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Content tagged with Semiconductors posted in July 2011
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VC funding slips slightly in Q2
News & Analysis  
7/22/2011   1 comment
Venture investing edged downward in the second quarter with software and social media showing growth, according to a new report from Dow Jones VentureSource.
Taiwan comforted by Apple chip spend cycle
News & Analysis  
7/22/2011   2 comments
Despite concern about the global economic situation Taiwan is taking comfort from an expected cycle of semiconductor purchasing to come in the second half of 2011, driven by the needs of forthcoming Apple products, according to a Taiwan Economic News report.
Rambus sees Q3 profit on rising revenue
News & Analysis  
7/22/2011   4 comments
Patent licensing company Rambus Inc. made a net loss of $10.6 million on sales revenue of $66.2 million in the second quarter of 2011. However, Rambus (Sunnyvale, Calif.) guided that it would be profitable in Q3 on rising revenue.
Xilinx space-grade SRAM-based Virtex-5QV FPGA in production with Mega-Rad capability
Product News  
7/21/2011   1 comment
Designers now have the ability to replace ASICs and one-time-programmable (OTP) solutions with space-grade, high-density, rad-hard reconfigurable FPGAs.
IDC sees 'modest' chip market growth
News & Analysis  
7/21/2011   3 comments
The global chip market be worth $303 billion in 2011, up 7.4 percent from $282 billion in 2010 and will grow 5 percent in 2012 to reach $318 billion, according to market researcher International Data Corp.
Losses swell, outlook flat at ST-Ericsson
News & Analysis  
7/21/2011   3 comments
Financial results for the second quarter at ST-Ericsson, the mobile phone chip joint venture between STMicroelectronics NV and Ericsson AB, were bleak with sales down, losses up and a flat outlook for the third quarter.
Zarlink says Microsemi bid is too low
News & Analysis  
7/21/2011   1 comment
Canadian chip company Zarlink Semiconductor Inc. has acknowledged the receipt of unsolicited bids for the company from analog and mixed-signal rival Microsemi Corp. and said that they have all been rejected because they undervalue the company.
Wolfson announces programmable audio hub
Product News  
7/21/2011   1 comment
Fabless chip company Wolfson Microelectronics plc has announced the imminent availability of the WM5100 integrated circuit, which the company describes as the world's first audio system-on-a-chip.
IAR releases starter kit for NXP’s LPC1780 MCUs
Product News  
7/20/2011   Post a comment
IAR's KickStart Kit for LPC1788 is a complete starter kit for NXP’s ARM Cortex-M3 based LPC1780 microcontroller family. The kit includes an evaluation board, software development tools, an IAR J-Link Lite debug probe, and software.
Freescale's loss narrows on stronger sales, margins
News & Analysis  
7/20/2011   4 comments
Freescale said its quarterly loss narrowed on higher sales and despite reorganization charges and continuing losses on early debt payments.
Op amp overcomes precision/protection tradeoff dilemma
Product News  
7/20/2011   Post a comment
ADA4096-2 from Analog Devices offers typical 35 uV offset, with +/-30V OVP
Taiwan nurtures the next ARM
News & Analysis  
7/20/2011   13 comments
Meet Andes, Taiwan's answer to ARM.
LDOs address diverse automotive application niches, with very low Iq
Product News  
7/20/2011   Post a comment
These low quiescent current, low dropout regulators support the almost uncountable low-drain DC rails in today's highly electronic cars.
Cognovo: soft modem can beat hardware on power
News & Analysis  
7/20/2011   2 comments
Cognovo Ltd. has said that its MCE160 software-defined modem, a version of which is currently being manufactured on its behalf by Samsung Foundry in 45-nm, is expected to consume less than 100-mW peak for simultaneous transmit and receive in LTE and significantly less for 2G and 3G applications. Cognovo has said it also expects the design to consume less power than a traditional ASIC-based hardware modem design.
Microsemi offers $549 million to buy Zarlink
News & Analysis  
7/20/2011   4 comments
Analog and mixed signal chip company Microsemi Corp. has announced that it has made a third offer to acquire Canadian mixed-signal chip company Zarlink Semiconductor Inc., this time worth $548.7 million.
Growth forecast for flip-chip packaging gear
News & Analysis  
7/20/2011   3 comments
Sales of equipment used in sputtering and copper deposition during IC manufacturing will grow at a compound annual growth rate of 17 percent between 2010 and 2013, thanks to a projected boom in flip-chip packaging, according to a report by the Information Network.
DRAM price reductions slowing, says IHS
News & Analysis  
7/20/2011   1 comment
Average prices for DRAM memory chips are projected to fall more slowly through the rest of this year through next year, due largely a slowdown in migration to more advanced lithography systems, according to market research firm IHS iSuppli.
