.
Multicore CPUs face slow road in comms News & Analysis 3/20/2009 2 comments The transition to multicore processors in communications and networking systems is expected to be a slow one due to complex and fragmented nature of the underlying technology, predicted a technology analyst.
National Semi buys solar firm News & Analysis 3/19/2009 Post a comment National Semiconductor acquired Act Solar, a privately held solar energy company that provides power optimization for commercial and utility-scale solar installations. Financial terms of the acquisition were not disclosed.
Startup begins shipping MMIC receiver modules Product News 3/19/2009 Post a comment MMIC Solutions Ltd (Ledbury, England), a startup focusing on modules and subsystems for commercial millimetre wave applications, has shipped its first integrated receiver modules to U.S. group HXI LLC, which specializes in radio links for backhaul.
Micronetics buys part of MA/COM's RFID lines News & Analysis 3/19/2009 Post a comment Microwave and RF components and subassemblies specialist Micronetics, Inc. (Hudson, NH) is buying, for an undisclosed sum, some of the RFID identification lines of M/A-COM RFID, Inc, , a subsidiary British defense , aerospace and sub-assembly group Cobham plc (Wimborne, England).
Automotive slump drags down microcontroller demand News & Analysis 3/19/2009 Post a comment Against the background of weak demand it the automotive industry, the market for microcontrollers is going to shrink 11 percent, predicts market researcher Databeans. While automotive applications will remain a large market for MCUs, new markets in industrial lighting, alternative energy and IC cards are emerging.
AXT chief exec resigns News & Analysis 3/18/2009 Post a comment Philip C. S. Yin resigned as chairman and CEO of semiconductor substrate supplier AXT in order to pursue other opportunities, according to the company.
Can Sony really afford to buy Ericsson out of handsets JV? News & Analysis 3/18/2009 Post a comment The rumors about a divorce between Sony and Ericsson from their 50:50 mobile phone joint venture have surfaced again, with German technology magazine Manager-Magazin reporting the Japanese group has approached the its Swedish partner about acquiring total control.
Dafca rolls FPGA tool, names new CEO Product News 3/18/2009 Post a comment Validation technology provider Dafca this week appointed 30-year industry veteran Dennis Shepard as its new CEO and introduced two products, ClearBlueXpress and ClearBlueFPGA, to address the SoC and FPGA markets.
Dashing towards another wireless data standard News & Analysis 3/18/2009 Post a comment A consortium of semiconductor companies, RFID industry players, system integrators and wireless data users have formed the DASH7 Alliance that will develop and promote a technology that extends the ISO 18000-7 standard.
Maxim : Re-drivers bridge long distances Product News 3/18/2009 Post a comment Maxim introduces two re-drivers to support the industry’s latest high-speed serial interfaces. The MAX4950 is a quad-channel buffer designed to re-drive PCI Express (PCIe) Gen I and Gen II signals (up to 5.0 Gbits/s), while the MAX4951 is a dual-channel (Tx and Rx) re-driver for SATA/eSATA Gen I (1.5 Gbits/s), Gen II (3.0 Gbits/s), and Gen III (6.0 Gbits/s) signals.
Ramtron cuts workforce, salaries News & Analysis 3/17/2009 Post a comment Nonvolatile ferroelectric random access memory vendor Ramtron International will cut its workforce by 17 percent and reduce salaries for all employees by 5 to 12 percent as part of a series of cost reduction actions, the company said.
T-Mobile sees Android, 3G rising News & Analysis 3/17/2009 Post a comment Like many wireless carriers, T-Mobile hopes to buck the downturn by expanding its cellular network and portfolio handsets; however, the company wants to streamline the number of application environments it supports and lower the costs of its back haul network.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.