Osram sues Samsung, LG in South Korea News & Analysis 8/23/2011 Post a comment German high-tech lighting manufacturer Osram and its subsidiary, Osram Opto Semiconductors, filed multiple lawsuits in South Korea against companies controlled by LG Group and Samsung, claiming that the companies are infringing core Osram patents.
Jedec readies DDR4 memory spec News & Analysis 8/22/2011 6 comments The Double Data Rate 4 memory chip standard will include three data width offerings, differential signaling, data masking and a new termination scheme, according to the Jedec Solid State Technology Association, the standards developer that creates the DDR standards.
WiMAX subscriptions surpass 20 million globally News & Analysis 8/21/2011 4 comments The WiMAX Forum has announced that WiMAX technology has broken the 20 million global subscriber mark. This significant milestone comes among reports from operators around the world reporting dramatic subscriber growth.
Hittite phase shifter claims one octave bandwidth Product News 8/21/2011 Post a comment Hittite Microwave Corporation has introduced a new SMT packaged MMIC analog phase shifter which is well suited for phased array, industrial sensors, and clock and local oscillator (LO) synchronization applications in fiber optic, military, test equipment and industrial/medical equipment.
Analyst: Marvell report 'better than feared' News & Analysis 8/19/2011 4 comments A Wall Street analyst reiterated his "buy" rating on Marvell Technology Group, one day after the company reported quarterly sales and profit that exceeded consensus analysts' expectations and guided for sequential growth of about 7 percent for the current quarter.
SEMI book-to-bill tumbles in July News & Analysis 8/18/2011 1 comment The ratio of sales bookings to billings among North American semiconductor capital equipment vendors tumbled for a third straight month in July, according to the fab tool vendor trade group SEMI.
Samsung samples 30nm, 32GB DDR3 RDIMMs Product News 8/18/2011 2 comments In an effort to deliver higher performance with lower power consumption to the next-generation server market, Samsung has developed 32GB DDR3 RDIMMs that use 3D through silicon via (TSV) package technology.
HP to spin out PCs, drop webOS products News & Analysis 8/18/2011 39 comments Hewlett-Packard CEO Léo Apotheker confirmed that rhe company will explore the spin out or sale of its PC business and said HP would discontinue operations for webOS devices, specifically the TouchPad tablet and webOS phones.
SanDisk flash drive targets advanced tablets Product News 8/18/2011 2 comments SanDisk Corporation recently introduced the iNAND™ Extreme® embedded flash drive (EFD), the first in a new line of products from the company that is designed for high-end tablets running advanced operating systems and data-intensive applications.
On Semiconductor NCN1188 link switch Product News 8/18/2011 Post a comment ON Semiconductor introduced the NCN1188, which is claimed to be the industry's first 3:1 high speed USB switch with the capacity to support the new Mobile High Definition Link interface standard for HD video and digital audio.
IR's chief sees weakened end-market demand News & Analysis 8/18/2011 1 comment International Rectifier reported quarterly sales in line with analysts' expectations, but CEO Oleg Khaykin said the company expects revenue to dip due to weakened end-market demand.
IBM demos cognitive computer chips News & Analysis 8/18/2011 28 comments IBM demonstrated proof-of-concept cognitive computing chips that replicate the functions of neurons and synapses in the brain with digital integrators and crossbar switches.
EE Times' coverage of ESC Boston News & Analysis 8/18/2011 Post a comment EE Times' continuing coverage of ESC Boston, the most complete technical conference and expo in the East, set for Sept. 26-29 at the Hynes Convention Center.
Freescale sells Scottish fab News & Analysis 8/17/2011 5 comments The Freescale Semiconductor fab in East Kilbride, Scotland, which ceased chip production two years ago, has been sold to a real estate developer for undisclosed financial terms.
Vishay SiB437EDKT P-channel MOSFET Product News 8/17/2011 Post a comment Vishay Siliconix claims its 8 V P-Channel TrenchFET Power MOSFET offers industry's lowest on-resistance down to 34 mO at 4.5 V in the 1.6 mm by 1.6 mm footprint area with sub-0.8-mm profile.
EE Times launches China fabless IC report News & Analysis 8/16/2011 2 comments UBM Electronics, the publisher of EE Times, announced the availability of the China Fabless Profile, a special report created by EE Times Confidential and focused on China's fast-growing fabless semiconductor sector.
Renesas files patent suit against Vizio News & Analysis 8/15/2011 Post a comment Renesas Electronics filed patent infringement complaints against television maker Vizio with the U.S. International Trade Commission and in U.S. federal court in Texas, according to a report by the Bloomberg news service.
SMIC's COO resigns in latest shakeup News & Analysis 8/15/2011 4 comments In the latest management shakeup to hit Chinese chip foundry SMIC, the company announced that Simon Yang, chief operating officer, will resign effective Sept. 5.
Viewpoint: Don't believe the hype News & Analysis 8/12/2011 6 comments The $4.5 billion Nortel patent sale, which has lead to a flurry of commentary about a bubble in patent valuation, was an outlier, not a trend. Here's why.
Siano, Innofidei settle mobile TV spat News & Analysis 8/12/2011 Post a comment Siano Mobile Silicon Ltd. and Innofidei Inc., two fabless chip companies competing in mobile TV applications, have agreed to drop court cases and other proceedings against each other in China and the United States.
TSMC's A6 processor to respin, says report News & Analysis 8/12/2011 17 comments Foundry chipmaker Taiwan Semiconductor Manufacturing Co. Ltd. (TSMC) – said to have started trial manufacturing of the ARM-based A6 processor for Apple – will put the IC through another tape-out for the "production design" in the first quarter of 2012, according to the Taiwan Economic News.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Are the design challenges the same as with embedded systems, but with a little developer- and IT-skills added in? What do engineers need to know? Rick Merritt talks with two experts about the tools and best options for designing IoT devices in 2016. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.