NEC, In-System to develop ICs for USB 2.0 spec News & Analysis 8/31/2000 Post a comment BOISE, Idaho -- In-System Design Inc. (ISD) today announced a partnership with NEC Corp. to co-develop a family of devices based on a new Universal Serial Bus (USB) 2.0 standard. Under a partnership agreement, ISD's digital expertise will be combined with NEC's analog capabilities to create what the companies claim will be the world's first single-chip solutions for the USB 2.0 specification.
Tundra to buy chip-layout specialist Quadic for $45 million News & Analysis 8/31/2000 Post a comment KANATA, Ontario--Tundra Semiconductor Corp. here today announced plans to acquire Quadic Systems Inc., an analog chip developer and design-layout specialist based in South Portland, Maine. Tundra said the purchase will help it reduce development time for high-speed interconnect technology in communications-chip applications. Tundra plans to buy Quadic for stock and cash, valued at up to $45 million.
Innocomm shifts to fabless model from wireless-IC design house News & Analysis 8/31/2000 Post a comment SAN DIEGO -- Two-year-old Innocomm Wireless Inc. here has turned itself into a fabless chip company from its start as an IC design house for radio-frequency and mixed-signal devices. The San Diego startup said it now specializes in chip sets for wireless PCs and automation products in the home and office.
TI says it won't rush Burr-Brown merger; Tucson fab upgrade considered News & Analysis 8/31/2000 Post a comment TUCSON, Ariz. -- Now that Texas Instruments Inc. has completed its $7.6 billion acquisition of Burr-Brown Corp., the real tricky part of M&A has begun--merger. Top TI officials promise to take a steady-but-not-hurried pace in merging the venerable analog chip supplier into Texas Instruments. In doing so, TI will put customer requirements ahead of merger activities, and it will consider upgrading Burr-Brown's 4-inch wafer fab in Tucson, while maintaining existing foundry agreements, said managers
On Semi to triple R&D and target power management, broadband ICs News & Analysis 8/31/2000 Post a comment PHOENIX -- On Semiconductor today announced plans to triple spending on research and development by 2001, compared to 1999 levels, with a long-term target of R&D expenditures set at 5-to-6% of revenues after next year. The year-old spin-off from Motorola Inc. spent about $37 million on R&D in 1999, which represented 2.3% of its revenues.
Anadigics enters new wireless net arena, invests in Embedded Wireless News & Analysis 8/30/2000 Post a comment Warren, N.J. -- Anadigics Inc. here entered the emerging personal area networking market, announcing that it has made an undisclosed equity investment in Embedded Wireless Devices Inc. of Pleasanton, Calif. Anadigics and Embedded Wireless plan to co-develop a range of chips, based on several new-but-incompatible 2.4-GHz wireless standards, such as Bluetooth, 802.11, and others.
Alliance to invest $75 million in Tower's new foundry fab in Israel News & Analysis 8/30/2000 Post a comment MIGDAL HAEMEK, Israel -- U.S. memory supplier Alliance Semiconductor Corp. today announced it will invest $75 million in a planned 8-inch wafer fab planned by silicon foundry supplier Tower Semiconductor Ltd. here. Alliance, based in Santa Clara, Calif., joins SanDisk Corp. in nearby Sunnyvale as investment partners in Tower's planned second fab. Tower expects to start construction on the long-planned fab this year after securing government funding.
Dense-Pac applies chip-stacking packaging to DSPs News & Analysis 8/30/2000 Post a comment GARDEN GROVE, Calif.--Dense-Pac Microsystems Inc. here today introduced a new three-dimensional chip packaging technology for digital signal processors--enabling up to four DSP chips to be stacked on top of each other in a single package.
AMD aims 32-Mbit simultaneous read/write flash at portable systems News & Analysis 8/30/2000 Post a comment SUNNYVALE, Calif.--Advanced Micro Devices Inc. today launched a new 32-megabit flash memory chip, which combines low-voltage technology with a simultaneous read/write architecture for portable systems applications. The 1.8-volt flash is capable of read-access times as fast as 110 nanoseconds with up to 60% less power consumption, compared to 3-V devices, said AMD.
inSilicon licenses Arm's system-on-chip peripherals News & Analysis 8/29/2000 Post a comment SAN JOSE -- inSilicon Corp. today announced it has licensed Arm Ltd.'s MicroPack design kit and PrimeCell peripherals for use in system-on-chip (SoC) development. The San Jose company plans to offer Arm's peripheral functions in sub-licensing agreements with customers, who are designing SoC chips using inSilicon's communications intellectual property.
Philips aims analog frontend ICs at range of CCD camera segments News & Analysis 8/29/2000 Post a comment EINDHOVEN, the Netherlands -- Philips Semiconductors today announced a new family of analog frontend (AFE) chips that provide 10- and 12-bit resolution for digital still cameras and camcorders. The new integrated analog chips are aimed at a range of professional and consumer camera market segments, supporting charge-couple device (CCD) applications with speeds of 18-to-40 million samples per second (MSPS).
Conexant offers chip set for V.90 modem, Ethernet on single card News & Analysis 8/29/2000 Post a comment NEWPORT BEACH, Calif.--Conexant Systems Inc. today rolled out a new V.90/Ethernet chip set for mobile computing, based on a mini-peripheral component interconnect form factor, called mini-PCI. The solution puts both the V.90 modem and Ethernet connection on a single card, saving costs in notebook PCs, said the company.
Nvidia files suit against 3dfx News & Analysis 8/28/2000 Post a comment SAN JOSE -- Nvidia Corp. here today announced a lawsuit against 3dfx Interactive Inc. for alleged patent infringement in the graphics chip market. The suit claims that 3dfx of San Jose has infringed upon five of Nvidia's patents involving graphics-acceleration technology used in PCs.
Battle-hardened veterans of the electronics industry have heard of the “connected car” so often that they assume it’s a done deal. But do we really know what it takes to get a car connected and what its future entails? Join EE Times editor Junko Yoshida as she moderates a panel of movers and shakers in the connected car business. Executives from Cisco, Siemens and NXP will share ideas, plans and hopes for connected cars and their future. After the first 30 minutes of the radio show, our listeners will have the opportunity to ask questions via live online chat.