AMD, HP propose extensions for PCI Express 3.0 News & Analysis 7/31/2009 Post a comment Researchers from Advanced Micro Devices and Hewlett-Packard have written two extensions to the PCI Express 3.0 specification which aims to enable lower cost chips that could support multiple protocols and reduce processor overhead.
Wolfson launches advanced PMIC line Product News 7/31/2009 Post a comment Wolfson Microelectronics' latest power management chips are the first to employ its BuckWise regulator technology, helping to cut support components and facilitate advanced multitasking.
Silicon Valley, Wall Street meet at interconnect event News & Analysis 7/30/2009 Post a comment The Hot Interconnects conference will move from its longstanding home on the Stanford campus to Lower Manhattan next month as organizers try to bring together Silicon Valley technologists and bleeding edge systems users on Wall Street, in part to debate the competition between 10 Gbit Ethernet and Infiniband.
NI expands FlexRIO line Product News 7/30/2009 Post a comment National Instruments announced the expansion of its NI FlexRIO product line with multiple forthcoming adapter modules, said to provide engineers with application-specific I/O for RF, digital, time-domain and vision inspection systems.
Quad and dual 14-bit 125 Msps ADCs dissipate one-third the power Product News 7/29/2009 Post a comment Linear Technology Corporation has announced a family of 24 low-power 14-bit/12-bit, 125-Msps to 25-Msps, quad and dual ADCs that dissipate as little as one-third the power of competing ADCs. The flagship ADC is the LTC2175-14, a quad 14-bit, 125Msps ADC that dissipates only 558 mW (140 mW per channel).
ST widens loss in first half News & Analysis 7/28/2009 Post a comment European chipmaker STMicroelectronics NV (Geneva, Switzerland) reported that its second half net loss was $860 million, or $-0.98 per share, compared to a net loss of $131 million, or $-0.15 per share in the first half of 2008.
ST uses Cadence signoff suite for 65- to 32nm design News & Analysis 7/28/2009 Post a comment European chipmaker STMicroelectronics NV said it has selected integration signoff solutions from Cadence Design Systems, Inc., including QRC Extraction and Encounter Timing System, for 65- to 32-nm design. It is qualifying the system for 32-nm process technologies.
TU Dresden brings power efficient MPSoC to DAC News & Analysis 7/27/2009 Post a comment At the Design Automation Conference (DAC) that currently takes place in San Francisco, a group of researchers and chip designers from the Dresden Technical University present what they hope it could offer a solution for the challenge of modem signal processing for upcoming wireless communications generations.
Agilent to pay $1.5B for Varian News & Analysis 7/27/2009 1 comment Agilent Technologies Inc. has agreed to pay $1.5 billion for Varian Inc. as it continues to seek growth opportunities outside of its dominant position in the electronic test and measurement equipment market.
Samsung, Intrinsity pump ARM to GHz rate News & Analysis 7/26/2009 Post a comment Samsung Electronics Co. and Intrinsity Inc. announced they have first silicon for Humming bird, an ARM Cortex A8 that runs at a GHz and delivers more than 2,000 Dhrystone Mips, competing with Intel Atom processors in an expanding market of mobile devices.
Lattice cutting 8% of workforce News & Analysis 7/24/2009 Post a comment Lattice Semiconductor plans to cut its workforce by 8 percent to reduce costs after posting sequential improvements in sales and net loss for the quarter ended July 4, the company said.
Freescale CEO claims progress, but firm posts loss News & Analysis 7/23/2009 Post a comment Freescale Semiconductor posted a net loss of $484 million on revenue of $824 million for the quarter ended July 3, but the company's top executive said the firm continues to make solid progress on its ongoing restructuring and goal of returning to profitability.
Global Foundries to sign new customer, raise cash News & Analysis 7/23/2009 Post a comment Global Foundries Inc. is getting ready to announce a wafer supply agreement with its first non-AMD customer since its spin off by Advanced Micro Devices Inc., as an independent company. The foundry is also expected to tap shareholders for additional capital although AMD is not expected to participate in the new round of funding.
Media processor aims to clean up Web, mobile video Product News 7/22/2009 Post a comment Integrated Device Technology rolled out the first consumer video processor from its acquisition of Silicon Optix in October, the Vida processor that aims to clean up artifacts in Internet and mobile video for today's big-screen TVs and digital media players.
Cisco, Intel help power up smart grids News & Analysis 7/21/2009 1 comment A broad group of companies including giants Cisco Systems and Intel Corp. are rolling up their sleeves to help set standards and compete for Department of Energy grants to build smart electric grids.
Battle-hardened veterans of the electronics industry have heard of the “connected car” so often that they assume it’s a done deal. But do we really know what it takes to get a car connected and what its future entails? Join EE Times editor Junko Yoshida as she moderates a panel of movers and shakers in the connected car business. Executives from Cisco, Siemens and NXP will share ideas, plans and hopes for connected cars and their future. After the first 30 minutes of the radio show, our listeners will have the opportunity to ask questions via live online chat.