SEMI book-to-bill slips again
News & Analysis  
7/19/2011   Post a comment
The three-month rolling average of bookings to billings posted by North America-based makers of semiconductor production equipment slipped in June for the second consecutive month, according to the fab tool trade group SEMI.
Altera beats Q2 targets, resumes growth
News & Analysis  
7/19/2011   Post a comment
Programmable logic vendor Altera reported sales for the second quarter that handily beat consensus analysts' expectations, returning to sequential growth after what the company's CEO called a mild first quarter correction.
Embedded software firm gets angel funding
News & Analysis  
7/19/2011   2 comments
The Indian Angel Network has invested $1 million in embedded software tool developer Vayavya Labs to help the firm expand its tool suite for electronic systems level design and bolster its sales and marketing efforts.
A19 LED bulbs: What’s under the frosting?
Teardown  
7/19/2011   28 comments
Why are A19 LED bulbs so expensive? In a scientific quest for answers, independent lab MuAnalysis tore apart five bulbs.
Fulcrum buy could signal shift for Intel
News & Analysis  
7/19/2011   10 comments
Intel's agreement to acquire Fulcrum Microsystems for an undisclosed sum could signal a significant change of direction for the world's biggest chip maker toward providing an end-to-end solution for data centers.
Parallel x86 software support for $250
Product News  
7/19/2011   Post a comment
Vector Fabrics BV has announced the availability of its vfThreaded-x86 cloud-based software tool to help with the parallelization and optimization of applications for multi-core x86 architectures.
Virtualizer – Next-gen virtual prototyping solution from Synopsys
News & Analysis  
7/19/2011   Post a comment
Virtualizer is claimed to accelerate software development schedules by up to nine months with lower engineering effort
Spreadtrum agrees to buy Telegent
News & Analysis  
7/19/2011   2 comments
Spreadtrum Communications Inc. has announced it has signed a definitive agreement to acquire Telegent Systems Inc., a developer of software and silicon for the reception of live broadcast television signals.
SeaMicro packs 384 x86 processors in server
News & Analysis  
7/19/2011   3 comments
Startup SeaMicro Inc. has announced it has packed 384 64-bit Intel Atom dual-core processors into a server. The resulting system, dubbed SM10000-64HD, delivers 768 1.66-GHz x86 cores in 10 rack units (17.5 inches).
Cisco to cut 6,500 jobs, sell plant
News & Analysis  
7/18/2011   22 comments
Networking gear giant Cisco Systems said it would cut about 6,500 jobs across its global workforce as part of a plan to reduce operating expenses by about $1 billion per year.
IHS: ARM ICs to be in 23% of laptops in 2015
News & Analysis  
7/18/2011   8 comments
Nearly one in four notebooks PCs made in 2015 will feature ARM-based processors, offering the first real competition to Intel's x86 architecture in the PC microprocessor market, according to a forecast issued by market research firm IHS iSuppli.
Microchip's Audio Development Board for PIC32 MCUs speeds design of 24-bit audio apps
Product News  
7/18/2011   Post a comment
Microchip Technology Inc. offers a 32-bit microcontroller (MCU)-based development kit for the creation of high-quality, 24-bit audio applications. The Audio Development Board for PIC32 MCUs features an 80 MIPS PIC32 MCU, a 24-bit Wolfson audio codec, a two-inch color LCD Display, a USB interface, and an onboard microphone.
ST teams with Swiss startup on audio ICs
News & Analysis  
7/18/2011   Post a comment
STMicroelectronics NV has said it is working with Soundchip SA, a Swiss electro-acoustic consultancy and originator of the High Definition Personal Audio (HD-PA) standard.
IDMs to hurt pure-play foundries, says report
News & Analysis  
7/18/2011   5 comments
The offer of foundry services and aggressive spending by integrated device makers (IDMs), including Intel and Samsung, is set to impact on pure-play foundries such as TSMC and UMC, according to Taipei Times, which referenced a report from Fitch Ratings.
Cause of Telegent’s spectacular fall: China dunnit
News & Analysis  
7/18/2011   21 comments
Telegent, still left with $60 – 70 million in the bank, will “phase out” of the current analog mobile TV chip business but will “restart in a completely different market,” according to industry sources.
Adaptive equalizer IC pushes to 14 Gbps, defeats crosstalk, allows lower-cost PCBs and longer runs
Product News  
7/18/2011   Post a comment
Vitesse VSC7224 spans 155 Mbps to 14 Gbps, implements autonomous retiming/redriving hardware function
Aeroflex announces automated test equipment for RF and mixed signal ICs
Product News  
7/18/2011   Post a comment
Available as turnkey systems or configurable subsystem modules, the AX-Series is based on industry standard AXIe and PXI modules.
