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Content tagged with Semiconductors posted in April 2011
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Analysis: TI-National deal a smart use of cash
News & Analysis  
4/5/2011   7 comments
Texas Instruments, which has shied away from big acquisitions, put its cash reserves to work through its acquisition of National Semiconductor.
Upset TI slams Samsung’s foundry efforts
News & Analysis  
4/4/2011   13 comments
Texas Instruments Inc. has updated its leading-edge digital foundry strategy-and slammed Samsung Electronics Co. Ltd.’s foundry efforts in the process.
VLSI: IC billings down, units up
News & Analysis  
4/4/2011   3 comments
The IC supply chain appears to be stable following the recent earthquake in Japan, according to VLSI Research Inc.'s Semiconductor Analytics report.
TI to buy National Semi for $6.5 billion
News & Analysis  
4/4/2011   43 comments
Texas Instruments said it signed a definitive merger agreement to acquire National Semiconductor. for $6.5 billion in cash.
Why did AMD-GF ink new wafer deal?
News & Analysis  
4/4/2011   3 comments
Why did Advanced Micro Devices Inc. forge a new and complex amendment to its wafer-supply agreement with Globalfoundries Inc. (GF)?
Plessey PS13004 operational amplifier drives 65mA, draws supply current of 3.3mA
Product News  
4/4/2011   Post a comment
Plessey Semiconductors today announced the availability of samples of its PS13000 series current feedback operational amplifiers. The first parts to be offered are quad-configuration devices, with four identical amplifiers on a single chip, supplied in 14-pin small outline, miniature plastic packages (SO-14).
Lattice MachXO2 *Do-It-All* PLDs in production
Product News  
4/4/2011   1 comment
Hurray! I just heard that the first member of the MachXO2 *Do-it-All* PLD family has been fully qualified and is shipping in production.
Lattice FPGA bridge allows any image signal processor to I/F with HiSPi CMOS sensors
Product News  
4/4/2011   1 comment
New LatticeXP2 HiSPi bridge reference design allows any Image Signal Processor (ISP) with a traditional CMOS parallel bus to interface with an Aptina HiSPi CMOS sensor.
Industry’s first HD wide dynamic range video surveillance chipset from Altera (and friends)
Product News  
4/4/2011   1 comment
I remember the not-so-distant past when the images from surveillance cameras were just about as low quality as could be achieved, but that’s certainly not the case anymore…
OmniVision buys Kodak patents
News & Analysis  
4/4/2011   1 comment
OmniVision Technologies Inc., a supplier of CMOS image sensors, announced the purchase of approximately 850 image sensor-related patents and patent applications from Eastman Kodak Co. for $65.0 million in a cash transaction.
Gartner: Fab tool revenue grew 143% in 2010
News & Analysis  
4/4/2011   Post a comment
Worldwide semiconductor equipment sales grew 143 percent in 2010 to nearly $41 billion as the market recovered from the industry slowdown of the previous two years, according market research firm Gartner.
GSI: Hit by Cypress suit
News & Analysis  
4/4/2011   2 comments
GSI Technology Inc. said on March 30, 2011, Cypress Semiconductor filed suit against GSI in the U.S. District Court for the District of Minnesota.
New low-cost VaultIC100 chip from INSIDE Secure protects from counterfeiters and cloners
Product News  
4/4/2011   1 comment
The folks at INSIDE Secure, who specialize in semiconductor solutions for secure transactions and digital identity, have introduced a teeny-tiny turnkey security chip.
Global averaged chip sales dip in February
News & Analysis  
4/4/2011   7 comments
The three-month average of worldwide sales of semiconductors was $25.19 billion for the month of February 2011, a decline of 1.1 percent from the prior month when averaged sales were $25.52 billion, according to the Semiconductor Industry Association (SIA).
E-field sensing startup raises $4 million
News & Analysis  
4/4/2011   3 comments
Ident Technology AG, a developer of proximity sensing and gesture recognition ICs, has received 2.9 million euro (about $4.1 million) to fund the development of its GestIC three-dimensional (3-D) gesture control chip using a fabless semiconductor business model.
Hynix announces DDR4 DRAM and module
Product News  
4/4/2011   2 comments
Hynix Semiconductor Inc. has announced that it has developed a 2-Gbit DDR4 DRAM IC and 2-Gbyte memory module based on the IC. The IC has been implanted using a 30-nm class (somewhere between 30 and 39-nm) manufacturing process technology.
