SEMI: Wafer shipments increased in Q2 News & Analysis 8/3/2011 1 comment Worldwide silicon wafer area shipments increased 5 percent in the second quarter compared to the first quarter, according to fab tool vendor trade organization SEMI's Silicon Manufacturers Group.
GreenPeak launches RF4CE on USB stick Product News 8/2/2011 3 comments GreenPeak Technologies BV has produced a reference design for a ZigBee RF4CE wireless standard receiver on a USB stick. The company is offering it to provide a quick upgrade to RF4CE wireless remote control for equipment that has a USB port.
Mentor CEO Rhines fears foundry oversupply News & Analysis 8/2/2011 5 comments The semiconductor industry is projected to grow by 7.2 percent in 2011, but Walden Rhines, chairman and CEO of EDA vendor Mentor Graphics, sounds a note of caution about maintaining this growth in 2012.
HiSilicon extends ARM licenses for 3G/4G comms News & Analysis 8/2/2011 2 comments HiSilicon Technologies Co. Ltd. has licensed a range of ARM technology for use across the breadth of its communications chip design activities including: 3G/4G basestations, networking infrastructure and mobile computing applications.
Dongbu aids Chinese image sensor entry News & Analysis 8/2/2011 3 comments Foundry Dongbu HiTek Co. Ltd. has announced it has begun volume production of high dynamic range CMOS image sensor chips for BYD Microelectronics, a subsidiary of BYD Co. Ltd., a Chinese manufacturer of products ranging from batteries to electric vehicles.
RF chip vendor files for $230 million IPO News & Analysis 8/1/2011 3 comments Chip and component vendor M/A-COM Technology Solutions said it filed an S-1 with the U.S. Securities and Exchange Commission for a proposed initial public offering of common stock.
Key exec, EDA 360 author, leaving Cadence News & Analysis 8/1/2011 7 comments The sudden departure of Cadence Design Systems' chief marketing officer was hastened by a reorganization of marketing functions within the company that a longtime analyst believes could signal a coming change in CEO at the EDA vendor.
Global Q2 chip sales confirm falling market News & Analysis 8/1/2011 4 comments Global chip sales in the second quarter were down 2 percent compared to equivalent figure in the previous quarter and down 0.5 percent from the second quarter in 2010, according to the Semiconductor Industry Association.
MimoOn LTE software ported to TI chips Product News 8/1/2011 Post a comment MimoOn GmbH (Duisburg, Germany), a developer of software-defined radio technology, has said it has implemented LTE PHY software on KeyStone chips from Texas Instruments Inc. for small cell basestations.
Indian chip market to grow 15% in 2011 News & Analysis 8/1/2011 2 comments The 2011 Indian semiconductor market is going to be worth $8.2 billion, up 15.5 percent compared to $7.1 billion in 2010, according to an EE Herald report that references market research company Gartner as its source.
Tower makes Ramon rad-hard processor News & Analysis 8/1/2011 Post a comment Tower Semiconductor Ltd., a specialty foundry that trades as TowerJazz, and Ramon Chips Ltd., a fabless company that specializes in space applications, have announced they have completed a second generation of radiation-hardened processors.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Are the design challenges the same as with embedded systems, but with a little developer- and IT-skills added in? What do engineers need to know? Rick Merritt talks with two experts about the tools and best options for designing IoT devices in 2016. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.