Intel's new Itanium 2 gets 0.13 treatment News & Analysis 6/30/2003 Post a comment Intel Corp. today will commence shipping its first Itanium 2 processor to be made in the company's 0.13-micron process technology. Called Madison, the chip hits 1.5GHz speeds and integrates a whopping 6Mbytes of Level 3 cache.
IR to offer entire product line in die form News & Analysis 6/30/2003 Post a comment International Rectifier Corp. last week moved to increase revenue by offering to make all its power management ICs and discrete products available to customers in die form. A dedicated business group will support the new program.
Hynix exercises modesty before ITC News & Analysis 6/30/2003 Post a comment Two weeks ago, Hynix Semiconductor Inc. was touting its 512Mbit DDR400 as the first such memory chip to win validation from Intel Corp. However, last week in a turnaround, Hynix was telling the U.S. International Trade Commission that it was "further behind in technology" than any of its three major DRAM rivals.
Chips sales higher as SARS effects wane News & Analysis 6/29/2003 Post a comment The global semiconductor market grew 10% in May from the year-ago month as the Asia-Pacific market began shaking off the disruptive effects of the SARS virus, which curtailed sales in the prior months.
Microstepper chip handles autocruise Product News 6/27/2003 Post a comment AMI Semiconductor's AMIS-30621 is a microstepping motor driver for remote and multiple-axis positioning applications such as those involved in automotive headlamp leveling and swiveling, cruise control and idle control.
Full-bridge driver tuned for auto apps Product News 6/27/2003 Post a comment Targeting automotive and industrial markets, Allegro Microsystems Inc.'s A3940 predriver IC for large-brush dc motors provides four high-current gate-drive outputs capable of driving a wide range of n-channel power MOSFETs.
Advanced DSP Supports Home Theater and Surround-Sound Audio: Part 1 News & Analysis 6/27/2003 Post a comment All home theater systems depend on some form of DSP to increase fidelity, expand the number of audio channels, and enhance the "you-are-there" experience of DVD movies and audio. Analog Devices' engineers explain the decoding algorithms the processor must handle in part one of this two-part tutorial.
Lattice Spins 10-Gbit Transceiver Chip News & Analysis 6/25/2003 Post a comment Lattice Semiconductor Corp. this week will unwrap a transceiver chip that moves data at 10 Gbits/second, considered the luxury class among off-the-shelf
transceivers. Lattice becomes the second programmable-logic vendor, after Xilinx Inc., to move into standalone serializer/deserializer transceivers as a way to gain
sockets in networking equipment.
Analog Devices makes wireless play News & Analysis 6/23/2003 Post a comment Analog Devices Inc. last week rolled out new versions of its TigerSharc DSPs that it said combine the raw performance and embedded memory necessary to build the "first true software-defined radio" for wireless basestation applications.
Altera drives deeper into ASIC turf News & Analysis 6/23/2003 Post a comment Altera Corp. appears to be issuing its biggest challenge yet to ASIC manufacturers by enabling customers to convert the company's Stratix FPGAs into mask-programmed ASICs through its HardCopy program. Altera's move is intended to further highlight and take advantage of the cost and time-to-market differences between FPGAs and ASICs.
DRAM market to be little affected by Hynix duty News & Analysis 6/23/2003 Post a comment The decision last week by the U.S. Commerce Department to levy a 44.71% countervailing duty against DRAM imported into the United States by Hynix Semiconductor Inc. is expected to have minimal impact on the DRAM market at large, according to analysts.
Product Focus: A/D Converters News & Analysis 6/21/2003 Post a comment Facing customer pressure to reduce board space requirements and improve
performance, makers of analog-to-digital converters are integrating
signal-conditioning functionality into their products in hopes of furthering both objectives. Analog Devices, Linear Technology, Maxim Integrated Products, National Semiconductor and Texas Instruments are among those offering A/Ds that tout signal quality, hand customers the ability to control signal parameters or both.
ADI Boosts DSP Performance Product News 6/19/2003 Post a comment The new generation of TigerSHARC processors is said to have the industry's highest performance per dollar, per watt or per square inch of board space.
IP Cores Crowd SoCs News & Analysis 6/19/2003 Post a comment The growing trend toward putting several processor cores on the same chip is enabled by the expanded transistor budgets of 0.18-and 0.13-micron processes. Fueling this drive is the attractiveness of using standard, already-validated
processor intellectual property (IP) and easily alterable software in place of application-specific hardware. The trend can be spotted in a number of technical
papers to be delivered at this week's Embedded Processor Forum in San Jose.
Regulator, contoller ICs extend comms Product News 6/19/2003 Post a comment National Semiconductor Corp. has designed its LM5000 high-input-voltage regulator and LM5030 current-mode PWM controller in analog bipolar CMOS DMOS (ABCD) technology for next-generation communications system requirements.
