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Content tagged with Semiconductors posted in September 2001
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Alliance Semi lays off 10% of workers, plans pay cuts to reduce losses
News & Analysis  
9/28/2001   Post a comment
SANTA CLARA, Calif.-- In an attempt to return to profitability, memory supplier Alliance Semiconductor Corp. here today announced it will cut its worldwide workforce by 10%, and the company said its remaining employees will take a 5-to-15% pay cut effective Oct. 1.
Elpida delays 300mm DRAM wafer fab
Product News  
9/28/2001   Post a comment
Elpida Memory Inc. announced it will delay for nine months the start of equipping a new 300mm wafer fab in Hiroshima, Japan.
Genesis Microchip to buy display processor supplier Sage for $241 million in stock
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9/28/2001   Post a comment
SAN JOSE -- Genesis Microchip Inc. here today announced plans to acquire digital display processor supplier Sage Inc. in nearby Milpitas for $241 million in stock to expand growth in consumer video IC applications worldwide.
IC surface assessed using nanotube tip
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9/28/2001   Post a comment
A team based at Nasa's Ames Research Center in California has developed a multi-walled carbon nanotube as the tip of an atomic force microscope.
Infineon launches 32-bit telematics controller based on TriCore architecture
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9/27/2001   Post a comment
MUNICH--Infineon Technologies AG today introduced a dedicated telematics controller for information and entertainment applications in consumer systems and automobiles. The "infotainment" telematics controller is based on Infineon's 32-bit TriCore Unified Processor.
STMicro tailors flash and SRAM chips for automotive systems
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9/27/2001   Post a comment
GENEVA -- STMicroelectronics today announced an expansion of its memory offering for automotive applications, including four new 16-megabit flash chips configured with 32-bit wide data buses and a 128-kilobit (by-16-bit) SRAM dedicated for automotive system designs.
Intel creates Web-based telematics center for wireless computing systems in cars
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9/27/2001   Post a comment
BADEN, Germany--During an automotive trade show here today, Intel Corp. announced a telematics design center to offer Web-based development and technical support for deployment of new wireless computing solutions in cars.
Samsung readies 576-Mbit Rambus DRAM with 0.12-micron process
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9/27/2001   Post a comment
SEOUL -- Samsung Electronics Co. Ltd. today claimed development of the industry's first 576-megabit Rambus DRAM. The new memory is based on 0.12-micron processes and operates at 1.066-GHz frequencies, making it about eight times faster than today's PC133 synchronous DRAMs, said the Korean chip maker.
Hitachi scheme paves way for 1.0-volt Gbit DRAMs
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9/26/2001   Post a comment
Researchers at Hitachi Ltd.'s Central Research Laboratories (CRL) have created a sense amplifier circuit technology that they claim will allow the development of 1-volt multigigabit DRAMs.
Intel expands chip-set patent fight with Via into Germany, U.K. and Hong Kong
News & Analysis  
9/26/2001   Post a comment
SANTA CLARA, Calif.--Intel Corp. today announced an expansion of its Pentium 4 chip-set patent fight with Taiwan-based Via Technologies Inc., which is now being sued in Germany, the United Kingdom, and Hong Kong in addition to the United States.
Winbond packs speech synthesizer in system-monitoring chip
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9/26/2001   Post a comment
HSINCHU, Taiwan -- Winbond Electronics Corp. today announced the first hardware-monitoring ICs with speed functionality and compliance to the new Alert Standard Forum (ASF) specification for Internet protocol (IP) capable systems.
Intel claims world's first 256-Mbit flash in new family of memories
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9/26/2001   Post a comment
SANTA CLARA, Calif. -- Intel Corp. here today announced its third-generation, flash memory products, including what the company claims is the world's first 256-megabit, NOR-based chip.
Hynix prepares to ramp 'low-cost' 0.15-micron process for DRAMs by year's end
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9/26/2001   Post a comment
SAN JOSE -- The U.S. subsidiary of Hynix Semiconductor Inc. today said the Korean IC maker will begin using a new 0.15-micron process technology, code-named "Blue Chip," to deliver 128- and 256-megabit synchronous DRAMs before the end of 2001.
Here come plastic ICs from startup FlexICs
News & Analysis  
9/26/2001   Post a comment
MILPITAS, Calif. -- After years of research and development, foundry startup FlexICs Inc. here will soon begin shipping samples of the world's first semiconductors fabricated on six-inch plastic substrates.
