Newport Media gets the ISDB picture in smartphones News & Analysis 6/29/2012 5 comments Fabless chip company Newport Media has won design slots for its digital television receiver SoCs in smartphones and feature phones from Samsung, HTC, LG, Motorola and ZTE. The chips are specifically for reception of Integrated Services Digital Broadcasting-Terrestrial transmissions, which are standard in Latin American and Japanese markets.
Litho firm buys packaging patents from IBM News & Analysis 6/28/2012 2 comments Ultratech, a supplier of lithography and laser-processing systems used to manufacture semiconductors, said it acquired the rights to a collection of chip packaging patents from IBM. The purchase price was not disclosed.
Report: Qualcomm wafer fab not ruled out News & Analysis 6/28/2012 30 comments Paul Jacobs, CEO of Qualcomm, the world's largest fabless chip company, has not ruled out owning a wafer fab or putting large amounts of cash down to ensure the firm's supply of semiconductor chips, according to a Bloomberg report.
Researchers report solid-state quantum leaps News & Analysis 6/27/2012 5 comments Labs in the U.S. and Europe separately reported progress in adapting solid-state materials to store spintronic quantum states, a critical hurdle on the path to using spintronics in quantum computing.
Silicon Laboratories Si21x8 TV tuners Product News 6/27/2012 Post a comment Silicon Laboratories launched its fourth generation TV tuner product line, which includes devices that offer greater integration, lower power consumption and the highest tolerance to Wi-Fi and LTE interference.
Maxim pledges $200M boost for U.S. chip making News & Analysis 6/27/2012 2 comments Analog and mixed-signal chip maker Maxim said it plans to spend $200 million to upgrade its wafer fabs in Oregon, Texas and California. The investment will also create additional manufacturing jobs.
AMD rolls low-power embedded APU News & Analysis 6/27/2012 Post a comment AMD introduced an accelerated processing unit targeted at very low power, small form factor and cost-sensitive embedded designs that require a combination of x86 compatibility and graphics.
PV gross margins fell 75% in Q1 News & Analysis 6/26/2012 2 comments Average gross profits of crystalline photovoltaic (PV) industry module manufacturers fell to 9 cents per watt in the first quarter of 2012 and are expected to decline further to 7 cents per watt by the end of 2012, according to IMS Research market report.
Virtual jobs fair offers engineers work in Singapore News & Analysis 6/26/2012 21 comments Engineers with experience in the consumer electronics and semiconductor sectors and who are prepared to continue their careers in Singapore could benefit from the first ever online recruitment event being organized by Contact Singapore.
Rambus names Ronald Black CEO News & Analysis 6/25/2012 Post a comment Rambus named Ronald Black, a 20-year veteran of the semiconductor and mobile industries, to the position of CEO, replacing Howard Hughes, who announced earlier this year he would retire.
Milan startup offers radiation hardened SRAM Product News 6/25/2012 3 comments A radiation hardened 512-kbit SRAM designed by Italian fabless chip startup RedCat Devices srl withstands a 15-Mrad total ionization dose. The chip was manufactured for RedCat by foundry Tower Semiconductor Ltd. in its 180-nm CMOS manufacturing process.
Reports: MediaTek bids to buy rival MStar News & Analysis 6/22/2012 2 comments Fabless consumer chip company Mediatek Inc. has announced it has offered to buy local Taiwan rival MStar Semiconductor Inc., according to a Reuters report that cited a statement from MediaTek as its source.
Fab tool book-to-bill slipped in May News & Analysis 6/22/2012 Post a comment The three-month rolling average book-to-bill ratio for North American semiconductor manufacturing equipment declined to 1.05 in May, down from 1.10 in April, according to the fab tool vendor trade group SEMI.
Cypress ups offer for Ramtron News & Analysis 6/21/2012 1 comment Cypress Semiconductor said it commenced a tender off to acquire all outstanding shares of Ramtron International for $2.68 per share, or about $95 million.
Broadcom BCM43242 WiFi chip Product News 6/21/2012 Post a comment Broadcom has launched two new WiFi devices to enable a consumer video experience that spans mobile devices, smart TVs and other consumer electronics (CE).
Report: Renesas closes in on cash for cuts News & Analysis 6/21/2012 8 comments Hitachi and Mitsubishi Electric, two of the three major shareholders in struggling Japanese chip company Renesas Electronics Corp., have agreed in principle to provide a support package worth 50 billion yen (about $630 million), according to a Reuters report that referenced unnamed sources.
Freescale grapples with auto safety mandates News & Analysis 6/21/2012 3 comments While automobile makers worldwide grapple with meeting the safety standards set by the International Standards Organization, Freescale Semiconductor aims to help auto makers meet the emerging safety mandate with a new system basic chip thatworks hand-in-hand with its Power Architecture.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Are the design challenges the same as with embedded systems, but with a little developer- and IT-skills added in? What do engineers need to know? Rick Merritt talks with two experts about the tools and best options for designing IoT devices in 2016. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.