VC funding slips slightly in Q2 News & Analysis 7/22/2011 1 comment Venture investing edged downward in the second quarter with software and social media showing growth, according to a new report from Dow Jones VentureSource.
Taiwan comforted by Apple chip spend cycle News & Analysis 7/22/2011 2 comments Despite concern about the global economic situation Taiwan is taking comfort from an expected cycle of semiconductor purchasing to come in the second half of 2011, driven by the needs of forthcoming Apple products, according to a Taiwan Economic News report.
Rambus sees Q3 profit on rising revenue News & Analysis 7/22/2011 4 comments Patent licensing company Rambus Inc. made a net loss of $10.6 million on sales revenue of $66.2 million in the second quarter of 2011. However, Rambus (Sunnyvale, Calif.) guided that it would be profitable in Q3 on rising revenue.
IDC sees 'modest' chip market growth News & Analysis 7/21/2011 3 comments The global chip market be worth $303 billion in 2011, up 7.4 percent from $282 billion in 2010 and will grow 5 percent in 2012 to reach $318 billion, according to market researcher International Data Corp.
Losses swell, outlook flat at ST-Ericsson News & Analysis 7/21/2011 3 comments Financial results for the second quarter at ST-Ericsson, the mobile phone chip joint venture between STMicroelectronics NV and Ericsson AB, were bleak with sales down, losses up and a flat outlook for the third quarter.
Zarlink says Microsemi bid is too low News & Analysis 7/21/2011 1 comment Canadian chip company Zarlink Semiconductor Inc. has acknowledged the receipt of unsolicited bids for the company from analog and mixed-signal rival Microsemi Corp. and said that they have all been rejected because they undervalue the company.
Wolfson announces programmable audio hub Product News 7/21/2011 1 comment Fabless chip company Wolfson Microelectronics plc has announced the imminent availability of the WM5100 integrated circuit, which the company describes as the world's first audio system-on-a-chip.
IAR releases starter kit for NXP’s LPC1780 MCUs Product News 7/20/2011 Post a comment IAR's KickStart Kit for LPC1788 is a complete starter kit for NXP’s ARM Cortex-M3 based LPC1780 microcontroller family. The kit includes an evaluation board, software development tools, an IAR J-Link Lite debug probe, and software.
Cognovo: soft modem can beat hardware on power News & Analysis 7/20/2011 2 comments Cognovo Ltd. has said that its MCE160 software-defined modem, a version of which is currently being manufactured on its behalf by Samsung Foundry in 45-nm, is expected to consume less than 100-mW peak for simultaneous transmit and receive in LTE and significantly less for 2G and 3G applications. Cognovo has said it also expects the design to consume less power than a traditional ASIC-based hardware modem design.
Microsemi offers $549 million to buy Zarlink News & Analysis 7/20/2011 4 comments Analog and mixed signal chip company Microsemi Corp. has announced that it has made a third offer to acquire Canadian mixed-signal chip company Zarlink Semiconductor Inc., this time worth $548.7 million.
Growth forecast for flip-chip packaging gear News & Analysis 7/20/2011 3 comments Sales of equipment used in sputtering and copper deposition during IC manufacturing will grow at a compound annual growth rate of 17 percent between 2010 and 2013, thanks to a projected boom in flip-chip packaging, according to a report by the Information Network.
DRAM price reductions slowing, says IHS News & Analysis 7/20/2011 1 comment Average prices for DRAM memory chips are projected to fall more slowly through the rest of this year through next year, due largely a slowdown in migration to more advanced lithography systems, according to market research firm IHS iSuppli.
SEMI book-to-bill slips again News & Analysis 7/19/2011 Post a comment The three-month rolling average of bookings to billings posted by North America-based makers of semiconductor production equipment slipped in June for the second consecutive month, according to the fab tool trade group SEMI.
Altera beats Q2 targets, resumes growth News & Analysis 7/19/2011 Post a comment Programmable logic vendor Altera reported sales for the second quarter that handily beat consensus analysts' expectations, returning to sequential growth after what the company's CEO called a mild first quarter correction.
Embedded software firm gets angel funding News & Analysis 7/19/2011 2 comments The Indian Angel Network has invested $1 million in embedded software tool developer Vayavya Labs to help the firm expand its tool suite for electronic systems level design and bolster its sales and marketing efforts.
