TSMC, Altera team on 3-D IC test vehicle News & Analysis 3/22/2012 1 comment Claiming an industry first, TSMC and Altera announced the joint development of a heterogeneous 3-D IC test vehicle using TSMC's chip-on-wafer-on-substrate integration process.
Applied Materials readies DRIE machine for MEMS News & Analysis 3/22/2012 Post a comment Leading chipmaking equipment company Applied Materials is planning to launch a deep reactive ion etch machine for small wafer sizes at the end of April, as part of a renewed commitment to the MEMS market, according to executives.
IHS: Chip inventories to improve in Q1 News & Analysis 3/22/2012 Post a comment Average days of inventory held by semiconductor suppliers is expected to decline by 0.5 percent in the first quarter after hitting an 11-year high in the fourth quarter of 2011, according to market research firm IHS iSuppli.
Materials science pioneer honored News & Analysis 3/21/2012 3 comments John Werner Cahn, a National Institute of Standards and Technology scientist responsible for major paradigm shifts that have repeatedly redefined modern materials science, recently received the Kyoto Prize in advanced technologies in San Diego.
Antenna IP looks to slash cost Product News 3/20/2012 2 comments Ploughshare Innovations (which licenses intellectual property developed by the UK’s Defence Science and Technology Laboratory) has introduced an antenna design that operates across multiple frequency bands and features a bill of materials (BOM) cost that is expected to be under 10 cents in volume.
XMOS launches developer partner program News & Analysis 3/20/2012 Post a comment XMOS has launched a new Partner Program, enabling companies to use XMOS devices and no-cost development tools as well as application code and reference designs to meet their exact product specifications.
Applied tips advanced CVD films for displays News & Analysis 3/19/2012 Post a comment Applied Materials said it has developed new plasma-enhanced chemical vapor deposition technology for use in the production of higher-performance, high-resolution displays for next-generation tablet computers and TVs.
Marvell's founders file complaint against Goldman Sachs News & Analysis 3/19/2012 13 comments Sehat Sutardja and Weili Dai, the founders of chip vendor Marvell Technology Group, filed a claim in the San Francisco office of the Financial Industry Regulatory Authority against Goldman Sachs and two account executives, alleging Goldman Sachs manipulated the 2008 financial crisis to defraud the two Silicon Valley executives of several hundred million of dollars.
TEL acquires deposition tool vendor News & Analysis 3/17/2012 3 comments Japanese semiconductor equipment vendor Tokyo Electron Ltd. said it signed a definitive agreement to acquire Nexx Systems, a supplier of physical vapor deposition tools for thin films and electrochemical deposition tools for metals.
Micrel to acquire controlling stake in PhaseLink News & Analysis 3/16/2012 Post a comment Analog chip vendor Micrel said Thursday it signed a definitive agreement to acquire a controlling interesting in PhaseLink, a privately held provider of high-performance integrated timing solutions to system and oscillator manufacturers.
iPad teardown reveals IC design winners News & Analysis 3/16/2012 12 comments Consumer electronics repair company iFixit has disassembled the latest iPad tablet computer from Apple to reveal the details of how it is put together including the IC design wins.
TSMC's solar subsidiary gets certifications News & Analysis 3/15/2012 Post a comment TSMC Solar Ltd., a wholly-owned solar module subsidiary of foundry giant TSMC, has received both Underwriters Laboratories and International Electrotechnical Commission certifications for a range of its copper indium gallium selenide photovoltaic modules.
Globalfoundries expects sales to AMD to increase News & Analysis 3/15/2012 2 comments Mike Noonen, head of sales at Globalfoundries, expects AMD to spend more on wafers with Globalfoundries in 2012, despite an amended wafer supply agreement that gives it the right to use others foundries for 28-nm APUs.
ST-Ericsson re-org is prep for sale News & Analysis 3/15/2012 1 comment Didier Lamouche, the CEO appointed in December at fabless mobile chip joint venture ST-Ericsson, is set to announce a re-organization before the end of the month, which will ready the company for sale, according to a Reuters report that quoted unnamed sources.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.