Year-old Bermai packs all functions for 5-GHz wireless LANs in one chip News & Analysis 4/29/2002 Post a comment LAS VEGAS -- In a move that's certain to raise the stakes in wireless local area networks, startup Bermai Inc. plans to formally launch its single-chip solution for 5-GHz wireless LANs at the NetWorld+Interop trade show here this week. The year-old fabless chip company is jumping into a crowded market, claiming to be the first to offer a single "radio chip" for the emerging 802.11a wireless LANs.
Fairchild rolls out MicroPak as next-generation logic package News & Analysis 4/29/2002 Post a comment SOUTH PORTLAND, Maine--Fairchild Semiconductor International Inc. today released 50 standard logic functions in its new MicroPak chip-scale package, which is 65% smaller than widely used SC70 packages, according to the company. Fairchild said the MicroPak is its next-generation package for a wide range of logic and switch functions.
Trident banks on 0.13-micron 3-D processor, chip set for rebound News & Analysis 4/25/2002 Post a comment SUNNYVALE, Calif. -- Trident Microsystems Inc. here reported a 4.4 sequential decrease in revenues to $28.8 million in the company's fiscal third quarter, ended March 31, compared to $30.2 million in the prior three-month period. The graphics chip supplier's sales were 16.6% higher than $24.7 million in the quarter last year.
austriamicrosystems offers SiGe chip set, ASIC library for passive optical networks News & Analysis 4/24/2002 Post a comment GRAZ, Austria ---Chip maker austriamicrosystems AG here today announced development of a new generation of design functions in an ASIC library for electro-optical interface ICs for passive optical networks (PON). In addition, the Graz-based company said it has created a new chip set, called Key Electro-Optical Elements (KEOPE), which will be fabricated in a high-speed, low-power silicon-germanium (SiGe) technology.
IXYS to acquire Clare in $55 million merger deal News & Analysis 4/23/2002 Post a comment SANTA CLARA, Calif. -- Power semiconductor maker IXYS Corp. here today announced an agreement to acquire Clare Inc. of Beverly, Mass., a supplier of high-voltage ICs, solid-state relays, mixed-signal ASICs and drivers for organic light emitting diode (OLEDs).
Intrinsity aims 2-GHz Adaptive Signal Processors at beating DSPs News & Analysis 4/22/2002 Post a comment AUSTIN, Tex. -- In a move to applying its dynamic logic technology to high-speed embedded processing applications, Intrinsity Inc. today announced plans to offer a 2-GHz adaptive signal processor, based on a matrix-computing engine and a souped up 32-bit RISC core, licensed from MIPS Technologies Inc.
Micron agrees to buy Hynix memory business for $3.2 billion in stock News & Analysis 4/22/2002 Post a comment BOISE, Idaho--Micron Technology Inc. today announced a non-binding agreement to purchase the memory business of Hynix Semiconductor Inc. for 108.6 million shares of stock, valued at $3.2 billion. Micron said it has also agreed to invest $200 million in Hynix in return for a 15% equity stake in the Korean company's non-memory chip business.
AMD sales fall 5% sequentially in Q1 despite record MPU shipments News & Analysis 4/17/2002 Post a comment SUNNYVALE, Calif.--Advanced Micro Devices Inc. today reported a net loss of $9.2 million on sales of $902.1 million in the first quarter. Despite shipping a record 8 million PC processors in the quarter, AMD said its Q1 revenues sequentially dropped 5% from the fourth quarter, partly because of weakness in flash memories.
Xicor buys analog development startup to expand mixed-signal efforts News & Analysis 4/17/2002 Post a comment MILPITAS, Calif.--Xicor Inc. today announced it has acquired privately-held Analog Integration Partners LLC, a developer of analog signal processing and data conversion circuits based in Milpitas. The purchase was completed on Tuesday for $15 million in stock and cash, said Xicor, also based in Milpitas.
Intel rolls out 1.8-V 'Wireless Flash' for 3G phones at Japan IDF meeting News & Analysis 4/17/2002 Post a comment TOKYO -- At the Intel Developer Forum (IDF) in Japan today, Intel Corp. launched 0.13-micron versions of its low-voltage, flash-memory line for third-generation (3G) cellular phones and other products. The company also rolled out new and advanced stacked chip-scale packages (CSPs) and related technologies for these flash-memory products.
TI buys echo-cancellation software unit from Ditech News & Analysis 4/16/2002 Post a comment MOUNTAIN VIEW, Calif. -- Texas Instruments Inc. today announced it has acquired the echo-cancellation software unit of Ditech Communications Corp. for $26.8 million in a move to provide communications chip customers with a complete hardware and software solution for carrier-class platforms.
