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Content tagged with Semiconductors posted in June 2012
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DCD's D68000 IP core with Linux, MAC, and debugger
Product News  
6/30/2012   Post a comment
Digital Core Design announce a modern incarnation of the good old Motorola 68000 processor as an IP core for use in FPGAs and ASICs/SoCs.
Microsemi's advanced motor control algorithms for SmartFusion cSoCs
Product News  
6/30/2012   Post a comment
SmartFusion cSoCs (chips with MCU, programmable digital, and programmable analog) provide cost-effective solutions ideal for safety-critical applications.
New Xilinx Kintex-7 FPGA-based Connectivity Kit
Product News  
6/30/2012   Post a comment
Use of pre-verified and integrated IP shortens time-to-market, reduces BOM, future-proofs high speed serial designs, and dramatically increases design productivity.
Kane's new Altera Stratix V-based Computational Accelerator
Product News  
6/30/2012   Post a comment
Kane Computing has announced that the Gidel ProcV PCIe x 8 (Gen3) computational accelerator board is now in production.
UMC licenses IBM technology for 20-nm FinFETs
News & Analysis  
6/29/2012   9 comments
UMC said it licensed technology from IBM to expedite the development of its 20-nm CMOS process, including FinFET 3-D transistors.
Newport Media gets the ISDB picture in smartphones
News & Analysis  
6/29/2012   5 comments
Fabless chip company Newport Media has won design slots for its digital television receiver SoCs in smartphones and feature phones from Samsung, HTC, LG, Motorola and ZTE. The chips are specifically for reception of Integrated Services Digital Broadcasting-Terrestrial transmissions, which are standard in Latin American and Japanese markets.
Litho firm buys packaging patents from IBM
News & Analysis  
6/28/2012   2 comments
Ultratech, a supplier of lithography and laser-processing systems used to manufacture semiconductors, said it acquired the rights to a collection of chip packaging patents from IBM. The purchase price was not disclosed.
Report: Qualcomm wafer fab not ruled out
News & Analysis  
6/28/2012   30 comments
Paul Jacobs, CEO of Qualcomm, the world's largest fabless chip company, has not ruled out owning a wafer fab or putting large amounts of cash down to ensure the firm's supply of semiconductor chips, according to a Bloomberg report.
U-blox makes LTE move, buys Cognovo and 4M Wireless
News & Analysis  
6/28/2012   2 comments
Swiss GPS and wireless chip company U-blox is acquiring 4G chip company Cognovo and LTE protocol licensor 4M Wireless for approximately $26 million.
Legislation seeks to relax restrictions on tracking fake chips
News & Analysis  
6/28/2012   12 comments
A House proposal seeks to reverse U.S. customs rules that prevent chip makers from examining fake chips to determine their authenticity. However, the bill is a long way from final passage.
Researchers report solid-state quantum leaps
News & Analysis  
6/27/2012   5 comments
Labs in the U.S. and Europe separately reported progress in adapting solid-state materials to store spintronic quantum states, a critical hurdle on the path to using spintronics in quantum computing.
Silicon Laboratories Si21x8 TV tuners
Product News  
6/27/2012   Post a comment
Silicon Laboratories launched its fourth generation TV tuner product line, which includes devices that offer greater integration, lower power consumption and the highest tolerance to Wi-Fi and LTE interference.
Texas Instruments TPA3116D2, TPA3118D2 and TPA3130D2 Class D audio amplifiers
Product News  
6/27/2012   3 comments
Higher efficiency levels and lower BOM costs will make Texas Instruments' Class D devices more accessible to cost-sensitive applications, including the LCD TV market, soundbars, after-market automotive solutions and portable audio docks.
Google launches 7-inch, $199 Android tablet
News & Analysis  
6/27/2012   27 comments
As expected, Google used the occasion of its Google I/O developer event to launch a 7-inch media tablet, made by Taiwan's Asustek, which will be available in mid-July starting at $199.
Firm of mature parts offers lead-free version of AMD chip
Product News  
6/27/2012   Post a comment
Rochester Electronics, a manufacturer of mature semiconductors, has created a lead-free version of the AM188EM microprocessor.
New HyperLink DSP interface FPGA core from Integre Technologies
Product News  
6/27/2012   Post a comment
Integretek core leverages proven Texas Instruments’ HyperLink technology connecting Altera and Xilinx FPGA designs to TI’s TMS320C66x multicore processors.
