Breaking News
News Analysis
Content tagged with Semiconductors posted in August 2000
Page 1 / 5   >   >>
NEC, In-System to develop ICs for USB 2.0 spec
News & Analysis  
8/31/2000   Post a comment
BOISE, Idaho -- In-System Design Inc. (ISD) today announced a partnership with NEC Corp. to co-develop a family of devices based on a new Universal Serial Bus (USB) 2.0 standard. Under a partnership agreement, ISD's digital expertise will be combined with NEC's analog capabilities to create what the companies claim will be the world's first single-chip solutions for the USB 2.0 specification.
Tundra to buy chip-layout specialist Quadic for $45 million
News & Analysis  
8/31/2000   Post a comment
KANATA, Ontario--Tundra Semiconductor Corp. here today announced plans to acquire Quadic Systems Inc., an analog chip developer and design-layout specialist based in South Portland, Maine. Tundra said the purchase will help it reduce development time for high-speed interconnect technology in communications-chip applications. Tundra plans to buy Quadic for stock and cash, valued at up to $45 million.
Innocomm shifts to fabless model from wireless-IC design house
News & Analysis  
8/31/2000   Post a comment
SAN DIEGO -- Two-year-old Innocomm Wireless Inc. here has turned itself into a fabless chip company from its start as an IC design house for radio-frequency and mixed-signal devices. The San Diego startup said it now specializes in chip sets for wireless PCs and automation products in the home and office.
Wolfson's stereo DAC integrates all audio functions for digital TV
News & Analysis  
8/31/2000   Post a comment
EDINBURGH, Scotland -- Wolfson Microelectronics Ltd. today announced a single-chip digital-to-analog converter (DAC) that integrates all the functions needed for audio processing in digital TVs and set-top boxes.
Top AMD executive departs suddenly
News & Analysis  
8/31/2000   Post a comment
TI says it won't rush Burr-Brown merger; Tucson fab upgrade considered
News & Analysis  
8/31/2000   Post a comment
TUCSON, Ariz. -- Now that Texas Instruments Inc. has completed its $7.6 billion acquisition of Burr-Brown Corp., the real tricky part of M&A has begun--merger. Top TI officials promise to take a steady-but-not-hurried pace in merging the venerable analog chip supplier into Texas Instruments. In doing so, TI will put customer requirements ahead of merger activities, and it will consider upgrading Burr-Brown's 4-inch wafer fab in Tucson, while maintaining existing foundry agreements, said managers
On Semi to triple R&D and target power management, broadband ICs
News & Analysis  
8/31/2000   Post a comment
PHOENIX -- On Semiconductor today announced plans to triple spending on research and development by 2001, compared to 1999 levels, with a long-term target of R&D expenditures set at 5-to-6% of revenues after next year. The year-old spin-off from Motorola Inc. spent about $37 million on R&D in 1999, which represented 2.3% of its revenues.
Anadigics enters new wireless net arena, invests in Embedded Wireless
News & Analysis  
8/30/2000   Post a comment
Warren, N.J. -- Anadigics Inc. here entered the emerging personal area networking market, announcing that it has made an undisclosed equity investment in Embedded Wireless Devices Inc. of Pleasanton, Calif. Anadigics and Embedded Wireless plan to co-develop a range of chips, based on several new-but-incompatible 2.4-GHz wireless standards, such as Bluetooth, 802.11, and others.
Alliance to invest $75 million in Tower's new foundry fab in Israel
News & Analysis  
8/30/2000   Post a comment
MIGDAL HAEMEK, Israel -- U.S. memory supplier Alliance Semiconductor Corp. today announced it will invest $75 million in a planned 8-inch wafer fab planned by silicon foundry supplier Tower Semiconductor Ltd. here. Alliance, based in Santa Clara, Calif., joins SanDisk Corp. in nearby Sunnyvale as investment partners in Tower's planned second fab. Tower expects to start construction on the long-planned fab this year after securing government funding.
Dense-Pac applies chip-stacking packaging to DSPs
News & Analysis  
8/30/2000   Post a comment
GARDEN GROVE, Calif.--Dense-Pac Microsystems Inc. here today introduced a new three-dimensional chip packaging technology for digital signal processors--enabling up to four DSP chips to be stacked on top of each other in a single package.
AMD aims 32-Mbit simultaneous read/write flash at portable systems
News & Analysis  
8/30/2000   Post a comment
SUNNYVALE, Calif.--Advanced Micro Devices Inc. today launched a new 32-megabit flash memory chip, which combines low-voltage technology with a simultaneous read/write architecture for portable systems applications. The 1.8-volt flash is capable of read-access times as fast as 110 nanoseconds with up to 60% less power consumption, compared to 3-V devices, said AMD.
inSilicon licenses Arm's system-on-chip peripherals
News & Analysis  
8/29/2000   Post a comment
SAN JOSE -- inSilicon Corp. today announced it has licensed Arm Ltd.'s MicroPack design kit and PrimeCell peripherals for use in system-on-chip (SoC) development. The San Jose company plans to offer Arm's peripheral functions in sub-licensing agreements with customers, who are designing SoC chips using inSilicon's communications intellectual property.
Philips aims analog frontend ICs at range of CCD camera segments
News & Analysis  
8/29/2000   Post a comment
EINDHOVEN, the Netherlands -- Philips Semiconductors today announced a new family of analog frontend (AFE) chips that provide 10- and 12-bit resolution for digital still cameras and camcorders. The new integrated analog chips are aimed at a range of professional and consumer camera market segments, supporting charge-couple device (CCD) applications with speeds of 18-to-40 million samples per second (MSPS).
Conexant offers chip set for V.90 modem, Ethernet on single card
News & Analysis  
8/29/2000   Post a comment
NEWPORT BEACH, Calif.--Conexant Systems Inc. today rolled out a new V.90/Ethernet chip set for mobile computing, based on a mini-peripheral component interconnect form factor, called mini-PCI. The solution puts both the V.90 modem and Ethernet connection on a single card, saving costs in notebook PCs, said the company.
Nvidia files suit against 3dfx
News & Analysis  
8/28/2000   Post a comment
SAN JOSE -- Nvidia Corp. here today announced a lawsuit against 3dfx Interactive Inc. for alleged patent infringement in the graphics chip market. The suit claims that 3dfx of San Jose has infringed upon five of Nvidia's patents involving graphics-acceleration technology used in PCs.
Page 1 / 5   >   >>