Uncertainty clouds Telegent's future
News & Analysis  
7/15/2011   9 comments
Telegent Systems Inc., a vendor of TV receiver chips for cell phones and other mobile devices with engineering resources in China, has closed according to Chinese reports which EE Times has seen in Google translation.
TSMC test runs Apple A6 processor, says report
News & Analysis  
7/15/2011   6 comments
Foundry chipmaker Taiwan Semiconductor Manufacturing Co. Ltd. has started making the ARM-based A6 processor Apple on a trial basis, according to a Reuters report that cited an unnamed source.
Toshiba, SanDisk open NAND flash wafer fab
News & Analysis  
7/15/2011   7 comments
Toshiba Corp. and SanDisk Corp. have announced the opening of Fab 5, the third 300-mm wafer fab for the production of NAND flash memory at Toshiba's Yokkaichi Operations in Mie Prefecture, Japan.
Older packaging technology breathes new life into automobile MEMS sensors
News & Analysis  
7/15/2011   11 comments
Many MEMS products companies are continuing to innovate by adding more functionality to the traditional semiconductor packages.
Semi West exec panel questions 450-mm, EUV
News & Analysis  
7/14/2011   8 comments
An executive panel discussion at the Semicon West fab tool vendor trade show revealed some uncertainty on the pending technology transitions to extreme ultraviolet lithography and 450-mm wafers.
Texas Instruments AMC1200 isolated amplifier and AMC1204 delta-sigma modulator
Product News  
7/14/2011   Post a comment
TI rolled out an isolated amplifier and modulator that enable high-precision current measurement in motor control and green energy applications.
Semtech SC286 dual PoL regulator
Product News  
7/14/2011   Post a comment
Semtech’s dual-channel regulator combines two buck regulators and 225 combinations of voltage options in one tiny 4 x 4 x 0.6mm package.
Samsung study rejects cancer claims
News & Analysis  
7/14/2011   5 comments
A study commissioned by consumer electronics giant Samsung Electronics Co. Ltd. has found no evidence that workers contracted cancer as a result of working at its wafer fabs, according to reports.
ASML sees slowdown in orders
News & Analysis  
7/13/2011   7 comments
ASML Holding reported that second quarter orders were lighter than expected, even as the lithography giant reported record sales for the quarter and said it remained on track for a record sales year.
STMicroelectronics STDP9320, STDP9210 and STDP7320 SoCs
Product News  
7/13/2011   1 comment
STMicroelectronics' latest SoCs combine a DisplayPort 1.2 receiver and transmitter and an HDMI 1.4 receiver for multifunctional monitors.
Hynix, Toshiba team up on MRAM
News & Analysis  
7/13/2011   13 comments
Hynix Semiconductor Inc. and Toshiba Corp. have agreed to develop spin-transfer torque magnetoresistance RAMs together with both saying that the technology is an important next-generation non-volatile memory.
Analyst sees soft June, lowers chip forecast
News & Analysis  
7/13/2011   1 comment
The three-month average of global chip sales for June is going to be $24.6 billion, down compared with $25.03 billion reported for May by the World Semiconductor Trade Statistics organization, according to Bruce Diesen, an analyst at Carnegie Group (Oslo, Norway).
Semicon keynoter urges new business models
News & Analysis  
7/13/2011   1 comment
The semiconductor industry is 53 years old, accounts for 0.6 percent of worldwide GDP, and should account for more in years to come, according to Tien Wu, chief operating officer of test and packaging provider ASE.
ITC to investigate Freescale complaint against TV chip firms
News & Analysis  
7/12/2011   3 comments
The U.S. International Trade Commission said it would investigate a complaint brought by Freescale Semiconductor against TV chip vendors including MediaTek, Zoran and Funai Electric.
New Fujitsu FRAM devices combine benefits of fast-writing SRAMs with Flash in a single IC
Product News  
7/12/2011   1 comment
The MB85RSxxx SPI FRAM family from Fujitsu Semiconductor America, Inc. (FSA) is a new series of advanced Ferroelectric Random Access Memory (FRAM) products designed to meet the rapidly increasing demand for FRAM in industrial systems, factory automation, metering, and many other low-power applications that require high-performance, non-volatile memory.
International Rectifier Automotive MOSFETs
Product News  
7/12/2011   1 comment
IR's new rugged planar devices feature low RDS(on) and are available across a range of voltages from 40 V to 75 V in a variety of SMD and through-hole packages.
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