Xilinx delivers PCIe Gen3 hard block and 1866 Mb/s DDR3 solution
Product News  
6/27/2012   1 comment
Xilinx integrated block for the PCI Express Gen3 standard accelerates productivity and increases system performance.
Maxim pledges $200M boost for U.S. chip making
News & Analysis  
6/27/2012   2 comments
Analog and mixed-signal chip maker Maxim said it plans to spend $200 million to upgrade its wafer fabs in Oregon, Texas and California. The investment will also create additional manufacturing jobs.
Indian fabless startup seeks $20 million, say reports
News & Analysis  
6/27/2012   15 comments
Fabless mobile computing chip company Ineda Systems Pvt Ltd. (Hyderabad, India) is planning to raise $20 million over the next few months, according to local reports.
Applied tips dielectric etch tool for 3-D NAND production
Product News  
6/27/2012   4 comments
Chip equipment vendor Applied Materials launched a dielectric etch system targeted specifically for three-dimensional memory architectures.
Infineon lowers guidance as business softens
News & Analysis  
6/27/2012   Post a comment
German chip company Infineon has updated its outlook for the third and fourth quarters of its 2012 fiscal year.
Intel announces another university research center
News & Analysis  
6/27/2012   2 comments
Intel CTO Justin Rattner announced the seventh Intel Science and Technology Center will focus on social computing and be based at the University of California, Irvine.
AMD rolls low-power embedded APU
News & Analysis  
6/27/2012   Post a comment
AMD introduced an accelerated processing unit targeted at very low power, small form factor and cost-sensitive embedded designs that require a combination of x86 compatibility and graphics.
PV gross margins fell 75% in Q1
News & Analysis  
6/26/2012   2 comments
Average gross profits of crystalline photovoltaic (PV) industry module manufacturers fell to 9 cents per watt in the first quarter of 2012 and are expected to decline further to 7 cents per watt by the end of 2012, according to IMS Research market report.
Wolfson wins audio slot in Samsung smartphone
News & Analysis  
6/26/2012   6 comments
Wolfson Microelectronics, a Scottish mixed-signal fabless chip company, has announced that its WM1811 audio hub IC is being used within the Galaxy S III smartphone from Samsung.
ST starts sampling STM32 F3 microcontroller range
Product News  
6/26/2012   Post a comment
STMicroelectronics NV (Geneva, Switzerland) has announced it has started delivering samples of its STM32 F3 series of microcontrollers which include a variety of analog peripherals and DSP capability.
Virtual jobs fair offers engineers work in Singapore
News & Analysis  
6/26/2012   21 comments
Engineers with experience in the consumer electronics and semiconductor sectors and who are prepared to continue their careers in Singapore could benefit from the first ever online recruitment event being organized by Contact Singapore.
Imec, Murata team on reconfigurable radio IC design
News & Analysis  
6/26/2012   1 comment
Next generation wireless access asks for reconfigurable radios. Imec and Murata Manufacturing Co. Ltd. said they have sealed a three-year R&D collaboration to work on cognitive reconfigurable radio front-end.
Slideshow: Scenes from the FTF 2012 Tech Lab
News & Analysis  
6/26/2012   3 comments
Snapshots from the hundreds of cool exhibits at the Freescale Technology Forum 2012 Tech Lab.
Dow Corning, SUSS MicroTec team on TSV chip packaging
News & Analysis  
6/26/2012   Post a comment
Materials vendor Dow Corning and semiconductor manufacturing equipment provider SUSS MicroTec said they would collaborate on a temporary bonding solution for 3-D through-silicon via semiconductor packaging.
Fab tool spending to fall 9% in 2012, says Gartner
News & Analysis  
6/25/2012   Post a comment
Worldwide wafer fab equipment spending is on pace to total $33 billion in 2012, a decline of 9 percent from $36.2 billion in 2011, according to market research firm Gartner.
Rambus names Ronald Black CEO
News & Analysis  
6/25/2012   Post a comment
Rambus named Ronald Black, a 20-year veteran of the semiconductor and mobile industries, to the position of CEO, replacing Howard Hughes, who announced earlier this year he would retire.
Renesas seeks $620 million from KKR, says report
News & Analysis  
6/25/2012   13 comments
Struggling Japanese chip company Renesas Electronics Corp. is to seek a 50 billion yen (about $620 million) investment from private equity firm Kohlberg Kravis Roberts & Co., according to a Nikkei report.
