Hitachi to eliminate 14,700 jobs, cut chip capital spending 57% News & Analysis 8/31/2001 Post a comment TOKYO -- Hitachi Ltd. today outlined massive cutbacks in its businesses, including the elimination of 14,700 jobs worldwide--about 4% of its workforce--and restructuring of its trouble semiconductor division. The company called the moves "emergency management measures" aimed at reviving turnaround efforts that began two years ago.
Arc and Siroyan catch ARM's Amba bus News & Analysis 8/31/2001 Post a comment ARC International and Siroyan have joined the list of companies to adopt ARM's Amba as an on-chip system bus, making it easier for both companies to plug into systems and IP built around it.
3DSP lines up software development support from India's Wipro News & Analysis 8/30/2001 Post a comment BANGALORE, India --Wipro Technologies here today announced it has joined a partnership program at U.S.-based 3DSP Corp. to develop MPEG-4 video software for digital signal processing (DSP) ICs. The two companies said they are also planning an ongoing alliance for wireless and video applications, based on 3DSP's platform.
Hynix samples first 0.13-micron DDR SDRAM devices News & Analysis 8/30/2001 Post a comment SAN JOSE -- During the Intel Developer Forum (IDF), Hynix Semiconductor Inc. here announced that it has begun sampling its first 0.13-micron products--a family of 512-megabit double-data-rate (DDR) SDRAMs.
At the same time, the Korean chip giant also rolled out a new line of low-profile memory modules that supports DDR SDRAMs.
Samsung steps up flash memory efforts, shrinking process ahead of DRAMs News & Analysis 8/30/2001 Post a comment SEOUL -- Samsung Electronics Co. Ltd. today claimed to be shipping the world's first engineering samples of 1-gigabit NAND flash memory devices, fabricated with a 0.12-micron technology. The Korean chip giant said the new nonvolatile flash chip has leaped ahead of advanced DRAM manufacturing technologies, which are now based on 0.15-micron design rules.
Cree's GaN microwave devices installed on ISS News & Analysis 8/29/2001 Post a comment Cree has announced that its GaN HEMT microwave devices and epiwafer materials were successfully installed aboard the International Space Station (ISS), after being launched into space by the Space Shuttle Discovery earlier this month
Motorola may integrate DRAM controller into PowerPC News & Analysis 8/28/2001 Post a comment To maximize data bandwidth and reduce memory latency, Motorola Inc. said it will likely integrate a DRAM controller directly onto a future high-end PowerPC processor a trend that has started to take hold among companies making communications-oriented processors.
TI attempts to speed adoption of high-speed 1394b link News & Analysis 8/27/2001 Post a comment SAN JOSE -- Texas Instruments Inc. today announced it was the first chip supplier to demonstrate 800-megabit-per-second devices for the industry's new 1394b serial bus standard, which doubles the speed of existing 1394 links and increases distances by more than 20 times to 100 meters.
Intel prepares for server chip set revival News & Analysis 8/23/2001 Post a comment Intel Corp. this week made its most comprehensive public disclosure to date of a chip set designed to propel its CPUs into highly scalable, multiprocessing systems. The microprocessor giant said at the Hot Chips conference that its forthcoming 870 chip set will allow OEMs to build 16 processors into a single system.
Router promises smart mobility for wireless IP News & Analysis 8/23/2001 Post a comment PacketAir Networks Inc plans to break the subscriber-management bottleneck of the mobile Internet with router-based software that will move wireless LANs and WANs to an all-Internet Protocol format immediately, the company said
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Are the design challenges the same as with embedded systems, but with a little developer- and IT-skills added in? What do engineers need to know? Rick Merritt talks with two experts about the tools and best options for designing IoT devices in 2016. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.