Atmel to outsource German fab operation News & Analysis 9/30/2008 Post a comment In a complex arrangement that in effect rids the company of the Heilbronn, Germany manufacturing operation it has been trying to sell for two years, Atmel said that a U.K. company has agreed to buy the fab's equipment and lease the facility from Atmel.
Strains showing on sapphires growth for electronics News & Analysis 9/30/2008 Post a comment The sapphire substrate market for electronic applications reached 4.61 million wafers (2 inch equivalent) for LEDs last year, as well as tens of thousands of 6 inch wafers for SoS RF applications in 2007, according to report from Yole Development (Lyon, France).
RF components to see few benefits from basestation growth News & Analysis 9/30/2008 Post a comment The global market for RF components for cellular basestations will remain flat at $1.1 billion through 2013 according to market research group Strategy Analytics. This despite the fact that actual shipments of basestations are forecast to grow to 13.4 million units in 2013, a CAAGR (compound annual average growth rate) of nearly 70 percent.
ASML tips next gen EUV lithography system News & Analysis 9/30/2008 Post a comment Lithography gear provider ASML (Veldhoven, the Netherlands) has unveiled a production version of its upcoming NXE range of EUV machines that, the company says, is part of a roadmap that supports cost-effective chip manufacturing to at least 11 nanometres (nm).
Trango's virtualization tool for TI OMAP receives certification Product News 9/30/2008 Post a comment Trango Virtual Processors, French provider of embedded processor virtualization IP, announced its HyperVisor embedded virtualization technology, dedicated to Texas Instruments' OMAP 2430 system-on-chip (SoC), complies with the CSPN (First level security certification) criteria, defined by the French National Security Agency.
Underwater helicopter surfaces News & Analysis 9/29/2008 1 comment Undersea robots have until now operated like fixed-wing aircraft, requiring motion to maneuver. Massachusetts Institute of Technology researchers now say they have created the helicopter-of-the-sea, the Odyssey IV.
Meltdown unlikely, says Stanford economist News & Analysis 9/26/2008 Post a comment A general economic slowdown is the most likely result of the current woes on Wall Street, according to a leading economist who would not rule out a small risk of a more general financial meltdown.
Analysts stay cool as Wall Street woes unfold News & Analysis 9/26/2008 Post a comment Analysts remain hopeful the crisis on Wall Street might not have a strong negative impact on the electronics industry, and some are taking a wait-and-see approach on a day when another bank collapsed and a legislative rescue package is still being hammered out.
Mirics wins first design win for PC TV receivers News & Analysis 9/25/2008 Post a comment Mirics Semiconductor Ltd (Fleet, England) has won its first design-in for its FlexiTV multiband receiver chip, from Taiwanese wireless module specialist AzureWave Technologies, which is using it in a part being readied for PC TV receivers.
Analyst sees chip sales in August falter News & Analysis 9/25/2008 Post a comment Global semiconductor sales in August are likely to come in at $22.6 billion for the 3-month moving average, compared with the corresponding figure the previous month, which was $22.1 billion, and up 5 percent year-on-year, according to securities house Carnegie.
Qualcomm first in Android phone but won't be lonely News & Analysis 9/25/2008 Post a comment Qualcomm's prominent place inside the first Android mobile phone is a feather in the company's cap, but doesn't mean there won't be stiff competition from rival wireless chip set vendors for design ins on future handsets to run the Google-backed operating system.
Panasonic will demo high def 3DTV in Japan Product News 9/24/2008 Post a comment Consumer giant Matsushita Electric Co. Ltd. has developed a prototype stereoscopic 3-D television and Blu-Ray Disc player that supports high definition and aims to work with the Blu-Ray Disc Association to set a standard around the 3-D format it hopes to use for the system.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.