TriQuint Semi cuts jobs News & Analysis 4/30/2012 Post a comment TriQuint Semiconductor cut about 70 jobs in Florida and plans to also cut jobs in Costa Rica as part of a plan to restructure the company's SAW filter manufacturing operations.
Huawei to give Intel LTE development support in China News & Analysis 4/30/2012 4 comments Intel's aspirations selling chips for mobile equipment have received a boost with the news that Huawei has agreed to work with Intel on the testing and rapid deployment of the time division duplex format applied to Long Term Evolution standard.
2012 chip market to grow 7%, says analyst News & Analysis 4/30/2012 1 comment Growth in the semiconductor market will accelerate in the second half of 2012 and achieve an annual percentage figure of 6 to 7 percent, according to Mali Venkatesan, research manager for semiconductors at International Data Corp.
PolyCore upgrades multicore development tool Product News 4/29/2012 3 comments PolyCore Software Inc. (Burlingame, Calif.) has upgraded its Poly-Platform tool to version 2.0 with the inclusion of Poly-Mapper which provides control of memory used for messaging in multi-core software.
LSI, Xilinx, Cadence beat estimates News & Analysis 4/26/2012 2 comments Chip vendors LSI and Xilinx and design automation software provider Cadence Design Systems reported quarterly results that exceeded analysts' expectations and offered guidance that was also better than expected.
Broadcom aims to spread 100-Gbit Ethernet with single-chip solution Product News 4/25/2012 7 comments Broadcom announced its fourth-generation Ethernet network processor, which it claims is the industry's first chip to use massive parallelism by virtue of its 64 packet-processing cores running at one gigahertz. Providing full-duplex 100Gbit per second performance, it can also be configured to provide a dozen 10-Gbit channels.
Tensilica aims at Chinese audio News & Analysis 4/24/2012 2 comments Tensilica is banking its future growth on the world's largest electronics market by adding support for China's Dynamic Resolution Adaptation standard to its entire library of over 100 audio encoders, decoders, an sound enhancement chips for adding high-fidelity audio digital signal processors to mobile handsets.
ST-Ericsson rescue plan underwhelms News & Analysis 4/24/2012 4 comments The plan put together to try and transform the fortunes of struggling mobile chip company ST-Ericsson NV by CEO Didier Lamouche, announced Monday (April 23), at one level makes a kind of sense but also looks like the last throw of the dice by an unlucky gambler.
Startup claims 'Holy Grail' of SoC design News & Analysis 4/23/2012 23 comments Startup Algotochip claims to have achieved the Holy Grail of chip design: the ability to create complete system-on-chip designs from a C-code specification and test stimulus vectors in eight to 16 weeks.
Equipment book-to-bill ratios diverge in U.S., Japan News & Analysis 4/23/2012 Post a comment The three-month rolling average book-to-bill ratio for North America-based semiconductor capital equipment vendors improved for the sixth straight month in March, while the ratio for Japanese vendors declined for the third straight month, according to trade groups.
Battle-hardened veterans of the electronics industry have heard of the “connected car” so often that they assume it’s a done deal. But do we really know what it takes to get a car connected and what its future entails? Join EE Times editor Junko Yoshida as she moderates a panel of movers and shakers in the connected car business. Executives from Cisco, Siemens and NXP will share ideas, plans and hopes for connected cars and their future. After the first 30 minutes of the radio show, our listeners will have the opportunity to ask questions via live online chat.