Atmel joins German R&D center for advanced analog ICs in communications
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9/26/2001   Post a comment
ULM, Germany--Silicon Valley-based Atmel Corp. today announced it was joining Multilink Technology Corp. of New Jersey and five-year-old GaAs foundry supplier United Monolithic Semiconductors in a new R&D center at the University of Ulm to pursue ICs with analog functions for wireless and high-speed optoelectronics systems.
Infineon to cut capital spending in half during next fiscal year
News & Analysis  
9/26/2001   Post a comment
MUNICH -- Infineon Technologies AG today described details of a previously announced initiative to save over 1 billion euros ($920 million) in costs from its semiconductor operations, including new plans to cut capital spending in half during the 2002 fiscal year, which begins Oct. 1.
Micron posts $576 million loss on sales of $480 million in quarter
News & Analysis  
9/25/2001   Post a comment
BOISE, Idaho--Micron Technology Inc. today posted a net loss of $576 million on net sales of just $480.3 million for the company's fiscal fourth quarter, ended Aug. 30. Micron's revenues plunged 40% sequentially from $802.3 million in the prior quarter, and sales were 79% lower than a year ago.
Update: Micron posts loss for fiscal 2001
News & Analysis  
9/25/2001   Post a comment
With rising inventories and plunging prices, Micron Technology posted a net loss of $576 million on sales of $480 million for its fiscal fourth quarter. The memory chip maker had a net loss for the full fiscal year of $521 million.
IDT integrates multi-queuing logic and FIFO memory for fast networks
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9/25/2001   Post a comment
SANTA CLARA, Calif.--Integrated Device Technology Inc. here has integrated high-speed queuing logic and first-in, first-out memory to offer a new series of multi-queue FIFOs for fast networking applications, such as terabit routers, multi-service switching platforms, and wireless base stations.
ASIC vendors will not benefit from upcoming chip recovery, says report
News & Analysis  
9/25/2001   Post a comment
EL SEGUNDO, Calif. -- There's good and bad news in the application specific integrated circuit (ASIC) market. The worldwide ASIC market will fare better than the overall semiconductor industry in 2001, but the business will not enjoy the full benefits of the coming recovery, according to a report from iSuppli Corp. here today. Worldwide ASIC revenues will decline by 22% in 2001, compared to a 28% decrease in overall semiconductor revenue for the year, said Jordan Selburn, who tracks the industr
California Micro says orders continue to strengthen
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9/25/2001   Post a comment
MILPITAS, Calif.--California Micro Devices Corp. here said orders for products have continued to strengthen despite a brief pause following terrorist attacks in New York City and Washington on Sept. 11. The supplier of analog semiconductors and integrated thin-film passive devices estimated that revenues would be closer to the high end of its $7-to-$7.5 million forecast for the current quarter.
Intel rolls out 2-GHz Xeon processor for workstations
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9/25/2001   Post a comment
SANTA CLARA, Calif. -- Intel Corp. today announced its fastest Xeon microprocessor to date--a 2-GHz chip for dual-processor workstations and other system products.
Canada's IceFyre aims three-engine modem IC at 5-GHz wireless LANs
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9/24/2001   Post a comment
OTTAWA, Ontario -- Seven-month-old IceFyre Semiconductor Inc. here today disclosed plans to introduce the industry's first single-chip modem solution for 5-GHz wireless local area networks using a proprietary architecture of three signal-computational engines to simplify waveform processing and lower power consumption.
Winbond 'reintroduces' nonvolatile memory ICs in U.S. after import ban expires
News & Analysis  
9/24/2001   Post a comment
HSINCHU, Taiwan--Winbond Electronics Corp. here today said it has begun notifying U.S. customers that it is now able to reintroduce EPROMs, EEPROMs, flash memories and other nonvolatile memory products after an exclusion order in a patent dispute with Atmel Corp. expired last week.
Hitachi joins QDR group defining high-speed SRAMs for communications
News & Analysis  
9/24/2001   Post a comment
TOKYO -- Hitachi Ltd. today announced plans to join Cypress, IDT, Micron, NEC, and Samsung in joint development of Quad Data Rate SRAM devices for high-performance communications applications.
UMC to port MoSys' one-transistor SRAM cell to advanced logic processes
News & Analysis  
9/24/2001   Post a comment
HSINCHU, Taiwan--Silicon foundry supplier United Microelectronics Corp. here and memory developer MoSys Inc. of Sunnyvale, Calif., today announced an extension to their cooperation in one-transistor SRAM technology for 0.15- and 0.13-micron logic-IC processes.