Milan startup offers radiation hardened SRAM
Product News  
6/25/2012   3 comments
A radiation hardened 512-kbit SRAM designed by Italian fabless chip startup RedCat Devices srl withstands a 15-Mrad total ionization dose. The chip was manufactured for RedCat by foundry Tower Semiconductor Ltd. in its 180-nm CMOS manufacturing process.
Freescale takes shotgun approach to base station SoCS
News & Analysis  
6/22/2012   4 comments
Freescale Semiconductor is casting a wide net in its pursuit of sockets in the nascent market for small cell base stations, according to Scott Aylor, general manager of Freescale's wireless access division.
DP5-A: An Altera FPGA video development platform
Product News  
6/22/2012   Post a comment
SingMai Electronics has introduced a range of low cost boards targeted at SD and HD video development.
Spansion's new HMI voice coprocessor
Product News  
6/22/2012   1 comment
Spansion's acoustic coprocessor leverages Nuance's voice technology to improve performance of voice applications.
GainSpan showcases expanded Wi-Fi connectivity capabilities
Product News  
6/22/2012   Post a comment
While at the Freescale Technology Forum 2012, GainSpan showcased extended capabilities, including serial to Wi-Fi, limited access point, and sensor apps.
SymTA/S supports ECU S/W dev on AURIX automotive MCUs
Product News  
6/22/2012   Post a comment
Infineon and Symtavision extend their partnership for model-based timing design and verification of multicore Engine Control Unit (ECU) software.
Reports: MediaTek bids to buy rival MStar
News & Analysis  
6/22/2012   2 comments
Fabless consumer chip company Mediatek Inc. has announced it has offered to buy local Taiwan rival MStar Semiconductor Inc., according to a Reuters report that cited a statement from MediaTek as its source.
Fab tool book-to-bill slipped in May
News & Analysis  
6/22/2012   Post a comment
The three-month rolling average book-to-bill ratio for North American semiconductor manufacturing equipment declined to 1.05 in May, down from 1.10 in April, according to the fab tool vendor trade group SEMI.
Micron recasts Intel JV, includes emerging memory
News & Analysis  
6/21/2012   4 comments
Micron has announced the reorganized of production arrangements within its IM Flash Technologies joint venture with Intel and the scope has been expanded to include certain emerging memory technologies.
Cypress ups offer for Ramtron
News & Analysis  
6/21/2012   1 comment
Cypress Semiconductor said it commenced a tender off to acquire all outstanding shares of Ramtron International for $2.68 per share, or about $95 million.
AMS AS3421 and AS3422, single chip ANC solutions
Product News  
6/21/2012   Post a comment
ams has introduced single-chip ANC solutions with integrated speaker driver ICs, which make it easier for manufacturers of Bluetooth headsets, headphones and earpieces to implement Active Noise Cancellation (ANC).
Broadcom BCM43242 WiFi chip
Product News  
6/21/2012   Post a comment
Broadcom has launched two new WiFi devices to enable a consumer video experience that spans mobile devices, smart TVs and other consumer electronics (CE).
Micron still interested in Elpida despite more losses
News & Analysis  
6/21/2012   7 comments
Micron made a net loss of $320 million on net sales of $2.2 billion in the third quarter of fiscal 2012, which ended May 31 due to continuing softness in the memory markets, the company said.
Report: Renesas closes in on cash for cuts
News & Analysis  
6/21/2012   8 comments
Hitachi and Mitsubishi Electric, two of the three major shareholders in struggling Japanese chip company Renesas Electronics Corp., have agreed in principle to provide a support package worth 50 billion yen (about $630 million), according to a Reuters report that referenced unnamed sources.
Freescale grapples with auto safety mandates
News & Analysis  
6/21/2012   3 comments
While automobile makers worldwide grapple with meeting the safety standards set by the International Standards Organization, Freescale Semiconductor aims to help auto makers meet the emerging safety mandate with a new system basic chip thatworks hand-in-hand with its Power Architecture.
Agile Zynq-7000 EPP software-defined radio kit
Product News  
6/20/2012   1 comment
Avnet and Analog Devices introduce the Agile Zynq-7000 EPP/Analog Devices software-defined radio kit
Live webinar on safety-critical apps and high-reliability products
News & Analysis  
6/20/2012   1 comment
The folks from Microsemi are inviting us to attend their live webinar on Tuesday 26 June 2012 from 8:00am to 9:00am Pacific Time (and it's free – hurray!)
Page 1 / 3   >   >>


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