8-bit MCU features dual bus design for complex multi-chip A/V subsystem control Product News 6/30/2008 1 comment Its dual SMBus feature, small form factor and support for a wide range of operating voltages make the SST89C58RC MCU an ideal solution for numerous applications, including HDMI, HDTVs, A/V receivers, home appliances, industrial instruments, notebook PCs, DVD players, Blu-ray players, RF modules and security applications such as fingerprint identification.
Opinion: ST-NXP Wireless needs a new name News & Analysis 6/30/2008 3 comments ST-NXP Wireless, the new communications IC joint venture floated by STMicroelectronics NV and NXP BV, is starting life with a name that confuses its identity with those of the parent companies. Even before the ink dries up on its birth certificate, CEO Alain Dutheil should consider changing the name.
Are IC thermal problems hot air, question panelists News & Analysis 6/30/2008 Post a comment At the Design Automation Conference mid-June in Anaheim, California, an educational panel addressed the thermal issue in integrated circuit (IC) design. Two key questions were raised: When will this issue be emerging as a crucial concern if at all? What are the solutions to solve this potential crisis?
Europe again lags in chip sales for May '08 News & Analysis 6/30/2008 Post a comment Europe was again the laggard in semiconductor growth in May, with the WSTS figures showing it fared worst in both the three month moving average and year-to-year calculations compared to other regions, and that it showed the largest decline, of 0.3 percent, for sales between April and May 2008.
Chip sales increased 7.5% in May, says SIA News & Analysis 6/30/2008 Post a comment The three month moving average of global chip sales was $21.8 billion in May, 7.5 percent up on the $20.3 billion reported for May 2007, according to the Semiconductor Industry Association (SIA) and based on figures from WSTS.
Sony Ericsson posts another profits warning News & Analysis 6/27/2008 Post a comment A profit warning from Sony Ericsson sent the share price of most mobile phone makers lower as the joint venture between Sony and Ericsson said second-quarter sales and net income would be hit by slowing demand for mid- to high-end models, and that it would only break even for the quarter.
Global chip sales seen 7% up in May News & Analysis 6/27/2008 Post a comment The three-month moving average of global chip sales is estimated to have come in at $21.7 billion in May, up a healthy 7 percent on the $20.3 billion achieved in May 2007, according to Bruce Diesen, analyst at Carnegie Research.
Autodesk ends interest in bid for Flomerics News & Analysis 6/27/2008 Post a comment Autodesk will not pursue its interest in simulation software group Flomerics (Hampton Court, England) leaving the field clear again for Mentor Graphics, who has a 29 percent stake in the British company and who has made several bids to take control.
Infineon gives Bauer CEO title, axing "spokesman" designation News & Analysis 6/27/2008 Post a comment Infineon Technologies AG has quietly restored the title of chief executive officer to its top executive, dropping the ponderous designation of "spokesman of the management board" it gave Peter Bauer in May when he replaced Wolfgang Ziebart at the helms of the German semiconductor company.
Coming (not too) soon: wireless set-top boxes News & Analysis 6/27/2008 Post a comment Wireless is coming to the cable TV set-top box, but just which wireless and when is still not clear, said a Cox Communications executive after a panel on wireless video networking at the Connections conference.
Video: 60 GHz, Wi-Fi, UWB face off at panel Product News 6/27/2008 Post a comment Competing approaches to delivering high quality video in the digital home faced off in a panel discussion at the Connections conference where representatives of Wi-Fi, ultrawideband and 60 GHz radios were clearly gunning for similar design wins in TVs, routers, set-top boxes, Blu-Ray drives and other devices.
Safe bet: tire pressure sensors Teardown 6/26/2008 Post a comment One of Portelligent's analysts had the presence of mind to gather up the damaged tire pressure monitor (TPM) from his Toyota during a recent service center visit.
Extreme design: SuitSat pushes engineers' limits Teardown 6/26/2008 1 comment When engineers from Microchip Technology took a routine microcontroller inquiry, little did they know they'd be embarking on a multiyear space mission that would challenge every aspect of their earthbound engineering experience, while reconnecting them with the excitement and sense of exploration that led them to choose engineering to begin with.
Quatech ships embedded 802.11 radios Product News 6/26/2008 Post a comment The Airborne Embedded 802.11b/g radio module is Quatech's first SDIO/SPI host interface product and the latest addition to Quatech's advanced line of radios for reliable and high performing M2M communication.
Lower costs, higher profits for Apple with 3G iPhone News & Analysis 6/26/2008 Post a comment A preliminary guesstimate by market research group iSuppli suggests the Bill of Materials (BOM) and assembly costs of the latest 8Gbyte 3G iPhone from Apple will be $173, making the device one of the most profitable ever for the company.
AMD delivers TeraFLOPS graphics chip Product News 6/25/2008 Post a comment AMD says it has achieved two firsts in visual computing: the launch of the first teraFLOPS graphics card, the ATI Radeon HD 4850, and the first graphics card featuring ultra high bandwidth GDDR5 memory, the ATI Radeon HD 4870.
Low-power Mobile SDRAM line debuts Product News 6/25/2008 Post a comment ISSI's first members of its PowerSaver Mobile SDRAM family include 128-Mbit, 256-Mbit and 512-Mbit Mobile SDRAMs offered in x8, x16, and x32 configurations in cost-effective TSOPII packages as well as space-saving BGA packages.
IBM, Zurich university build joint nanotech lab News & Analysis 6/25/2008 Post a comment IBM and the ETH Zürich University have agreed to jointly build a laboratory for nanotechnology research. The research activities aim at technologies for the post-CMOS era such as carbon-based materials, nano photonics, spintronics, nanowires and tribology.
AMD taps Ghilardi to head EMEA region News & Analysis 6/25/2008 Post a comment Advanced Micro Devices Inc. has named Emilio Ghilardi senior vice president and general manager of Europe, Middle East and Africa, or EMEA, reporting to Gustavo Arenas, the chip group’s chief sales officer.
Nokia builds open mobile software foundation News & Analysis 6/24/2008 Post a comment Epoch making. Unprecedented. Setting mobile software free. These were just some of the typical superlatives used by the senior executives from Symbian, Nokia, Sony-Ericsson, Motorola, Texas Instruments, ST Microelectronics, Vodafone and others at the London conference where Nokia et al put some flesh on the announcement that the Finnish phone maker would pay about $410 million for the 52 percent of Symbian Ltd it does not already own, and thus ease the way to creating the Foundation that will de
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.