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Content tagged with Semiconductors posted in July 2011
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Toshiba embedded NAND supports JEDEC's e-MMC
Product News  
7/30/2011   Post a comment
Toshiba America Electronic Components, Inc. (TAEC) has introduced a family of 24-nanometer (nm) e-MMC devices.
TI SRAM targets rad-hard apps
Product News  
7/30/2011   2 comments
The SMV512K32 is a high performance asynchronous CMOS SRAM organized as 524,288 words by 32 bits.
Intersil rolls AEC-Q100 qualified dual synchronous step-down DC/DC regulator
Product News  
7/29/2011   Post a comment
Device targets secondary power automotive applications such as infotainment, camera, and systems modules.
Semtech SX8654/55/56/57/58 low-power 4/5-wire resistive touchscreen controllers
Product News  
7/29/2011   1 comment
Semtech's 4D touchscreen controller, which integrates proximity and pressure inputs with no additional components, is targeted at next-generation handheld applications.
NXP grew again in Q2; may decline in Q3
News & Analysis  
7/29/2011   4 comments
NXP Semiconductors reported a sequential increase in product revenue for the ninth consecutive quarter, but said the streak could come to an end in the third quarter because of a pause in demand from automotive customers, slower-than-expected deployment of near field communications technology and global macroeconomic weakness.
Cadence lifts sales target after strong Q2
News & Analysis  
7/29/2011   1 comment
Cadence Design Systems adjusted its sales target for 2011 after reporting revenue for the second quarter that beat consensus analysts' expectations.
Earnings: Maxim, LSI, KLA beat estimates
News & Analysis  
7/28/2011   1 comment
Chip makers Maxim Integrated Products and LSI and semiconductor capital equipment vendor KLA-Tencor delivered quarterly results that exceeded analysts' expectations.
Silicon Laboratories' Si86xx digital isolators
Product News  
7/28/2011   1 comment
These new six-channel 5 kV digital isolators from Silicon Labs can replace optocouplers in industrial automation and drives, motor control and medical systems.
Tablets, smartphones hit sales of CE devices
News & Analysis  
7/28/2011   7 comments
As sales of multi-function electronics devices like tablets and smartphones rise, sales of single-task products like MP3 players and digital still cameras are projected to decline or stay flat, according to IHS iSuppli.
Microchip MCP3903 analog front end for three-phase energy metering
Product News  
7/28/2011   Post a comment
Microchip's latest device includes six 16-/24-bit ADCs, integrated programmable gain amplifiers, low-drift voltage reference, phase-delay compensation and modulator output block.
Next iPhone looks to be an underachiever
News & Analysis  
7/28/2011   23 comments
Apple's iPhone 5 may be little more than an incremental upgrade, analysts predict.
Avago AFBR-5972Z Fast Ethernet transceiver
Product News  
7/28/2011   Post a comment
Avago’s latest small-footprint device offers reliable data transmission at up to 100 Mbps for industrial automation and renewable energy applications.
TSMC forecasts falling sales in Q3
News & Analysis  
7/28/2011   Post a comment
Foundry Taiwan Semiconductor Manufacturing Co. Ltd. has announced that its net income fell in the second quarter and has forecast its revenue will decline by about 7 percent in the third quarter.
Lam sees steep decline in tool spending
News & Analysis  
7/27/2011   Post a comment
Lam Research reported quarterly results that beat analysts' expectations but warned of a significant decline equipment spending that would cause its revenue to contract in the current quarter.
Atmel adds five SAM9 MCUs with DDR2 support, enhanced LCD control, soft modem implementation
Product News  
7/27/2011   Post a comment
Atmel Corporation has added five new devices to the Atmel SAM9 ARM926-based family of microcontrollers (MCUs): the SAM9G15, SAM9G25, SAM9G35, SAM9X25, and SAM9X35.
ST-Ericsson to close R&D sites
News & Analysis  
7/27/2011   12 comments
Mobile chip company ST-Ericsson is set to close R&D sites as part of the latest round of restructuring, according to CEO Gilles Delfassy. A site in Basingstoke, England, has already been earmarked for closure with a loss of up to 139 jobs, according to a local report.
TI touts 3-D packaging technology
News & Analysis  
7/27/2011   9 comments
Texas Instruments said it has shipped more than 30 million power management devices featuring its PowerStack 3-D packaging technology, which the company says offers performance, thermal, power consumption and board space advantages compared with conventional packaging technologies.
Israel offers Intel $290 million to expand
News & Analysis  
7/27/2011   11 comments
The Israeli government is offering semiconductor giant Intel up to 1 billion shekels (about $290 million) to expand its manufacturing operations in the country, according to local reports.