Flash Poll
EE Life
Frankenstein's Fix, Teardowns, Sideshows, Design Contests, Reader Content & More
Max Maxfield

MSGEQ7-Based DIY Audio Spectrum Analyzer: Testing
Max Maxfield
13 comments
In my previous column on this topic, we discussed the step-by-step construction of the first pass at a MSGEQ7-based DIY audio spectrum analyzer for use in my BADASS Display project. Of ...

Karen Field

June 2014 Cartoon Caption Winner
Karen Field
13 comments
Congratulations to "Wnderer" for submitting the winning caption for our June cartoon, after much heated conversation by our judges, given the plethora of great entries.

Jeremy Cook

Inspection Rejection: Why More Is Less in a Vision System
Jeremy Cook
3 comments
Albert Einstein has been quoted as saying, "Everything should be as simple as possible, but not simpler." I would never claim to have his level of insight -- or such an awesome head of ...

Jeremy Cook

Machine Fixes That Made Me Go 'DUH!'
Jeremy Cook
21 comments
As you can see in my bio at the end of this article, I work as a manufacturing engineer. One of my favorite things that happens on a Friday late in the afternoon is to hear my phone ring ...

Top Comments of the Week
Like Us on Facebook
EE Times on Twitter
EE Times Twitter Feed

Datasheets.com Parts Search

185 million searchable parts
(please enter a part number or hit search to begin)