Samsung's profits fall 30 percent News & Analysis 4/29/2011 10 comments Samsung Electronics Co. Ltd. announced revenues of 36.99 trillion won ($34.6 billion) on a consolidated basis for the first quarter, a 7 percent increase year-on-year.
Apple, Samsung gain in cell phone rankings News & Analysis 4/29/2011 7 comments Having posted a record Q1 shipment volume, South Korea's Samsung Electronics Co. Ltd. further closed the gap against market leader Nokia and extended its lead ahead of third place vendor LG Electronics, according to International Data Corp. (IDC).
On Semiconductor NBX series silicon-based crystal oscillator clocks Product News 4/29/2011 Post a comment ON Semiconductor is extending its silicon-based crystal oscillator (XO) clock module range. The six new additions to the NBX series provide a cost-effective, high accuracy reference clock solution with dual voltage capabilities and class-leading total frequency stability as low as ±20 parts per million (ppm).
Hynix' profits jump News & Analysis 4/28/2011 1 comment Hynix Semiconductor Inc. posted consolidated first quarter revenue of 2.79 trillion won ($2.6 billion), up 2 percent from the previous quarter but down 1 percent a year ago.
AMD licenses SMSC's USB chip interface News & Analysis 4/28/2011 Post a comment Advanced Micro Devices Inc. (AMD) has licensed SMSC's Inter-Chip Connectivity (ICC) technology, a low power variant of the 480 Mbit/s USB 2.0 standard geared for chip-to-chip links.
TSMC posts mixed results News & Analysis 4/28/2011 1 comment Taiwan Semiconductor Manufacturing Co. Ltd. (TSMC) reported consolidated revenue of NT$105.38 billion ($3.597 billion) in the first quarter, representing a 4.3 percent decrease from 4Q10 and a 14.3 percent increase in 1Q10.
Piezoelectric MEMS boosts vibration harvester News & Analysis 4/28/2011 14 comments Electrical engineers from the University of Michigan claim to have invented a technique for micro-machining piezoelectric MEMS that generate 10-times more energy than conventional energy harvesters.
Cadence beats Q1 estimates, promotes exec News & Analysis 4/27/2011 Post a comment Cadence Design Systems reported sales and earnings for its fiscal first quarter that exceeded consensus analyst expectations and announced the promotion of one EDA veteran to replace another that is leaving the company.
TSMC spins out solar, LED units News & Analysis 4/27/2011 1 comment Taiwan Semiconductor Manufacturing Co. Ltd. (TSMC) plans to transfer its solar and solid-state lighting businesses into two new subsidiaries.
ARM working on AMD to drop x86 News & Analysis 4/27/2011 39 comments ARM CEO Warren East says it's "perfectly natural" for ARM to try to persuade AMD to license ARM processors and use them instead of Intel's x86 architecture.
Accellera tips IP tagging standard effort News & Analysis 4/27/2011 Post a comment EDA and IP standards body Accellera launched an effort to create a standard for IP tagging—tracking soft IP information which will be automatically added and detectable in the final GDSII database format.
ST's Q1 sales come up a little short News & Analysis 4/27/2011 Post a comment European chip vendor ST Microelectronics reported first quarter sales that came in slightly below expectations, with the company saying that sales at its ST-Ericsson cell phone chip joint venture decreased more than expected.
Wi-LAN settles suits with Intel, others News & Analysis 4/26/2011 Post a comment Canada's Wi-LAN Inc. has confirmed that four litigations that were scheduled for trial in early 2011 have been dismissed as a result of agreements signed with major semiconductor and product vendors.
Broadcom down, Altera up after Q1 earnings News & Analysis 4/26/2011 Post a comment Broadcom's stock declined more than 7 percent in after hours trading after the company reported first quarter profits and second quarter guidance that disappointed analysts. Altera's shares rose despite narrowly missing consensus analysts' expectations.
Silver Lake buys Smart Modular News & Analysis 4/26/2011 Post a comment Smart Modular Technologies Inc., a manufacturer of memory modules and solid-state storage products, has entered into a definitive agreement to be acquired by Silver Lake Partners and Silver Lake Sumeru for $9.25 per share in cash. The transaction is valued at approximately $645 million.
M/A-COM buys Optomai amid suit News & Analysis 4/26/2011 1 comment M/A-COM Technology Solutions Inc. has acquired Optomai Inc., a fabless semiconductor company that develops integrated circuits and modules for next-generation 40- and 100-Gbps fiber optic networks.
Hynix sale scheduled for May News & Analysis 4/26/2011 4 comments A group of creditor banks that turned Hynix debts into shareholding back in 2001 have announced plans to sell off as early as May, their 15 percent stake in the world's second largest DRAM maker, according to reports.
Si2 to form 3-D IC standards group News & Analysis 4/26/2011 3 comments The Silicon Integration Initiative (Si2), an organization focused on the development and adoption of standards to improve IC design, is quietly forming a standards group for 3-D chips.
Apple moves to No. 1 in handset revenue News & Analysis 4/26/2011 39 comments Apple overtook Nokia to become No. 1 in revenue among the world's handset vendors during the first quarter, when Apple racked up record iPhone sales according to Strategy Analytics.
Cadence introduces latest version of Allegro News & Analysis 4/25/2011 Post a comment Cadence Design Systems introduced the latest version of its Allegro PCB and IC packaging technology, delivering new capabilities that the company says provide increases in productivity and predictability across silicon, SoC and system development.
Firm lowers MOCVD forecast News & Analysis 4/25/2011 Post a comment Investment banking firm Barclays Capital has lowered its forecast in the metal organic chemical vapor deposition (MOCVD) equipment arena.
Three indicted for PC exports to Iran News & Analysis 4/25/2011 10 comments Three individuals have been recently indicted on charges of illegally exporting millions of dollars worth of computer-related equipment from the United States to Iran via the United Arab Emirates (UAE), according to the U.S. Department of Justice.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.