Mouser launches new audio applications site
News & Analysis  
7/27/2011   1 comment
Mouser Electronics launched an audio applications training site devoted to the newest products and developments for sound engineering.
STMicroelectronics collaborates with Soundchip to bring HD-PA to market
News & Analysis  
7/27/2011   Post a comment
STMicroelectronics is to collaborate with Soundchip SA, a Swiss-based electro-acoustics consultancy and originator of the High Definition Personal Audio (HD-PA) Standard, to bring HD-PA to market by applying their respective strengths in audio system and semiconductor technology, product design and industrialization methods, audio software and sales and marketing.
Audio Pixels Holdings Limited signs joint development agreement with Sony Corporation of Japan
News & Analysis  
7/27/2011   Post a comment
Audio Pixels Holdings Limited has announced that it has signed a Joint Development Agreement with Sony Corporation of Japan for the development of its patented low cost micro-electro mechanical ("MEMS") digital speakers.
CML Microsystems acquires leading-edge vocoder technology
News & Analysis  
7/27/2011   Post a comment
CML Microsystems has acquired the exclusive rights to the RALCWI low bit-rate vocoder products from Spirit Corp., (Spirit), a Moscow based software company.
Ultra-low power DAC delivers crystal-clear audio
Product News  
7/27/2011   Post a comment
Wolfson Microelectronics plc has unveiled the company's latest high performance ultra-low power stereo digital-to-analog converter (DAC) which delivers superior audio to portable applications including mobile phones, tablet PCs, wireless headsets, multimedia players and handheld gaming devices.
Audio streamer delivers class-leading cost and power optimization for mono wireless audio
Product News  
7/27/2011   Post a comment
Nordic Semiconductor ASA has announced the nRF2460 audio streamer IC that offers class-leading power optimization and performance specifically for cost-sensitive battery-powered mono (single channel) C applications such as microphones, subwoofers, musical instruments, and gaming.
Audio SoC gives access to DSP cores
Product News  
7/26/2011   Post a comment
Wolfson Microelectronics has announced a single-chip audio processor that could, potentially, replace up to five of its discrete ICs in mobile devices, including mobile phones, tablet PCs and other handheld media devices.
VoIP SLIC promises smaller BoM
Product News  
7/26/2011   Post a comment
Silicon Laboratories is claiming the title of industry's most integrated, cost-effective and power-efficient subscriber line interface circuit (SLIC) solution for voice-over-IP (VoIP) gateways, with its new Si3226x Dual ProSLIC family.
Low power audio codec optimizes performance and prevents speaker damage
Product News  
7/26/2011   Post a comment
Maxim Integrated Products has introduced the MAX98089, a highly integrated stereo audio codec targeted at portable multimedia applications such as tablets, netbooks, and mobile phones.
Class-G headphone and Class-D speaker amplifiers balance audio power versus battery life
Product News  
7/26/2011   Post a comment
Fairchild Semiconductor has developed the FAB1200 stereo Class-G ground-referenced headphone amplifier with integrated buck converter, as well as the FAB2200 audio subsystem with stereo Class-G headphone amplifier and 1.2 W Class-D mono speaker amplifier.
Fab tool vet Cutini to lead solar startup
News & Analysis  
7/26/2011   Post a comment
Longtime semiconductor capital equipment executive Jerry Cutini has joined elQ Energy, a developer of DC-to-DC parallel solar technology, as president and CEO.
DisplayLink USB virtual graphics technology enables low-power, low-cost embedded displays
Product News  
7/26/2011   Post a comment
DisplayLink USB virtual graphics technology enables embedded applications to provide detailed information to the consumer in multiple displays in different or remote locations without requiring power cords, delivering current via a USB 2.0 or USB 3.0 cable.
Former CFO to become Intel's next chairman
News & Analysis  
7/26/2011   10 comments
Intel Chief Administrative Officer Andy Bryant was elected to the new position of vice chairman of the board of directors in preparation for him to be elected the company's next chairman following Intel's annual stockholder meeting next May.
ProMOS to swap debt for equity, say reports
News & Analysis  
7/26/2011   Post a comment
Struggling DRAM maker ProMOS Technologies Inc. has agreed a deal in principle with more than 30 creditor banks to swap half of its NT$57 billion (about $2 billion) of debt for equity, according to a Taiwan Economic News report.
Infineon ships chips for Chromebook security
Product News  
7/26/2011   Post a comment
Infineon Technologies AG has said it is shipping security chips for devices running Google's Chrome operating system.