Fulcrum buy could signal shift for Intel News & Analysis 7/19/2011 10 comments Intel's agreement to acquire Fulcrum Microsystems for an undisclosed sum could signal a significant change of direction for the world's biggest chip maker toward providing an end-to-end solution for data centers.
Parallel x86 software support for $250 Product News 7/19/2011 Post a comment Vector Fabrics BV has announced the availability of its vfThreaded-x86 cloud-based software tool to help with the parallelization and optimization of applications for multi-core x86 architectures.
Spreadtrum agrees to buy Telegent News & Analysis 7/19/2011 2 comments Spreadtrum Communications Inc. has announced it has signed a definitive agreement to acquire Telegent Systems Inc., a developer of software and silicon for the reception of live broadcast television signals.
SeaMicro packs 384 x86 processors in server News & Analysis 7/19/2011 3 comments Startup SeaMicro Inc. has announced it has packed 384 64-bit Intel Atom dual-core processors into a server. The resulting system, dubbed SM10000-64HD, delivers 768 1.66-GHz x86 cores in 10 rack units (17.5 inches).
Cisco to cut 6,500 jobs, sell plant News & Analysis 7/18/2011 22 comments Networking gear giant Cisco Systems said it would cut about 6,500 jobs across its global workforce as part of a plan to reduce operating expenses by about $1 billion per year.
IHS: ARM ICs to be in 23% of laptops in 2015 News & Analysis 7/18/2011 8 comments Nearly one in four notebooks PCs made in 2015 will feature ARM-based processors, offering the first real competition to Intel's x86 architecture in the PC microprocessor market, according to a forecast issued by market research firm IHS iSuppli.
IDMs to hurt pure-play foundries, says report News & Analysis 7/18/2011 5 comments The offer of foundry services and aggressive spending by integrated device makers (IDMs), including Intel and Samsung, is set to impact on pure-play foundries such as TSMC and UMC, according to Taipei Times, which referenced a report from Fitch Ratings.
Uncertainty clouds Telegent's future News & Analysis 7/15/2011 9 comments Telegent Systems Inc., a vendor of TV receiver chips for cell phones and other mobile devices with engineering resources in China, has closed according to Chinese reports which EE Times has seen in Google translation.
Toshiba, SanDisk open NAND flash wafer fab News & Analysis 7/15/2011 7 comments Toshiba Corp. and SanDisk Corp. have announced the opening of Fab 5, the third 300-mm wafer fab for the production of NAND flash memory at Toshiba's Yokkaichi Operations in Mie Prefecture, Japan.
Semi West exec panel questions 450-mm, EUV News & Analysis 7/14/2011 8 comments An executive panel discussion at the Semicon West fab tool vendor trade show revealed some uncertainty on the pending technology transitions to extreme ultraviolet lithography and 450-mm wafers.
Samsung study rejects cancer claims News & Analysis 7/14/2011 5 comments A study commissioned by consumer electronics giant Samsung Electronics Co. Ltd. has found no evidence that workers contracted cancer as a result of working at its wafer fabs, according to reports.
ASML sees slowdown in orders News & Analysis 7/13/2011 7 comments ASML Holding reported that second quarter orders were lighter than expected, even as the lithography giant reported record sales for the quarter and said it remained on track for a record sales year.
Hynix, Toshiba team up on MRAM News & Analysis 7/13/2011 13 comments Hynix Semiconductor Inc. and Toshiba Corp. have agreed to develop spin-transfer torque magnetoresistance RAMs together with both saying that the technology is an important next-generation non-volatile memory.
Analyst sees soft June, lowers chip forecast News & Analysis 7/13/2011 1 comment The three-month average of global chip sales for June is going to be $24.6 billion, down compared with $25.03 billion reported for May by the World Semiconductor Trade Statistics organization, according to Bruce Diesen, an analyst at Carnegie Group (Oslo, Norway).
Semicon keynoter urges new business models News & Analysis 7/13/2011 1 comment The semiconductor industry is 53 years old, accounts for 0.6 percent of worldwide GDP, and should account for more in years to come, according to Tien Wu, chief operating officer of test and packaging provider ASE.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Are the design challenges the same as with embedded systems, but with a little developer- and IT-skills added in? What do engineers need to know? Rick Merritt talks with two experts about the tools and best options for designing IoT devices in 2016. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.