TI tools simplify DaVinci development Product News 6/6/2006 Post a comment Trying to push its DaVinci video platform into yet more applications, Texas Instruments has develop and will make available in the third quarter of this year an enhanced software development kit based on the DSP-enabled technology.
Micron touts Managed NAND flash pack for mobile handsets Product News 6/5/2006 Post a comment The newest offering in Micron Technology’s embedded product line is its Managed NAND flash unit for feature-rich mobile handsets and other portable devices. Combining the company’s NAND flash memory with a high-speed multimedia card (MMC) controller in a package is said to streamline a manufacturer's mobile design process and simplify NAND flash procurement logistics.
Philips' Nexperia to power Cyberhome's PMPs Product News 6/5/2006 Post a comment Philips Electronics has won a significant order for the latest version of its Nexperia mobile multimedia processor, which is set to power portable media players being launched at this week’s Computex trade fair in Taipei, Taiwan by Cyberhome.
Artimi shifts ultrawideband sales effort to Asia News & Analysis 6/5/2006 Post a comment Cambridge, England based Ultrawideband chip specialist Artimi has moved its worldwide sales headquarters to Taipei, Taiwan, believing that Asia will be a key market for its single chip devices targeting Certified Wireless USB and Bluetooth applications.
Neah migrating fuel cell process to 200-mm News & Analysis 6/2/2006 Post a comment Micro fuel-cell developer Neah Power Systems announced plans to expand the research and development of its patented porous silicon-based direct methanol fuel cell to include 200-mm wafers. The company's current process primarily uses 100-mm wafers.
Micron ups the ante in Lexar bid News & Analysis 6/2/2006 Post a comment Semiconductor memory supplier Micron Technology has upped the ante in its bid to acquire flash-memory card supplier Lexar Media, saying it would offer more shares of its common stock to buy the company.
Court rules against IXYS subsidiary in contract suit News & Analysis 6/2/2006 Post a comment Semiconductor supplier IXYS Corp. announced that the Superior Court of Norfolk County in Massachusetts has awarded wireless tracking system provider LoJack Corp. damages amounting to $36.7 million, in its breach of contract suit against Clare Inc., a subsidiary of IXYS.
Fuel gauge's suspend mode extends battery life Product News 6/2/2006 Post a comment Dallas Semiconductor's DS2756 battery fuel gauge for wireless devices includes a power-saving 'suspend' mode that allows the chip to optimize its own current drain while other devices in the host enter low-power inactive states.
Report: Deloitte knew of Micrel stock options deal News & Analysis 6/1/2006 Post a comment Mixed-signal chip supplier Micrel Inc. alleges in a lawsuit that Deloitte & Touche LLP, its former auditor, signed off on stock options that were granted in a similar way to the stock options practices now under investigation, according to a Wall Street Journal report.
Vitesse sued by shareholders News & Analysis 6/1/2006 Post a comment Shareholders of Vitesse Semiconductor Corp. have filed suit against the company, alleging the company misstated its finances, including the dating of executive stock option grants.
Europe to crack down on chip tax fraud News & Analysis 6/1/2006 Post a comment The European Commission has laid out plans to combat a specific tax fraud that it says is costing hundreds of billions of Euros a year and is having a major impact on many industries, especially those susceptible to the fraud, such as semiconductors and mobile phones.
Micron, Hynix e-mails indicate price fixing News & Analysis 6/1/2006 Post a comment The global price-fixing conspiracy among memory suppliers took another twist when several online reports said Micron Technology Inc. and Hynix Semiconductor Inc. exchanged e-mails that suggest the companies colluded to fix memory chip prices in an effort to hurt Rambus Inc.
Battle-hardened veterans of the electronics industry have heard of the “connected car” so often that they assume it’s a done deal. But do we really know what it takes to get a car connected and what its future entails? Join EE Times editor Junko Yoshida as she moderates a panel of movers and shakers in the connected car business. Executives from Cisco, Siemens and NXP will share ideas, plans and hopes for connected cars and their future. After the first 30 minutes of the radio show, our listeners will have the opportunity to ask questions via live online chat.