Intel SoCs aided by interconnect, IP library
News & Analysis  
7/26/2011   3 comments
Intel now has the tools in place – in particular an on-chip interconnect fabric, an extensive IP library and software – to make a success of its system-on-chip engineering effort, according to Bill Leszinske, an executive with Intel's Atom processor SoC development group.
ST hurt by quake impact, lower Nokia sales
News & Analysis  
7/26/2011   Post a comment
STMicroelectronics reported second quarter sales that were in line with analysts' expectations, but the company guided for lower-than-expected third quarter sales, citing lingering effects from the March 11 earthquake off the coast of Japan and weaker demand from a major wireless customer, believed to be Nokia.
USB port power controller ICs tackle pesky charging issues
Product News  
7/26/2011   Post a comment
SMSC's programmable USC100x trio emulate chargers; optimaize, manage charing under complex scenarios
TI development kit combines MCU and Bluetooth
Product News  
7/25/2011   Post a comment
Kit merges Stellaris ARM Cortex-M3 MCU performance with TI’s seventh-generation CC2560 Bluetooth solution to enable streaming audio, data transfers and other advanced capabilities
TI says damaged Japan fabs back in action
News & Analysis  
7/25/2011   2 comments
Texas Instruments said t two semiconductor fabs damaged in the March 11 earthquake in Japan resumed production ahead of schedule as the company reported second quarter results that beat analysts' expectations.
Brooks buys another life sciences firm
News & Analysis  
7/25/2011   2 comments
Continuing to broaden the company's scope into the life sciences market, semiconductor equipment vendor Brooks Automation acquired life sciences technology vendor Nexus Biosystems in a cash deal worth $79 million.
Mindspeed buys assets of W-CDMA chip vendor
News & Analysis  
7/25/2011   Post a comment
Network infrastructure chip maker Mindspeed Technologies said it acquired substantially all of the assets of San Diego-based W-CDMA signal processing chip vendor IPG Communications.
Broadcom, PLX beat Q2 estimates
News & Analysis  
7/25/2011   Post a comment
Chip makers Broadcom and PLX Technology reported second quarter results that exceeded consensus analysts' expectations.
Texas Instruments ADS42xx analog-to-digital converters
Product News  
7/25/2011   Post a comment
TI bolstered its ultra-low-power, high-speed, ADC family with eight dual-channel devices from 65 to 250 MSPS.
Allegro MicroSystems A8502 and A8514 LED drivers
Product News  
7/25/2011   Post a comment
Allegro MicroSystems rolled out a pair of multi-output LED drivers for backlighting automotive LED displays.
Zarlink adopts 'poison pill'
News & Analysis  
7/25/2011   2 comments
In an apparent bid to thwart a hostile takeover attempt by Microsemi, Canadian chip vendor Zarlink Semiconductor said its board of directors has adopted a limited duration shareholder rights plan that prevents anyone from acquiring the right to vote on more than 20 percent of the company's outstanding shares.
Texas Instruments TPS62730 voltage regulator
Product News  
7/25/2011   Post a comment
TI's 3-MHz, 100-mA step-down DC/DC converter adds 20-percent run-time to ultra-low power wireless and MCU applications.
GE announces micro-holographic storage that supports 500GB disk at Blu-ray speed
Product News  
7/25/2011   3 comments
The micro-holographic material can support on one disc the same storage capacity as 20 standard Blu-ray discs
Triad offers 1 million gates plus analog
Product News  
7/25/2011   4 comments
Triad Semiconductor Inc., whose via-configurable arrays offer programmable analog with a microcontroller, has announced the availability of its largest configurable array to date, the VCA-6, with more than one million ASIC gates.
ST gets Air for TV
News & Analysis  
7/24/2011   2 comments
STMicroelectonics has claimed a significant step forward in its third generation TV SoC platform for STBs, with the successful porting and certification of Adobe AIR 2.5 for TV. It enables AIR-based applications to be run on connected TVs.
User Association certifies Smart Meter stack for PICs
News & Analysis  
7/24/2011   Post a comment
Through a partnership with Kalki Communication, Microchip is now able to provide a Device Language Message Specification (DLMS) protocol stack optimised for its 16bit PIC microcontrollers.
Fujitsu FRAM targets industrial, factory, and low-power applications
Product News  
7/22/2011   2 comments
Latest MB85RSxxx SPI Series, MB85RCxxx I2C Series and FRAM-based RFIDs designed and manufactured by Fujitsu.
Page 1 / 3   >   >>


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