Forum planned on 40/100G Ethernet News & Analysis 6/30/2009 Post a comment The Ethernet Alliance will host a one-day forum in Silicon Valley on the changes coming with the 40 and 100 Gbit/second versions of the IEEE P802.3ba standard now in the works.
Micron puts 34-nm NAND chips in mass production News & Analysis 6/30/2009 Post a comment Micron Technology announced mass production of NAND flash memory chips using 34-nanometer (nm) process technology. Micron also said its subsidiary, consumer memory product provider Lexar Media, would deliver flash memory cards and USB flash drives based on the 34-nm devices.
Broadcom jacks up Emulex offer 19%, drops lawsuit News & Analysis 6/30/2009 Post a comment Broadcom Corp. has increased its offer for Emulex Corp. 20 percent, raising the value of the deal to $912 million, and has also dropped a lawsuit against the board of directors in a bid to engage the management in a friendly takeover discussion.
Jobs go but new processors coming at ARC Product News 6/30/2009 Post a comment ARC International (St Albans, England) is to lay off 35 employees and close several of its locations in a major restructuring that sees the licensor of multimedia IP cores reduced to 115 direct staff, excluding its Adaptive Chips joint venture in India. The company also revealed it is readying a new processing range that will be launched in November.
Altera rolls low power, anti-tamper FPGAs Product News 6/29/2009 Post a comment Altera this week is rolling out a new product family, Cyclone III LS, billed by the company as the industry's first low power FPGAs with anti-tamper, design-security and design-separation features.
Semico projects five-fold netbook growth News & Analysis 6/29/2009 Post a comment As many as 59 million netbooks will ship in 2013, nearly 22 percent of the mobile PC market and up almost five-fold from 2008, according to a new report by Semico Research that profiles the major chip contenders in the sector.
Stantum, Sitronix team for multi-touch controllers News & Analysis 6/29/2009 Post a comment Stantum Technologies, the French multi-touch sensing technologies specialist, has teamed with Taiwanese group Sitronix (Hsinchu), which focuses on LCD driver and SoC design, to develop voltage matrix multi-touch single-chip solutions.
Siemens platform addresses Hi-Mix Low-Volume production News & Analysis 6/29/2009 Post a comment After several months of field testing, Siemens Electronics Assembly Systems GmbH (Munich) has launched sales for its Siplace SX component insertion machine platform. With a high degree of flexibility, the platform particularly addresses production environments characterized by frequent product changes and low volumes.
SMSC to outsource test operations News & Analysis 6/25/2009 Post a comment Chip vendor SMSC said it plans to outsource some of its production test operations to Asian suppliers. The affected operations are currently handled in New York State.
Analyst: Intel eyes cellphone apps processor market News & Analysis 6/25/2009 Post a comment Intel is coveting the $1.3 billion cellphone application processor market for its future versions of Atom, according to Will Strauss, president and principal analyst at Forward Concepts, in a soon-to-be-published report on the handsets and chip market.
Gigle powers ahead in Belkin adapters News & Analysis 6/25/2009 Post a comment Gigle Semiconductor (Barcelona, Spain and Edinburgh, Scotland) has revealed that its GGL541 home-networking chip drives the Gigabit Powerline Networking Adapters being launched by network router specialist Belkin.
XMOS fosters its first fabless client companies News & Analysis 6/24/2009 Post a comment James Foster, CEO of XMOS, has said the first partner company, enabled by the XMOS event-driven processor, is selling chips under its own brand and package labeling. Other XMOS client companies are moving to market rapidly, Foster said.
Analysis: Intel, Nokia deal: Where's the beef? News & Analysis 6/23/2009 Post a comment The agreement between Intel Corp. and Nokia Corp. to collaborate in the development of new mobile communication chipsets, OEM hardware and software offered limited information about how such an alliance would work and the products that would result from it, indicating the ongoing PC-mobile handset convergence is still taking shape with winners and losers yet to be clearly determined.
Intel, Nokia team up for opportunities in PC-mobile convergence News & Analysis 6/23/2009 Post a comment Intel Corp. and Nokia Corp. have announced an agreement to collaborate in the development of next-generation mobile computing devices that the companies said would go beyond the current generation of products as they fight to maintain dominance in their respective market segments.
Gartner warns of slow recovery in electronics News & Analysis 6/23/2009 Post a comment Electronic equipment markets are predicted to start picking up in the fourth quarter of 2009 and lead to a sustainable recovery in the second half of next year, according to market research group Gartner Inc.
Companies demo 'mass market' femtocell platform News & Analysis 6/23/2009 Post a comment Femtocell pioneer Ubiquisys (Swindon, England) is demonstrating for the first time at this week at the Femtocells World Summit staged here in London its latest 3G basestation, which is based on the Aquilo baseband chipset from Percello (Ra’anana, Israel).
Rambus lowers revenue target News & Analysis 6/23/2009 Post a comment Memory technology licensor Rambus lowered its revenue target for the quarter ending June 30, saying it now expects sales of between $26.7 million and $27.2 million.
SanDisk files suit against LSI News & Analysis 6/22/2009 Post a comment SanDisk has filed a complaint against LSI asking for a declaratory judgment of non-infringement of several patents held by that company. The complaint, filed in U.S. District Court, also alleges libel against LSI and requests damages.
Silicon startups get the squeeze News & Analysis 6/22/2009 6 comments Top venture capitalists say opportunities are changing and narrowing for semiconductor startups because the costs of bringing a new processor or system-on-chip to market are becoming prohibitive and raising new funds to invest in high tech companies of any kind is getting increasingly difficult.
Marvell lifts sales target on improved demand News & Analysis 6/22/2009 Post a comment Citing broad improvement in demand within multiple end-markets, Marvell Technology Group increased its revenue target for its second fiscal quarter, saying it now expects sales to be between $600 million and $630 million.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Are the design challenges the same as with embedded systems, but with a little developer- and IT-skills added in? What do engineers need to know? Rick Merritt talks with two experts about the tools and best options for designing IoT devices in 2016. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.