High-k Oxides Knock at Metal Gate News & Analysis 6/16/2003 Post a comment The shift to metal gate electrodes may need to take place in tandem with the introduction of high-k insulators, Motorola Inc. researchers argue. The team made its case at the 2003 Symposium on VLSI Technology, in Kyoto, Japan.
IBM-Infineon Team Discloses MRAM at VLSI Symposium News & Analysis 6/16/2003 Post a comment Magneto-resistive random access memory (MRAM) technology continues to pick up critical momentum, with the MRAM Alliance between IBM and Infineon Technologies announcing prototype MRAM arrays at the 2003 Symposium on VLSI Technology.
Motorola names Anderson president of chip unit News & Analysis 6/16/2003 Post a comment Motorola Inc. today announced the appointment of Scott Anderson as head of its Semiconductor Products Sector, moving swiftly to replace outgoing SPS president Fred Shlapak in a bid to allay concerns about the fortunes of its chip business.
Top semiconductor companies News & Analysis 6/16/2003 Post a comment Cost-cutting measures taken in 2002 to buttress semiconductor companies' sliding profits became evident in the year's rankings, as players exited flagging or noncore product lines, or combined efforts to share research and development and manufacturing resources.
ICs manage power of Moto Quicc processor Product News 6/12/2003 Post a comment Motorola Inc. will come out of the gate this month with two ICs that manage the power capabilities of its Quicc I and II processors, which are popular processors in telecom, networking, cable modem and asymmetric digital subscriber line equipment designs.
TI lowers 2Q forecast, lays off more workers News & Analysis 6/11/2003 Post a comment Texas Instruments Inc. is cutting an additional 250 semiconductor manufacturing jobs in Japan and now sees second quarter revenue falling shy of its previous estimate due to weaker than expected demand from wireless handset manufacturers.
ESS buys Pictos for $27 million News & Analysis 6/10/2003 Post a comment ESS Technology Inc. has acquired Pictos Technologies Inc. for $27 million to strengthen its presence in the consumer electronics market, especially in the digital imaging semiconductor sector.
Vitesse to buy distressed Multilink News & Analysis 6/10/2003 Post a comment Vitesse Semiconductor Corp. said it has agreed to pay approximately $23 million for struggling Multilink Technology Corp., in a sign that suppliers to the sluggish communications equipment market continue to struggle for survival.
ASIC suppliers say business starting to return News & Analysis 6/9/2003 Post a comment When telecommunications system vendor Calix set out to design its linecard platform for network-edge DSLAMs, the company determined that using an ASIC was the only way it could squeeze multiple service functions into the tight space the application required.
TSMC alters ties with spinoff Vanguard Int'l News & Analysis 6/9/2003 Post a comment Last week's exodus of Taiwan Semiconductor Manufacturing Co. Ltd. executives from the board of Vanguard International Semiconductor Corp.--most notably TSMC chairman Morris Chang--appears to be more cosmetic than a genuine effort to allow Vanguard to stand on its own.
Elpida aims cash at new capacity News & Analysis 6/9/2003 Post a comment Elpida Memory Inc. last week moved to reverse its declining global DRAM market share by arranging $687 million in investments to expand capacity at its 300mm-wafer fab in Hiroshima, Japan.
Power Management Chip Vendors Zero in on Wireless News & Analysis 6/3/2003 Post a comment Power-managing ICs in wireless products are now playing a major role in system-level solutions. Cell phones, which are being combined with PDAs and cameras, are becoming increasingly small, dense and power-hungry, offsetting the size and energy density advances made by the lithium-ion battery sources powering them.
SST to climb NOR flash density ladder News & Analysis 6/2/2003 Post a comment Having established itself as the leading flash memory supplier at 8Mbits and below, Silicon Storage Technology Inc. is seeking to expand its market by plying its small cell size on what it calls the "sweet spot" of high-density NOR flash: 16 to 64Mbits.
The move will allow SST to gain entry to set-top boxes and low-end handsets, as well as deepen its penetration in digital consumer electronics, network equipment, PC BIOS, and graphics cards, said Jason Feinsmith, business director at SST's Stand
National enhances online tool suite News & Analysis 6/2/2003 Post a comment National Semiconductor Corp. today is launching an online enhanced suite of product selection and design tools for its analog chips, betting that easing procurement and time-to-market for its customers will improve sales.
Battle-hardened veterans of the electronics industry have heard of the “connected car” so often that they assume it’s a done deal. But do we really know what it takes to get a car connected and what its future entails? Join EE Times editor Junko Yoshida as she moderates a panel of movers and shakers in the connected car business. Executives from Cisco, Siemens and NXP will share ideas, plans and hopes for connected cars and their future. After the first 30 minutes of the radio show, our listeners will have the opportunity to ask questions via live online chat.