ST to buy Alcatel Micro for $343 million, sell mixed-signal business to AMI News & Analysis 4/15/2002 Post a comment PARIS -- In a complex series of transactions, STMicroelectronics today announced it has agreed to acquire Alcatel Microelectronics from telecom giant Alcatel SA for 390 million euros ($343 million) in cash. But in an usual twist, STMicroelectronics turned around and announced it had also agreed to sell the mixed-signal business of Alcatel Microelectronics to AMI Semiconductor Inc. of Pocatello, Idaho.
Intel will pay Intergraph $300 million for patents in suit settlement News & Analysis 4/15/2002 Post a comment
HUNTSVILLE, Ala. -- Intergraph Corp. and Intel Corp. today announced they have agreed to bury the legal hatchet in their dispute over microprocessor patents. Under the settlement, Intel will pay Intergraph $300 million. Intergraph will transfer ownership of patents not covered by a new cross-licensing agreement in the settlement.
LSI launches 90-nm ASIC offering, expands foundry pact with TSMC News & Analysis 4/15/2002 Post a comment MILPITAS, Calif. -- In a move to enable next-generation chips with up to 1 billion transistors, LSI Logic Corp. here today announced its new ASIC and system-on-chip (SoC) product portfolio, based on 90-nm (0.09-micron) process technology. The company's "G90" product offering consists of process technology, IC building blocks, and design tools to enable development of 90-nm chip designs.
Intel offers design mock-ups for XScale-based wireless monitor devices News & Analysis 4/12/2002 Post a comment SANTA CLARA, Calif.--Intel Corp. today announced a reference design platform for a new-generation of smart displays using its XScale technology and the new Mira software set from Microsoft Corp. The XScale architecture is aimed at supporting processor performance and low-power consumption in wireless connections to Windows XP-based PCs that are linked to battery operated smart display devices in the home.
Micron plans to turn CAM devices into a volume product line News & Analysis 4/12/2002 Post a comment SAN JOSE -- Looking to alter the landscape in one networking-IC market, Micron Technology Inc. here this week outlined its strategy in the content addressable memory (CAM) arena, disclosing plans to move CAMs from their current niche status to high-volume products for a broader range of applications.
Transmeta names Cirrus executive as new CEO News & Analysis 4/10/2002 Post a comment SANTA CLARA, Calif.--Transmeta Corp. today named a former executive from Cirrus Logic Inc. as its new chief executive officer, replacing industry veteran Murray A. Goldman, who temporarily took over the CEO post last fall to help stabilize the struggling microprocessor supplier (see Oct. 16 story).
Rambus revenues slip 5% from prior quarter; legal expense fall too News & Analysis 4/10/2002 Post a comment LOS ALTOS, Calif.--Rambus Inc. today reported a slight sequential increase in net income to $6.7 million in the company's fiscal second quarter, ended March 31, compared to $6.2 million in the previous quarter. Rambus said its revenues declined 5% sequentially to $23.5 million vs. $24.9 million in the prior quarter.
ATMOS and TSMC to qualify embedded DRAM for 90-nm process News & Analysis 4/9/2002 Post a comment OTTAWA -- ATMOS Corp. here and Taiwan Semiconductor Manufacturing Co. Ltd. today announced an agreement to develop, verify and qualify embedded DRAM memory technology for 90-nm (0.09-micron) process technology. The memory will be based on the ATMOS SoC-RAM cell design technology and will be offered to foundry customers using TSMC's Nexsys 90-nm process.
Philips claims smallest IC package with improved heat dissipation News & Analysis 4/8/2002 Post a comment EINDHOVEN, the Netherlands -- Royal Philips Electronics N.V. today announced development of the world's smallest IC package, called the depopulated very-thin quad flat-pack no-lead (DQFN) package. The DQFN is 75% smaller than the existing thin shrink small-outline package (TSSOP) and has a footprint of 2.5-by-3 mm in a 14-pin configuration, Philips said.
ASIC sales to rebound slowly, rising 5% in 2002, says report News & Analysis 4/8/2002 Post a comment EL SEGUNDO, Calif. -- Applications-specific ICs, such as gate arrays and other ASIC technologies, were hit hard by the 2001 downturn causing revenues to drop 28% to $12.9 billion last year, but sales in the semi-custom chip segment are now expected to grow steadily to $21.7 billion by 2006, said a new report from iSuppli Corp.
Canada's SiGe Semi moves into fiber optics IC market News & Analysis 4/8/2002 Post a comment OTTAWA, Canada -- SiGe Semiconductor Inc. today announced its entry into the IC market for optoelectronics with the launch of two transimpedance amplifiers and an automatic gain control device for fiber-optic modules in routers, modems and cross connect systems supporting 2.5-gigabits-per-second OC-48 and STM-16 transmission rates.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Are the design challenges the same as with embedded systems, but with a little developer- and IT-skills added in? What do engineers need to know? Rick Merritt talks with two experts about the tools and best options for designing IoT devices in 2016. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.