Audience reverse engineers human hearing for mobile News & Analysis 3/30/2012 5 comments Using its earSmart voice processor, using two microphones that work like human ears, Audience’s chip enables analysis of sound in much the same way as the human brain, which when processing audio decides what to remove, what to keep and what to enhance.
TI THS4531 ADC driver Product News 3/29/2012 Post a comment TI's fully differential amplifier uses only 250 uA of quiescent current while providing 36 MHz of bandwidth to support the low power needs of portable and high-density systems
World on cusp of EV tipping point, says Tesla CTO News & Analysis 3/29/2012 53 comments Slow, steady improvement in battery technology over the past several decades as brought the world to the cusp of a tipping point that will lead to greater adoption of electric vehicles, according to JB Straubel, chief technology and co-founder of Tesla Motors.
Mobile MotionEngine empowers apps Product News 3/28/2012 2 comments The Freespace MotionEngine has already empowered the smart TV revolution at LG, Roku and Sony by enabling remote controllers to point-and-click on-screen air-mouse style. Now Hillcrest Labs has repurposed it for tablets and smartphones running the Android and Windows Phone operating systems.
RDA buys Chinese IP to broaden cell phone offering News & Analysis 3/27/2012 6 comments RDA Microelectronics Inc. (Shanghai, China), a fabless chip company that markets RF and mixed-signal chips for cellular and broadcast communications applications, has announced the acquisition of all the baseband intellectual property from privately-held Chinese company Coolsand Holding Co. Ltd. for $46 million.
Oclaro, Opnext to merge News & Analysis 3/26/2012 Post a comment Oclaro, a provider of optical communications and laser products, said it agreed to merge with optical module and components vendor Opnext in an all stock deal.
Chip rankings: Intel had highest share in over 10 years News & Analysis 3/26/2012 3 comments Intel accounted for 15.6 percent of the overall semiconductor market in 2011, as brisk sales of its core chips and the acquisition of Infineon AG's wireless chip business unit helped the No. 1 chip vendor achieve its highest share of the overall chip market in more than 10 years, according to market research firm IHS iSuppli.
Multi-cores tackle human interface News & Analysis 3/26/2012 5 comments The diverse demands of realtime process control which must nevertheless offer a touch-enabled user-interface—from smart appliances to point-of-sale terminals to medical monitors—is best addressed by heterogeneous multi-core processors, according to Freescale Semiconductor, which introduced its new Vybrid family of microcontrollers at DESIGN West 2012.
Ambiq launches nanoampere RTC chips Product News 3/25/2012 10 comments Fabless chip company Ambiq Micro has announced the introduction to the market of the AM08XX and AM18XX real-time clock (RTC) chips, which the company claims are the world's lowest power RTC chips. The typical active current is between 15 and 55 nanoamperes, Ambiq said.
Movidius signs $25 million Chinese partnership deal News & Analysis 3/25/2012 2 comments Fabless mobile multimedia chip company Movidius has signed a deal with electronics manufacturer Keen High Technologies that is expected to generate more than $25 million of equipment sales over the next three years, according to reports.
Fab tool book-to-bill above parity for first time in 16 months News & Analysis 3/23/2012 Post a comment North America-based manufacturers of semiconductor capital equipment posted a book-to-bill ratio of 1.01 on a three-month average basis for February, the first time the industry has achieved a book-to-bill above parity since September of 2010, according to the fab tool vendor trade group SEMI.
Panel sees MEMS market boom, silicon to win more slots News & Analysis 3/23/2012 2 comments The consumer electronics industry is going to continue as the driver for rapid expansion in MEMS volume shipments with established equipment being loaded with more sensors and actuators even as sales expand and new equipment comes on to the scene. That's according to the final panel discussion at the MEMS Executive Congress Europe held in Zurich, Switzerland, on Tuesday March 20.
Battle-hardened veterans of the electronics industry have heard of the “connected car” so often that they assume it’s a done deal. But do we really know what it takes to get a car connected and what its future entails? Join EE Times editor Junko Yoshida as she moderates a panel of movers and shakers in the connected car business. Executives from Cisco, Siemens and NXP will share ideas, plans and hopes for connected cars and their future. After the first 30 minutes of the radio show, our listeners will have the opportunity to ask questions via live online chat.