Toshiba GaN HEMTs include PA for satcom Product News 6/11/2011 1 comment At IMS2011, Toshiba America Electronic Components, Inc. announced the TGI1314-25L, a gallium nitride (GaN) semiconductor high electron mobility transistor (HEMT), the latest addition to its power amplifier (PA) product family.
Renesas shakes up post-quake plan News & Analysis 6/10/2011 1 comment Renesas is moving up the target date for full supply restoration to the end of September -- one month ahead of the previously announced goal.
STMicro claims memory density record Product News 6/9/2011 1 comment STMicroelectronics claimed a new memory density record, launching what it described as the first 2-Mbit serial EEPROM chip for write-intensive applications.
Fusion-io IPO raises $200 million News & Analysis 6/9/2011 2 comments Fusion—io Inc., a solid-state server memory company, has priced its initial public offering of 12.3 million shares at $19.00. The stock opened Thursday on the New York Stock Exchange at $24.5 before settling back slightly to $24.35.
Spreadtrum buys into 3G modem firm, finds CTO News & Analysis 6/9/2011 5 comments Spreadtrum Communications Inc., China's leading fabless chip company, has announced that it has acquired 48.4% of MobilePeak Holdings Ltd., a fabless chip company that designs UMTS/HSPA+ modem chipsets.
Kovio raises $15 million for printed NFC News & Analysis 6/9/2011 2 comments Kovio, a private company developing manufacturing technology that combines graphics printing with silicon-based circuitry, has raised $15 million to pursue NFC applications in a round of funding led by Tyco Retail Solutions.
China startup rolls 'unified' Android processor News & Analysis 6/8/2011 33 comments ICube Corp., a two-year old fabless startup out of Shenzhen, China, backed by a publicly listed holding company in Hong Kong, is going after the Android mobile computing market using its own architecture of multicore processor.
IHS: Apple ranked as top chip buyer in 2010 News & Analysis 6/8/2011 7 comments Apple Inc. became the largest buyer of chips in 2010, overtaking Hewlett-Packard Co. by spending $17.5 billion to grab nearly 6 percent of global production, according to market research firm IHS-iSuppli.
Record fab tool spending projected in 2011 News & Analysis 6/7/2011 5 comments SEMI said spending on semiconductor production equipment is expected to grow 31 percent in 2011 to a record $44 billion, but new fab construction spending is expected to be historically low in 2011 and 2012.
Intel tips second university research center News & Analysis 6/7/2011 7 comments The second Intel Science and Technology Center—part of a commitment by the company to pump $100 million into U.S. university research over the next five years—will focus on secure computing and will be hosted at the University of California-Berkeley in collaboration with several other universities, Intel said.
ARM set to play in games consoles, says analyst News & Analysis 6/7/2011 12 comments Having become the leading supplier of processor architecture for mobile phones ARM is set to start making inroads into the games console market, according to Semicast Research.
which means variants of PowerPC, according to market research company Semicast Research.
IDC slashes 2011 PC growth forecast News & Analysis 6/6/2011 10 comments IDC slashed its forecast for 2011 PC shipment growth to 4.2 percent from 7.1 percent, citing declining first quarter shipments, an increasingly conservative economic outlook and relative PC market saturation among consumers in developed countries.
Freescale inks Rambus patent license News & Analysis 6/6/2011 2 comments Freescale Semiconductor signed a patent licensing agreement covering the use of Rambus patents for memory controllers and serial links in a broad range of ICs, settling pending litigation between the companies.
Kozio adds support for Freescale's QorIQ P2 Product News 6/6/2011 Post a comment Kozio Inc. has expanded its in-system diagnostics solution to support Freescale Semiconductor's QorIQ P2 Platform Series, which includes the P2020 (dual-core) and P2010 (single-core) communications processors.
WSTS strips value from Q1 chip market News & Analysis 6/3/2011 7 comments The WSTS organization has reduced its figures for global chips sales for each of the months of January, February and March of 2011, in its latest updating of its spreadsheet.
Japan 'actual' chip sales collapsed in April News & Analysis 6/3/2011 3 comments Actual chip sales for the Japan region in April were the lowest for 23 months, according to figures from the WSTS organization. It is likely to be due to the aftermath of the earthquake that struck Japan in March.
Analyst: OEMS cut tablet builds for 2011 News & Analysis 6/3/2011 6 comments Production of media tablets in 2011—aside from Apple's iPad—is now expected to be significantly less than previously thought after lackluster sell through and other factors burst "the tablet bubble," according to a Wall Street analyst.
SIA: Semi industry exceeded emissions goal News & Analysis 6/2/2011 4 comments The worldwide semiconductor industry exceeded its initial 10 percent reduction goal for perfluorocompounds (PFCs) emissions, bringing total PFCs emissions down by 32 percent over a 10-year period, according to the Semiconductor Industry Association.
DRAM module market growing, says IHS News & Analysis 6/2/2011 3 comments The market for DRAM modules is set to increase to 812.8 million units in 2011, up 10.9 percent from 733.2 million units in 2010, according to market research firm IHS-iSuppli. This growth is down from the 14.6 percent market expansion seen in 2010.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Are the design challenges the same as with embedded systems, but with a little developer- and IT-skills added in? What do engineers need to know? Rick Merritt talks with two experts about the tools and best options for designing IoT devices in 2016. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.