LSI Logic says cable-modem tuner integrates all critical RF elements
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9/24/2001   Post a comment
MILPITAS, Calif. -- LSI Logic Corp. today claimed development of the industry's most highly integrated tuner chip for cable modems. The chip, called Hi-IQ, integrates all the critical radio-frequency elements for cable-based telephony and broadband access applications, according to the Milpitas company.
Agere says new 2.5G chips, support will cut one year from handset launch
News & Analysis  
9/24/2001   Post a comment
ALLENTOWN, Pa. -- In a move to raise the bar in chip sets for 2.5G handsets, Agere Systems Inc. today rolled out a new platform series, software, and testing support to reducing the total number of components in GSM-based cellular phones by nearly 50%, while accelerating product introductions by up to one year.
Chip to meet both lan standards with automatic hand-off
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9/24/2001   Post a comment
Synad Technologies, a Reading-based start-up, is aiming to be the first company to offer a chipset that addresses both the IEEE 802.11b and 802.11a wireless lan standards and which will allow automatic hand-off between the two.
Intel launches fabless ASIC business, forms alliances with Chartered, TSMC, UMC, and others
News & Analysis  
9/24/2001   Post a comment
SANTA CLARA, Calif. -- In a move that could alter the semiconductor landscape, Intel Corp. here today formally launched a new and bold business that will provide fabless ASIC, global logistics and other services for customers. The new business--called Intel Microelectronics Services--is a new and radical turnkey service that will help IC makers and OEMs bring their application specific integrated circuits (ASICs), application specific standard parts (ASSPs), or system-on-a-chip designs to the
SanDisk braces for big loss, 35% sequential sales drop due to low flash prices
News & Analysis  
9/21/2001   Post a comment
SUNNYVALE, Calif.--Flash memory supplier SanDisk Corp. here today cut its revenue forecast for the third quarter due to severe pricing pressures on products resulting from weak market conditions and too much competition. SanDisk said it now expects third-quarter revenues to sequentially fall 35% from $88 million in the prior quarter instead of being flat with Q2.
Breakthrough in copper depositing below 100nm
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9/21/2001   Post a comment
A team at the University of Massachusetts has developed a process called chemical fluid deposition for depositing copper (Cu) below 100nm.
Toshiba aims new 64-Mbit pseudo-SRAMs at wireless, portable systems
News & Analysis  
9/20/2001   Post a comment
TOKYO -- Toshiba Corp. today claimed to be the first to introduce a 64-megabit pseudo-SRAM series, which is aimed at memory applications in next-generation wireless and portable systems.
Faster realtime signal rates from DSP architecture
News & Analysis  
9/20/2001   Post a comment
RF Engines has developed a digital signal processing architecture that can handle up to 1024 realtime signals at rates well over 100MHz, with higher quality than fourier transforms.
Via accuses Intel of violating patent for storage of formats in MPUs
News & Analysis  
9/20/2001   Post a comment
TAIPEI, Taiwan -- Via Technologies Inc. today stepped up its legal counterattack against Intel Corp. by providing more details about a U.S. patent lawsuit filed against the microprocessor giant for infringement of patented MPU technology. Last week, Via said it has filed a counter suit against Intel, which is suing the Taiwan chip maker for infringement of its Pentium 4 technology.
Altera works with Virginia Tech to put programmable devices in new wireless systems
News & Analysis  
9/19/2001   Post a comment
SAN JOSE--Altera Corp. today announced a partnership with the Mobile and Portable Radio Research Group at Virginia Polytechnic Institute and State University to collaborate in development of cutting-edge wireless communications technology for manufacturers, government and consumer service providers.
Lexra disputes MIPS's claims of favorable ruling
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9/19/2001   Post a comment
SAN JOSE -- Lexra Inc. today claimed it had won key interpretations on two patents in a lawsuit filed by MIPS Technologies Inc., which is accusing the company of infringing upon its instruction sets for RISC processors. On Tuesday, MIPS claimed it had won favorable rulings from the judge in the interpretation of the disputed patents (see Sept. 18 story).