UK startup unveils LTE transceiver IC
News & Analysis  
4/4/2011   1 comment
Genasic Design Systems Ltd., a privately-held RF design company formed in 2009, has announced the availability of its first chip, a 65-nm CMOS transceiver IC for HSPA and LTE applications.
Globalfoundries joins IMEC's CMOS club
News & Analysis  
4/4/2011   1 comment
Abu Dhabi owned foundry chipmaker Globalfoundries Inc. has signed a "strategic, long-term" partnership with European research institute IMEC on sub-22nm CMOS scaling and GaN-on-Si technology.
Tower offers $140 million for Micron fab
News & Analysis  
4/4/2011   6 comments
Tower Semiconductor Ltd., a specialty foundry chipmaker which trades under the name TowerJazz, has announced it is proposing to buy a wafer fab belonging to Micron Technology Inc. in Nishiwaki City, Hyogo prefecture, Japan, for $140 million.
Digi-Key drops printed catalog to become solely Internet-based
News & Analysis  
4/3/2011   10 comments
In an unprecedented industry move, electronics component distributor Digi-Key Corporation announced that it will immediately cease all print versions of its product catalog and TechZone Magazine, offering this content exclusively online.
Ultra-low-power technology group focuses on energy-efficient applications
News & Analysis  
4/3/2011   1 comment
STMicroelectronics has demonstrated a next-generation variation of its smart power technology, which is expected to enable significant reductions in the power consumption of a wide range of electronic systems – from new medical equipment to battery chargers in hybrid electric vehicles.
Casio G-SHOCK features Bluetooth low energy
News & Analysis  
4/3/2011   2 comments
Casio has revealed a Bluetooth LE watch that employs Nordic µBlue nRF8001 single-chip-connectivity to wirelessly link to smartphones, enabling incoming call, email and SMS alert notifications, and a Finder Function that enables users to locate a misplaced phone.
Media processor SoC for multimedia display products
Product News  
4/3/2011   Post a comment
Conexant Systems announced a single-chip media processor for multimedia display products including connected Web devices and interactive video displays, and applications such as digital signage, home automation/security, and user interface (UI) control.
Wireless modules combine WLAN, Bluetooth, FM and GPS functionality
Product News  
4/3/2011   Post a comment
Jorjin Technologies launched three wireless modules based on Texas Instruments' WiLink IC solutions.
Momentum builds for 3-D chips
News & Analysis  
4/2/2011   26 comments
Many wonder if mainstream 3-D chips based on through-silicon-via (TSV) technology is feasible-or will even fly-amid ongoing problems in the arena.
Do parts from Japan pose radiation risk?
News & Analysis  
4/1/2011   15 comments
Questions have arisen about contamination and radiation levels of electronics parts from Japan, though no dangerous radiation levels have been detected in any cargo, according to a trade group.
Atomic superconductor one-ups squid
News & Analysis  
4/1/2011   6 comments
Circulating ultra-cold atoms around a ring exhibits superfluidity—the atomic version of superconductivity—potentially enabling sensors capable of tracking rotational motion in gyroscopes of unparalleled accuracy, according to the National Institute of Standards and Technology and Technology.
IHS: Chip revenue dipped in fourth quarter
News & Analysis  
4/1/2011   1 comment
Global semiconductor revenue in the fourth quarter of 2010 dipped by 3.7 percent compared with the previous quarter, the first sequential decline in chip revenue since the first quarter of 2009, according to market research firm IHS iSuppli.
Hynix agrees six-year patent deal with Mosaid
News & Analysis  
4/1/2011   Post a comment
Memory and wireless patent holder Mosaid Technologies Inc. has said that Hynix Semiconductor Inc. has agreed to take a six-year license to Mosaid's patents, with fixed equal quarterly payments over the term.
Bluespec working to eliminate the industrialized world’s dependence on oil
News & Analysis  
4/1/2011   4 comments
Soon to be *Previously known as ‘The Synthesizable Modeling Company’* Bluespec redeploys its engineers to work on a ‘Promising’ solution.
Xilinx buys optical transport chip vendor
News & Analysis  
4/1/2011   2 comments
FPGA vendor Xilinx Inc. has acquired Omiino Ltd. a Belfast telecommunications startup for an undisclosed amount, according to local reports. Xilinx follows AppliedMicro and Altera as an acquirer of companies that developed optical transport IP and implemented it in FPGAs.
Android remains processor neutral, says MIPS
News & Analysis  
4/1/2011   5 comments
Processor intellectual property licensor MIPS Technologies Inc. is fully involved in Android antifragmentation efforts and is one of many companies invited to participate by Google, according to Art Swift, vice president of business development and marketing at MIPS.
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What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.

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