SIA slightly raises Q3 chip forecast News & Analysis 8/4/2003 Post a comment The Semiconductor Industry Association (SIA) has slightly raised its chip forecast for the third quarter of 2003, although the trade group has not altered its 10.1 percent growth prediction for 2003.
ASIC evolution News & Analysis 8/4/2003 Post a comment The ASICs business is a study in market dynamics and supplier adaptation. Although industry watchers expect the sector to grow the next few years, declining ASIC design starts will conspire to offset rising revenue and an increase in unit volume per design.
Pericom seeks to leap in high-end clock ICs News & Analysis 8/4/2003 Post a comment With a relatively small acquisition, Pericom Semiconductor Corp. is hoping to secure a solid stake in the market for high-performance clock ICs and firmly establish one of the main pillars of its growth strategy.
Low-latency server DIMMs emphasize speed News & Analysis 8/4/2003 Post a comment Two DRAM module manufacturers, Smart Modular Technologies Inc. and Kingston Technology Co., have separately introduced nonstandard, low-latency 2.2.2 PC2100 server DIMMs for streaming video and high-performance enterprise applications.
Cypress Doubles Dual-Port Memory Density to 18 Mb News & Analysis 8/4/2003 Post a comment Saying that system design activity has perked up, Cypress Semiconductor Corp. today will introduce what it calls the first 18-Mbit dual-port memory, which it hopes will find a home in switches, routers and basestations that are soon to
hit the market.
PalmChip asserts patent approval gives it broad rights to SoC design News & Analysis 8/4/2003 Post a comment A sweeping patent granted to PalmChip Corp. late last month covers the techniques used to implement on-chip CPU bus structures in nearly all modern SoC designs. Vendors of CPU or system-interconnect intellectual property (IP) and most SoC design teams may be infringing the new patent, PalmChip warned.
PalmChip patent looms over SoC on-chip buses News & Analysis 8/4/2003 Post a comment A patent granted to PalmChip Corp. on July 29 covers the techniques used to implement on-chip CPU bus structures in nearly all modern system-on-chip designs, the company said. CPU or system-interconnect intellectual-property vendors and most SoC design teams may be infringing the new patent, PalmChip warned.
Analysis: Comics yield to a literate MPU News & Analysis 8/4/2003 Post a comment With the speed of a Bruce Lee karate chop, Hong Kong-based Culturecom Holdings Ltd. is shedding its past as a hawker of popular kung fu titles, like Dragon and Tiger Heroes, and springing forth with a Chinese character capable microprocessor.
Flat June chip sales up 10% y-on-y, says SIA News & Analysis 8/4/2003 Post a comment Worldwide sales of semiconductors totalled $12.54 billion in June, 2003 up less than 1 percent from $12.50 billion in May 2003 and up 10.4 percent from $11.35 billion in June 2002, according to Global Sales Report (GSR) figures released by the Semiconductor Industry Association (SIA) on Monday (August 4, 2003).
Alliance to craft mobile MPU interface News & Analysis 8/1/2003 Post a comment What began last December as an agreement between Texas Instruments Inc. and STMicroelectronics Inc. to standardize interfaces for 2.5G and 3G mobile phone application processors has become a broader industry consortium.
Digital GaAs market is dead, says research firm News & Analysis 8/1/2003 Post a comment The digital market for gallium arsenide chips is dead according to Strategy Analytics Inc., a market prediction and analysis company. From a high point of $600 million in 2000, merchant revenues from digital GaAs ICs collapsed to $55 million in 2002, the company said.
Winbond narrows loss on falling sales News & Analysis 8/1/2003 Post a comment Winbond Electronics Corp. announced Friday (Augut 1, 2003) net sales for the 2003 second quarter of NT$6,228 million (about US$179 million), with the net loss totaling NT$791 million (about US$23 million).
New Group to Define Interfaces for Mobile Processors News & Analysis 8/1/2003 Post a comment What began last December as an agreement between
Texas Instruments and STMicroelectronics to standardize interfaces
for application processors targeting 2.5G and 3G mobile phones has
grown into a broader industry consortium called the Mobile Industry
Processor Interface (MIPI) Alliance that now includes ARM Ltd. and