Altera sales rise sequentially News & Analysis 7/24/2006 Post a comment Programmable logic device supplier Altera Corp. posted second quarter 2006 sales of $334.1 million, up 14 percent from the first quarter of 2006 and 17 percent from the year-ago second quarter.
Zero-crossover op amp delivers glitch-free performance Product News 7/24/2006 Post a comment Product Review - Proclaiming a step advance for low-noise, high-performance operational amplifiers, Texas Instruments' OPA365 utilizes a zero-crossover input architecture to achieve glitchless rail-to-rail performance for precision data conversion applications.
ASIC design down, but not out News & Analysis 7/24/2006 Post a comment LSI Logic's exit from the structured ASIC market prompted many analysts to downgrade their market predictions, but the market for structured ASICs remains significant, a market watcher said.
ARM demos generator tool for virtual prototyping Product News 7/24/2006 Post a comment ARM has developed a system generator tool that it has already supplied to lead partners and will introduce generally in September that it says will allow platform providers to rapidly generate, by themselves, instruction-accurate virtual prototypes that are scaleable, reusable and fast enough to interact with in real time.
Low power IC design initiative to target EDA companies News & Analysis 7/21/2006 Post a comment The Power Forward Initiative (PFI), an industry group formed earlier this year to address obstacles to low-power IC design, is planning to attract more EDA companies into the project. The group will outline the initiative's roadmap at a special event at next week's Design Automation Conference in San Francisco.
China Video Industry Association to support HDMI News & Analysis 7/21/2006 Post a comment Silicon Image Inc., a supplier of semiconductors for the secure storage, distribution and presentation of high-definition content, has announced an agreement with the China Video Industry Association (CVIA), under which CVIA will promote and support the use of the High-Definition Multimedia Interface (HDMI) by the consumer electronics industry in China.
Tessera, Micron ink chip packaging pact News & Analysis 7/21/2006 Post a comment Tessera Technologies, Inc. and Micron Technology Inc. have sealed a technology license deal that gives Micron access to the former's chip packaging technology. The agreement also settles all outstanding litigation between the companies.
picoChip partners with KT for WiBro/WiMAX femtocells News & Analysis 7/21/2006 Post a comment picoChip has signed a breakthrough agreement with one of the most aggressive operators of broadband wireless in Korea. The non exclusive partnership with Korea Telecom (KT) calls for the companies to develop WiBro / WiMAX access points, sometimes called Femtocells.
SMBus interface bridges analog and digital circuits Product News 7/20/2006 Post a comment Check out this SMBus to analog interface device that digitizes analog signals for use with digital microprocessors. Microsemi's LX1800 can be paired with its ambient light sensors to incorporate microprocessor-controlled digital dimming of backlight lamps in LCD displays.
Europe blamed for slower growth in PC sales News & Analysis 7/20/2006 Post a comment Slow growth in the shipment of PCs in Europe held back global sales in the second quarter of the year, though they did manage to grow by 9.7 percent year-on-year, according to market research group IDC.
Qualcomm demos HSUPA based mobile broadband News & Analysis 7/19/2006 Post a comment Commercialization of the emerging HSUPA standard for high speed data uplink on W-CDMA third generation networks took a step forward this week as Qualcomm said it has completed what it says are the first test calls delivering 2Mbit/s on the uplink.
Survey says Micron leads in patents News & Analysis 7/18/2006 Post a comment ipIQ, an independent technology analysis firm, has ranked Micron Technology Inc. the top semiconductor supplier number in its 2006 Patent Scorecard, an annual industry-by-industry qualitative analysis measuring corporate innovation.
Funding secured for U.K. MEMS research center News & Analysis 7/18/2006 Post a comment The Institute for System Level Integration has received ?£1.12 million ($2 million) of funding from Scottish Enterprise to help U.K. industry adopt Micro-Electromechanical Systems [MEMS] technology. Other groups involved in the design and prototyping initiative include Heriot Watt University and Strathclyde University, the SemeMEMS open access facility run by Semefab and Coventor Inc.
Wi-Fi RF front-end chip slashes size, cuts cost Product News 7/18/2006 Post a comment Promising to cut system-level integration cost and slash board area requirements, RF semiconductor maker SiGe Semiconductor announces a highly integrated RF front-end module. Slated for Wi-Fi systems compliant with 802.11b/g, the device is very small and eliminates several external discrete components. It packs all functions required between the output of a transceiver and its antenna.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.