Newport Media gets the ISDB picture in smartphones
News & Analysis 6/29/2012 5 comments
Fabless chip company Newport Media has won design slots for its digital television receiver SoCs in smartphones and feature phones from Samsung, HTC, LG, Motorola and ZTE. The chips are specifically for reception of Integrated Services Digital Broadcasting-Terrestrial transmissions, which are standard in Latin American and Japanese markets.
Litho firm buys packaging patents from IBM
News & Analysis 6/28/2012 2 comments
Ultratech, a supplier of lithography and laser-processing systems used to manufacture semiconductors, said it acquired the rights to a collection of chip packaging patents from IBM. The purchase price was not disclosed.
Report: Qualcomm wafer fab not ruled out
News & Analysis 6/28/2012 30 comments
Paul Jacobs, CEO of Qualcomm, the world's largest fabless chip company, has not ruled out owning a wafer fab or putting large amounts of cash down to ensure the firm's supply of semiconductor chips, according to a Bloomberg report.
Researchers report solid-state quantum leaps
News & Analysis 6/27/2012 5 comments
Labs in the U.S. and Europe separately reported progress in adapting solid-state materials to store spintronic quantum states, a critical hurdle on the path to using spintronics in quantum computing.
Silicon Laboratories Si21x8 TV tuners
Product News 6/27/2012 Post a comment
Silicon Laboratories launched its fourth generation TV tuner product line, which includes devices that offer greater integration, lower power consumption and the highest tolerance to Wi-Fi and LTE interference.
Maxim pledges $200M boost for U.S. chip making
News & Analysis 6/27/2012 2 comments
Analog and mixed-signal chip maker Maxim said it plans to spend $200 million to upgrade its wafer fabs in Oregon, Texas and California. The investment will also create additional manufacturing jobs.
AMD rolls low-power embedded APU
News & Analysis 6/27/2012 Post a comment
AMD introduced an accelerated processing unit targeted at very low power, small form factor and cost-sensitive embedded designs that require a combination of x86 compatibility and graphics.
PV gross margins fell 75% in Q1
News & Analysis 6/26/2012 2 comments
Average gross profits of crystalline photovoltaic (PV) industry module manufacturers fell to 9 cents per watt in the first quarter of 2012 and are expected to decline further to 7 cents per watt by the end of 2012, according to IMS Research market report.
Virtual jobs fair offers engineers work in Singapore
News & Analysis 6/26/2012 21 comments
Engineers with experience in the consumer electronics and semiconductor sectors and who are prepared to continue their careers in Singapore could benefit from the first ever online recruitment event being organized by Contact Singapore.
Rambus names Ronald Black CEO
News & Analysis 6/25/2012 Post a comment
Rambus named Ronald Black, a 20-year veteran of the semiconductor and mobile industries, to the position of CEO, replacing Howard Hughes, who announced earlier this year he would retire.
Milan startup offers radiation hardened SRAM
Product News 6/25/2012 3 comments
A radiation hardened 512-kbit SRAM designed by Italian fabless chip startup RedCat Devices srl withstands a 15-Mrad total ionization dose. The chip was manufactured for RedCat by foundry Tower Semiconductor Ltd. in its 180-nm CMOS manufacturing process.
Reports: MediaTek bids to buy rival MStar
News & Analysis 6/22/2012 2 comments
Fabless consumer chip company Mediatek Inc. has announced it has offered to buy local Taiwan rival MStar Semiconductor Inc., according to a Reuters report that cited a statement from MediaTek as its source.
Fab tool book-to-bill slipped in May
News & Analysis 6/22/2012 Post a comment
The three-month rolling average book-to-bill ratio for North American semiconductor manufacturing equipment declined to 1.05 in May, down from 1.10 in April, according to the fab tool vendor trade group SEMI.
Cypress ups offer for Ramtron
News & Analysis 6/21/2012 1 comment
Cypress Semiconductor said it commenced a tender off to acquire all outstanding shares of Ramtron International for $2.68 per share, or about $95 million.
Broadcom BCM43242 WiFi chip
Product News 6/21/2012 Post a comment
Broadcom has launched two new WiFi devices to enable a consumer video experience that spans mobile devices, smart TVs and other consumer electronics (CE).
Report: Renesas closes in on cash for cuts
News & Analysis 6/21/2012 8 comments
Hitachi and Mitsubishi Electric, two of the three major shareholders in struggling Japanese chip company Renesas Electronics Corp., have agreed in principle to provide a support package worth 50 billion yen (about $630 million), according to a Reuters report that referenced unnamed sources.
Freescale grapples with auto safety mandates
News & Analysis 6/21/2012 3 comments
While automobile makers worldwide grapple with meeting the safety standards set by the International Standards Organization, Freescale Semiconductor aims to help auto makers meet the emerging safety mandate with a new system basic chip thatworks hand-in-hand with its Power Architecture.