ISuppli: IC inventories down to appropriate levels News & Analysis 7/20/2009 Post a comment Global semiconductor inventories have declined to appropriate levels following four consecutive quarters of reductions, clearing the way for stockpile rebuilding and higher sales in the second half of the year, according to market research firm iSuppli.
NXP cuts more debt, interest payment News & Analysis 7/20/2009 Post a comment NXP Semiconductors said its total debts will go down $225 million and interest payments $16 million following a new financing deal with a private investment manager as the company continues to make headway in efforts to improve its operating condition by lowering debts and the servicing costs.
PMC-Sierra merges Sonet, IP for access nets News & Analysis 7/20/2009 Post a comment PMC-Sierra announced two chips that aim to drive the convergence of Internet Protocol on optical networks, the HyPHY 10/20G chips that integrate a wide range of features for both traditional Sonet/SDH time division multiplexing networks and emerging Carrier Ethernet services.
Infineon, NXP, Soitec lead weekly ranking News & Analysis 7/17/2009 Post a comment Here are the top five online stories for the week beginning Sunday, July 12 , as ranked by EE Times Europe readers, up to and including Friday, July 17. The ranking is based on the number of reader "views" or "hits" on a particular article.
Cypress beats Q2 expectations News & Analysis 7/16/2009 Post a comment Cypress Semiconductor said second quarter revenue increased 12 percent sequentially, while President and CEO T.J. Rodgers said company management is "cautiously optimistic" on the pace of the chip industry recovery.
Real-time clocks are small and thin Product News 7/16/2009 Post a comment Claiming to be up to 73% smaller and 45% thinner than the competition, these real-time clocks simplify design of utility E-meters, multifunction printers, digital photo frames and many other portable devices.
Big falls and rises seen for graphics chips News & Analysis 7/16/2009 Post a comment The graphics chip market is predicted to suffer its worst ever year-on-year shipments performance this year, to be followed by an amazing comeback in 2010, according to market tracker Jon Peddie Research (Tiburon, Calif.).
Group harvested to demo energy harvesting platform News & Analysis 7/16/2009 Post a comment Wireless networking chip and modules group Jennic (Sheffield, England) has demonstrated a platform that harvests thermal, solar, RF and vibrational energy, to power wireless sensor networks based on the IEEE802.15.4 standard such as ZigBee PRO and 6LoWPAN.
June semi sales seen 4.5% up on May News & Analysis 7/16/2009 Post a comment Global semiconductor sales for June are estimated to come in at a month-on-month increase of 4.5 percent against that achieved in May, and the 3-month moving average should rise by $900 million to 17.4 billion, according to market trackers at securities house Carnegie AS (Oslo, Norway).
Intel keynoter offers pep talk, vision of better days News & Analysis 7/16/2009 Post a comment Anand Chandrasekher, senior vice president and general manager of Intel's Ultra Mobility Group, did his best to offer hope to beleaguered semiconductor equipment executives in a Semicon West keynote address, predicting that the convergence of communications and computing would mean big money for the industry in years to come.
PCI Express will scale to 8 GHz by next June News & Analysis 7/15/2009 1 comment The final specification for PCI Express 3.0 will be released by next June, the PCI Special Interest Group announced at its annual conference, providing more detail about the 8 GHz interconnect and challenges implementing it.
Analysis: 5 cautionary notes from Intel's Q2 results News & Analysis 7/15/2009 Post a comment Intel Corp. performed better than expected during the second quarter but the company's results do not necessarily indicate the entire high-tech sector is about to embark upon another round of strong growth or that the global economy has fully recovered and is again on an upward trend.
Printed silicon pioneer raises another $20 million News & Analysis 7/15/2009 Post a comment Kovio Inc. (Milpitas, Calif.), the startup developing manufacturing technology that combines the low cost of graphics printing with the functionality of silicon-based semiconductor integrated circuits, has raised $20 million in Series E funding.
edXact to release enhanced EDA tools at DAC Product News 7/15/2009 Post a comment At the approach of the 46th Design Automation Conference in San Francisco, Calif., edXact SA, French EDA startup specializing in parametric extraction and physical verification, announced it will launch version 3.1 of its Comanche parasitic rule checking analyzer and version 4.3 of its Jivaro simulation acceleration software.
EVE unveils scalable emulation system Product News 7/15/2009 Post a comment On the eve of the 46th Design Automation Conference (DAC) in San Francisco, Calif., Emulation and Verification Engineering SA (Palaiseau, France) has introduced a scalable emulation system that is said to handle up to one-billion ASIC gates.
CEA may set wireless charging standard News & Analysis 7/14/2009 1 comment The Consumer Electronics Association is investigating whether it should create a wireless charging standard for devices such as cellphones at a time when many competing technologies are emerging including one used in the Palm Pre Touchstone that has analysts scratching their heads.
NXP dropping off speculators' death watch News & Analysis 7/14/2009 Post a comment NXP Semiconductor's financial position has improved moderately enough over the last few months following two long-term debts reduction actions that speculators are beginning to give the chip vendor a better chance of surviving its current problems.
Tensilica to power Blue Wonder's LTE designs Product News 7/14/2009 Post a comment Design house Blue Wonder Communications (Dresden, Germany), which specializes in baseband chips and IP for mobile broadband applications such as LTE, is to use Tensilica's Xtensa dataplane processors for an LTE broadband modem design.
Market for thin film IPDs set to grow fatter News & Analysis 7/13/2009 Post a comment The market for thin film integrated passive devices (IPD) is set to grow from $615 million this year to be worth just over $1 billion by 2013 and $1.8 billion two years later, according to market trackers Yole Developpement (Lyon, France).
Report sees WiMax slowdown, LTE concerns Product News 7/13/2009 Post a comment WiMax networks are facing a slowdown in revenue and subscriber growth this year, and many carriers still harbor concerns about whether the rival fourth generation wireless technology, Long Term Evolution, is ready for deployment, according to a new report from Maravedis Research.
Renesas touts faster SiP design process Product News 7/13/2009 Post a comment Renesas has started using new tools that the company says can halve system-in-package (SiP) design time since they rely on a top-down (predictive) design approach in which key characteristics, such as design quality and heat dispersion, are verified during the initial design stage.
Report: Q2 chip sales up 16% from Q1 News & Analysis 7/10/2009 Post a comment The IC market embarked on the road to recovery in the second quarter, growing 16 percent compared to the first quarter, one of the best sequential growth rates in the past 25 years, according to a market research firm.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Are the design challenges the same as with embedded systems, but with a little developer- and IT-skills added in? What do engineers need to know? Rick Merritt talks with two experts about the tools and best options for designing IoT devices in 2016. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.