NXP grew again in Q2; may decline in Q3 News & Analysis 7/29/2011 4 comments NXP Semiconductors reported a sequential increase in product revenue for the ninth consecutive quarter, but said the streak could come to an end in the third quarter because of a pause in demand from automotive customers, slower-than-expected deployment of near field communications technology and global macroeconomic weakness.
Tablets, smartphones hit sales of CE devices News & Analysis 7/28/2011 7 comments As sales of multi-function electronics devices like tablets and smartphones rise, sales of single-task products like MP3 players and digital still cameras are projected to decline or stay flat, according to IHS iSuppli.
TSMC forecasts falling sales in Q3 News & Analysis 7/28/2011 Post a comment Foundry Taiwan Semiconductor Manufacturing Co. Ltd. has announced that its net income fell in the second quarter and has forecast its revenue will decline by about 7 percent in the third quarter.
Lam sees steep decline in tool spending News & Analysis 7/27/2011 Post a comment Lam Research reported quarterly results that beat analysts' expectations but warned of a significant decline equipment spending that would cause its revenue to contract in the current quarter.
ST-Ericsson to close R&D sites News & Analysis 7/27/2011 12 comments Mobile chip company ST-Ericsson is set to close R&D sites as part of the latest round of restructuring, according to CEO Gilles Delfassy. A site in Basingstoke, England, has already been earmarked for closure with a loss of up to 139 jobs, according to a local report.
TI touts 3-D packaging technology News & Analysis 7/27/2011 9 comments Texas Instruments said it has shipped more than 30 million power management devices featuring its PowerStack 3-D packaging technology, which the company says offers performance, thermal, power consumption and board space advantages compared with conventional packaging technologies.
Israel offers Intel $290 million to expand News & Analysis 7/27/2011 11 comments The Israeli government is offering semiconductor giant Intel up to 1 billion shekels (about $290 million) to expand its manufacturing operations in the country, according to local reports.
STMicroelectronics collaborates with Soundchip to bring HD-PA to market News & Analysis 7/27/2011 Post a comment STMicroelectronics is to collaborate with Soundchip SA, a Swiss-based electro-acoustics consultancy and originator of the High Definition Personal Audio (HD-PA) Standard, to bring HD-PA to market by applying their respective strengths in audio system and semiconductor technology, product design and industrialization methods, audio software and sales and marketing.
Ultra-low power DAC delivers crystal-clear audio Product News 7/27/2011 Post a comment Wolfson Microelectronics plc has unveiled the company's latest high performance ultra-low power stereo digital-to-analog converter (DAC) which delivers superior audio to portable applications including mobile phones, tablet PCs, wireless headsets, multimedia players and handheld gaming devices.
Audio SoC gives access to DSP cores Product News 7/26/2011 Post a comment Wolfson Microelectronics has announced a single-chip audio processor that could, potentially, replace up to five of its discrete ICs in mobile devices, including mobile phones, tablet PCs and other handheld media devices.
VoIP SLIC promises smaller BoM Product News 7/26/2011 Post a comment Silicon Laboratories is claiming the title of industry's most integrated, cost-effective and power-efficient subscriber line interface circuit (SLIC) solution for voice-over-IP (VoIP) gateways, with its new Si3226x Dual ProSLIC family.
Former CFO to become Intel's next chairman News & Analysis 7/26/2011 10 comments Intel Chief Administrative Officer Andy Bryant was elected to the new position of vice chairman of the board of directors in preparation for him to be elected the company's next chairman following Intel's annual stockholder meeting next May.
ProMOS to swap debt for equity, say reports News & Analysis 7/26/2011 Post a comment Struggling DRAM maker ProMOS Technologies Inc. has agreed a deal in principle with more than 30 creditor banks to swap half of its NT$57 billion (about $2 billion) of debt for equity, according to a Taiwan Economic News report.
Intel SoCs aided by interconnect, IP library News & Analysis 7/26/2011 3 comments Intel now has the tools in place – in particular an on-chip interconnect fabric, an extensive IP library and software – to make a success of its system-on-chip engineering effort, according to Bill Leszinske, an executive with Intel's Atom processor SoC development group.
ST hurt by quake impact, lower Nokia sales News & Analysis 7/26/2011 Post a comment STMicroelectronics reported second quarter sales that were in line with analysts' expectations, but the company guided for lower-than-expected third quarter sales, citing lingering effects from the March 11 earthquake off the coast of Japan and weaker demand from a major wireless customer, believed to be Nokia.
TI says damaged Japan fabs back in action News & Analysis 7/25/2011 2 comments Texas Instruments said t two semiconductor fabs damaged in the March 11 earthquake in Japan resumed production ahead of schedule as the company reported second quarter results that beat analysts' expectations.
Brooks buys another life sciences firm News & Analysis 7/25/2011 2 comments Continuing to broaden the company's scope into the life sciences market, semiconductor equipment vendor Brooks Automation acquired life sciences technology vendor Nexus Biosystems in a cash deal worth $79 million.
Zarlink adopts 'poison pill' News & Analysis 7/25/2011 2 comments In an apparent bid to thwart a hostile takeover attempt by Microsemi, Canadian chip vendor Zarlink Semiconductor said its board of directors has adopted a limited duration shareholder rights plan that prevents anyone from acquiring the right to vote on more than 20 percent of the company's outstanding shares.
Triad offers 1 million gates plus analog Product News 7/25/2011 4 comments Triad Semiconductor Inc., whose via-configurable arrays offer programmable analog with a microcontroller, has announced the availability of its largest configurable array to date, the VCA-6, with more than one million ASIC gates.
ST gets Air for TV News & Analysis 7/24/2011 2 comments STMicroelectonics has claimed a significant step forward in its third generation TV SoC platform for STBs, with the successful porting and certification of Adobe AIR 2.5 for TV. It enables AIR-based applications to be run on connected TVs.