Vicor Power offers efficient buck regulators Product News 7/17/2012 Post a comment Vicor has introduced Picor PI33XX Cool-PowerZVS buck regulator series with Zero-Voltage Switching (ZVS) topology that can convert input supplies ranging from 8V to 36V to output voltages from 1V to 16V and output current up to 10A for power delivery up to 120W.
DSP chip makes mobile sound louder Product News 7/17/2012 8 comments An audio DSP chip from NXP is able to boost the output power of small speakers used in smartphones and tablet computers by a factor of five while still preventing damage to the speakers.
Samsung acquires CSR's mobile business News & Analysis 7/17/2012 13 comments Samsung has agreed to pay CSR plc $310 million for its handset connectivity and location operations and the associated technology. Samsung has also agreed to invest an additional $34.4 million to take a 4.9 percent stake in publicly-held CSR.
Xilinx CTO: Focus on what matters to customers News & Analysis 7/12/2012 4 comments The value of Moore's Law—the doubling of the number of transistors in a chip every 18 months—is not just in the cost reduction it offers but more importantly in the added value that chip makers can create for customers, according to Ivo Bolsens, chief technology officer at Xilinx.
Ecosystem emerges around new mobile chip tech News & Analysis 7/11/2012 13 comments A consortium touting fully depleted silicon-on-insulator technology for mobile apps is presenting a united front in promoting the process technology as a viable alternative to Intel’s FinFET manufacturing approach.
Thin Film printed electronics selected for smart packaging News & Analysis 7/11/2012 6 comments Bemis Company Inc. (Neenah, Wisc.), a producer of films and packaging for the food and healthcare industries, is working with printed electronics pioneer Thin Film Electronics ASA (Oslo, Norway) to develop a flexible sensing film that can wirelessly communicate data.
Applied cuts annual sales target on foundry weakness News & Analysis 7/10/2012 Post a comment Semiconductor production equipment vendor Applied Materials cut its sales outlook for its fiscal year 2012, which ends in October, citing weaker than expected near-term demand in its semiconductor business, primarily among foundry customers.
AMD warns of Q2 sales shortfall News & Analysis 7/9/2012 1 comment AMD cut its estimate for second quarter sales, citing lower than expected sales in China and Europe and a weaker consumer market for PCs.
Atmel unveils two serial EEPROM lines Product News 7/9/2012 2 comments The AT24MAC series provides pre-programmed MAC/EUI node identity addresses, while the AT24CS devices include factory-programmed, read-only serial numbers for easier inventory control.
Indoor femtocell market flat in 2012, says ABI News & Analysis 7/9/2012 4 comments The market for enterprise and consumer femtocell equipment for communications, also referred to as indoor small cells, will be flat in 2012 in terms of volumes compared with 2011, according to market research firm ABI Research.
UMC June sales move into annual growth News & Analysis 7/9/2012 1 comment Foundry United Microelectronics Corp. has announced sales for June of NT$9,289 million (about $310 million) up 1.1 percent on the same figure in 2011 and up 0.9 percent on the sale in May 2012. June's sales result was UMC's first monthly sales figure to be ahead of its equivalent in 2011.
Aeroflex offers 16-Mbit, 64-Mbit rad-hard MRAMs Product News 7/6/2012 2 comments Aeroflex Inc., a supplier of electronic components for military and aerospace applications, has announced the availability of three magnetoresistive random access memory components made using a manufacturing license from Everspin Technologies.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.