Faulty memory chip causes Philips defibrillator recall News & Analysis 9/30/2009 1 comment Koninklijke Philips Electronics NV (Amsterdam, The Netherlands), a leading vendor of consumer and medical products, has announced that it is recalling approximately 5,400 HeartStart FR2+ automated external defibrillators (AEDs).
Micron narrows quarterly loss News & Analysis 9/29/2009 Post a comment Saying the market remains challenging but is beginning to improve, memory chip vendor Micron Technology reported a net loss of $88 million for the quarter ended Sept. 3, down from a net loss of $290 million in the prior quarter and a net loss of $344 million in the year-ago quarter.
TI to open 300-mm analog fab in North Texas News & Analysis 9/29/2009 2 comments Texas Instruments plans to open a 300-mm analog semiconductor fab in Richardson, Texas. The company expects to begin equipping the facility next month and ship the first chips from the fab by the end of next year.
Powerful problems seen for mobile handsets News & Analysis 9/29/2009 Post a comment Emerging solutions for bridging the power gap required by a growing number of handset features and available handset battery capacity are unlikely to solve the increasing and worrying problem, according to market trackers at IMS Research.
Drive makers at crossroads over next generation News & Analysis 9/29/2009 Post a comment Hard disk makers will have to decide in the next year which of two major paths they will take to tomorrow's drives that will pack a terabit or more per square inch, according to a leading consultant—heat-assisted recording or patterned media.
Secure CPU vendor introduces security server News & Analysis 9/28/2009 Post a comment Secure processor vendor CPU Technology introduced a security server that combines hardware and software used to encrypt embedded applications and configure security features for the company's Acalis CPU872 secure processors.
Six European startups in the spotlight News & Analysis 9/25/2009 Post a comment The twelfth edition of SAME Forum this week in Sophia Antipolis, France, was no exception to the rule. A startups panel brought to light innovative technologies and applications for the microelectronics industry.
Intel dials in 45nm for TV chip gambit News & Analysis 9/25/2009 Post a comment Intel Corp. formally announced its first 45nm system-on chip—the CE4100 or Sodaville--at the Intel Developer Forum, its second swing at a device aimed for TVs and other digital living room systems.
Fast interfaces overlap at IDF News & Analysis 9/24/2009 1 comment The buzz in fast interconnects at Intel Developer Forum was supposed to be around SuperSpeed USB, the 3.0 version of the omnipresent interface coming to systems in 2010, but somewhere on the road to San Francisco's Moscone Center, Intel decided to roll out Light Peak, the next next big thing in fast interconnects.
Standards bodies seek common ground for powerline nets News & Analysis 9/24/2009 Post a comment A senior director of DS2, the Valencia, Spain based specialist in silicon for broadband power line gear, has warned of confusion and frustration in the industry and amongst consumers if forthcoming votes on a standard for the technology fail to resolve the problem of a fragmented powerline networking industry.
Freescale Toulouse says no word on Intel News & Analysis 9/24/2009 Post a comment Intel Corp. intends to acquire Freescale Semiconductor's wireless operations in Toulouse, France, and to take over 53 out of the 236 employees that Freescale said it would lay off by the end of 2009, according to French press. In order to obtain confirmation, EE Times, contacted Michel Abitteboul, communication manager for Freescale Toulouse, who neither denied nor confirmed these speculations.
Update: Intel debuts optical link for PCs News & Analysis 9/23/2009 2 comments Intel Corp. wants to consolidate all the wired connections on your PC to a single 10 Gbit/second optical cable it calls Light Peak that it plans to support in silicon sometime next year working with Sony Corp.'s Viao group and other unnamed partners.
Actel releases firmware catalog Product News 9/23/2009 Post a comment Actel has released a new firmware catalog, a move billed by the company as a continuation of its commitment to enhancing the embedded processor development tool suite.
Xilinx boosts sales target News & Analysis 9/23/2009 Post a comment Xilinx raised its sales target for the September quarter, saying it now expects sales of approximately $413.8 million, up 10 percent from the previous quarter.
Samsung semis chief sees signs of recovery News & Analysis 9/23/2009 Post a comment Samsung Electronics is ramping up production of DDR3 memories and shifting manufacturing to a 40-nm process to meet what it anticipates will be increased demand as companies start rebuilding inventories.
Otellini denies antitrust charges in EC's Intel report News & Analysis 9/23/2009 Post a comment Chief executive Paul Otellini denied Intel Corp. engaged in anticompetitive practices outlined in a 518-page report released Monday by the European Commission, and said in a Q&A session after his keynote at the first day of the Intel Developer Forum that Intel will present its evidence in an appeal of the EC's May decision to slap a $1.45 billion fine on the chip maker.
Otellini: Intel to ship more SoCs than PC CPUs -- someday News & Analysis 9/22/2009 Post a comment Intel Corp. will someday ship more system-on-chip devices than PC processors, said chief executive Paul Otellini whorolled out new software efforts to drive its Atom-based chips into handsets and other devices and.showed the company's first working 22nm SRAM devices, 364 Mbit chips with 2.9 billion transistors.
Executive move: Freescale to ST, Austin to Milan News & Analysis 9/22/2009 Post a comment Paul Grimme, STMicroelectronics NV's newly appointed head of the automotive products group, joined the chipmaker from Freescale and moved to Milan from Austin, Texas, as the company takes step to expand its presence in the sector and catch up with leaders Freescale and Infineon.
AT&T to unleash femtocell for 3G News & Analysis 9/22/2009 1 comment AT&T's long-awaited entry into the femtocells market is believed to rely on home basestations supplied by ip.access (Cambridge, England), powered by silicon from picoChip (Bath, England) and Cisco acting as systems integrator.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Are the design challenges the same as with embedded systems, but with a little developer- and IT-skills added in? What do engineers need to know? Rick Merritt talks with two experts about the tools and best options for designing IoT devices in 2016. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.