Silicon Wave plans to use ARM7 core in Bluetooth chips
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9/19/2001   Post a comment
SAN DIEGO -- Silicon Wave Inc. here today announced it has licensed the 32-bit ARM7 TDMI processor core from U.K.-based ARM Ltd. to create new Bluetooth baseband ICs for cellular phones, personal digital assistants (PDAs), mobile computers and other wireless products.
Converting and scaling chipset for video systems
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9/19/2001   Post a comment
Canadian broadcast chip designer Gennum has developed a chipset for converting and scaling many video standards, including high definition, for broadcast systems and applications, such as plasma screen and projectors, and home theatre systems.
SiGe Semi uses ASAT's chip-carrier to reduce size of Bluetooth amplifier
News & Analysis  
9/18/2001   Post a comment
OTTAWA -- Hong Kong-based ASAT Holdings Ltd. today announced it will supply leadless plastic chip-carrier (LPCC) packages to SiGe Semiconductor Inc. here for Class 1 Bluetooth power amplifiers. The 3-by-1.6-mm form factor is the industry's smallest size for a fully encapsulated Class 1 Bluetooth power amplifiers, said the two companies.
MIPS Technologies claims favorable ruling in patent suit against Lexra
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9/18/2001   Post a comment
MOUNTAIN VIEW, Calif. -- MIPS Technologies Inc. today claimed a legal victory in a judge's ruling on the interpretation of a key disputed patent in its lawsuit against Lexra Inc., which is accused of infringing upon RISC processor instruction-set technology.
Fast-Chip designs packet-classification processor for 10-Gbit speeds
News & Analysis  
9/17/2001   Post a comment
SUNNYVALE, Calif.--Three-year-old Fast-Chip Inc. here today announced an OC-192 network classification processor, called PolicyEdge, which offloads work from other processors or ASICs in 10-gigabit-per-second routers, switches and other communications systems.
Microchip expects revenues to be almost sequentially flat in quarter
News & Analysis  
9/17/2001   Post a comment
CHANDLER, Ariz.--After postponing its business update last week, Microchip Technology Inc. today left its revenue estimate for the current fiscal quarter unchanged, at $136-to-$141 million in the period ending Sept. 30. The guidance shows Microchip expecting revenues to sequentially decline 2% or rise 1.5% from $138.9 million in the prior fiscal quarter.
Rambus, Intel expand licensing pact, hint of greater cooperation
News & Analysis  
9/17/2001   Post a comment
LOS ALTOS, Calif. -- Rambus Inc. and Intel Corp. today announced a new comprehensive patent cross-license agreement, which supersedes a prior pact between the companies. The agreement also appears to be aimed at ending doubts about Intel's support of Rambus.
Motorola unleashes its first complete 2.5G cell-phone chip solution
News & Analysis  
9/17/2001   Post a comment
AUSTIN, Tex. -- In an effort to redefine its semiconductor business, Motorola Inc. today publicly disclosed details of its first complete solution for 2.5-generation cellular phones, including a highly integrated four-component chip set that reduces electronics parts count in 2.5G handsets from more than 250 devices (passives and active circuits) to as low as 125.
Growth forecast for semiconductor design business
News & Analysis  
9/17/2001   Post a comment
Future Horizons has forecast strong growth for the design house and fabless semiconductor industry in Europe, but warns that the number of companies in the market is likely to fall from today's 170.
Broadcom, French software supplier collaborate in interactive TV applications
News & Analysis  
9/14/2001   Post a comment
AMSTERDAM -- During the International Broadcast Convention here today, Broadcom Corp. announced a partnership with Paris-based Canal+ Technologies to develop compatible products for set-top box systems in interactive television applications.
Nvidia's 2-for-1 stock split to be reflected in trading next week
News & Analysis  
9/14/2001   Post a comment
SANTA CLARA, Calif. -- Multimedia and graphics chip supplier Nvidia Corp. today said its planned two-for-one stock split, which was effective on Thursday while U.S. stock markets have been shutdown, will be reflected as soon as trading resumes on the Nasdaq exchange.
Intel's processor business sees better second half
News & Analysis  
9/14/2001   Post a comment
Intel says that getting rid of employees faster than expected has contributed to Q3 business being within expectations and the company has forecast a better second half for processors.
IBM pushes two ways for wireless
News & Analysis  
9/14/2001   Post a comment
IBM has developed two chip production processes for wireless applications. One, which IBM has named 6RF, is based on its 0.25µm RF CMOS process. The other, called 5HPE, enhances the use of silicon germanium in RF devices.
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