Intel invests in Ozmo News & Analysis 6/7/2010 Post a comment Ozmo Devices Inc. (Palo Alto, Calif.), a provider of low-power Wi-Fi personal area network (Wi-Fi PAN) solutions, has completed its series D funding round in the amount of $10.8 million.
Chip processes gesture recognition for innovative HMIs Product News 6/7/2010 Post a comment Gesture recognition is not only a technology for computer games and mobile devices – it increasingly is also an option for innovative automotive human-machine interfaces. Chip maker Elmos AG now has implemented the respective signal processing within one chip.
RF chips use 10x less power than Bluetooth, Zigbee News & Analysis 6/7/2010 3 comments Europe's Imec research group plans to produce before the end of the year a short range RF transceiver ten times more power efficient than today's Bluetooth and Zigbee chips and demonstrated discrete blocks capable of sending 1,024 Kbytes/second over five meters while consuming less than one milliwatt.
Focusing on automotive, Micronas gains momentum News & Analysis 6/7/2010 Post a comment Semiconductor manufacturer Micronas has left a difficult year behind: In 2009, the company was forced to shut down its core business of image signal processing chips for TV sets. EE Times Europe asked the new CEO Matthias Bopp if, and how, the company has digested the surgery.
Software drives mesh nets for smart meters News & Analysis 6/7/2010 Post a comment Arch Rock is releasing software based on Internet Protocol standards for a new generation of radio chips from companies such as Analog Devices and Texas Instruments aimed at supporting wireless mesh neighborhood networks to link smart meters to utility networks.
20-nm ready for tape out in 2012, says ST News & Analysis 6/4/2010 Post a comment STMicroelectronics NV will be ready to tape out designs using a 20-nm CMOS low power process technology in the fourth quarter of 2012, according to Jean-Marc Chery, the company’s chief technology officer.
Hewlett-Packard passes two million mark in blade servers News & Analysis 6/4/2010 1 comment Hewlett-Packard has climbed to the top of the market for blade systems, one of the few bright spots in what has become a slow growth server market, but the question now is whether it can hang on in the face of new dynamics and competitors.
HP researcher predicts memory-centric processors News & Analysis 6/2/2010 1 comment Hewlett-Packard researchers are exploring ways to make their memristor the centerpiece of a future server design and have determined low power processors such as those based on ARM cores are superior for some data center workloads.
Intel tips next-gen Atom SoC for tablets News & Analysis 6/2/2010 Post a comment Intel Corp. announced at Computex Oak Trail, its next-generation Atom processor for tablets and netbooks that will sample in early 2011, and Acer said it will make systems using it running Intel's MeeGo version of mobile Linux.
New specs rev Infiniband to 100 Gbits/s News & Analysis 6/2/2010 Post a comment The trade group behind the Infiniband interconnect is adding new 50 and 100 Gbit/second milestones to its road map, claiming its members will deliver products for them by early 2012 as the technology revs up to compete with the next wave of Ethernet.
Qualcomm samples dual-CPU Snapdragons, at last News & Analysis 6/2/2010 1 comment Qualcomm Inc. has announced that it is sampling dual-CPU Snapdragon processors that operate at up to 1.2-GHz in clock frequency. However, the parts were scheduled to sample in the fourth quarter of 2009.
Freescale cuts Atom power by 50X News & Analysis 6/1/2010 Post a comment Freescale described its power management IC for Intel's Atom that enables operating power to be cut in half and standby power to be reduced by 50-times over previous Atom processors.
IBM, partners to report 22-nm FinFET SRAM News & Analysis 6/1/2010 2 comments A research team comprising authors from IBM Research, GlobalFoundries, Toshiba and NEC has produced an SRAM cell with an area of 0.0063 square microns using FinFET transistors and optical lithography.