Medical electronics seeks role in health care debate News & Analysis 9/22/2009 1 comment The medical electronics sector is under pressure to prove its value in the debate over the high costs of health care, believing its biggest contribution could be developing devices and networks that drive a shift to lower cost care at home, but market hurdles have stymied early efforts.
Europe releases report on Intel antitrust investigation News & Analysis 9/21/2009 1 comment A day before the opening of the Intel Developer Forum in San Francisco, the European Commission has released a 518-page report detailing its allegations of antitrust violations against Intel Corp. for which it levied a $1.45 billion fine in May.
40Gb Ethernet set to be major feature at ECOC Product News 9/21/2009 Post a comment 40GbE transceivers and other parts, including testers, are set to be a major talking point at both the exhibitor stands and conferences at this week's European Conference and Exhibition on Optical Communication (ECOC) in Vienna, Austria.
Long, bumpy transition seen for USB 3.0 News & Analysis 9/21/2009 1 comment The Intel Developer Forum is expected to generate buzz around SuperSpeed USB this week, but the transition to the 5 GHz interface may be slower and bumpier than many would hope due to cost, power and support issues.
IC analyst sees tighter supply, ASP growth News & Analysis 9/18/2009 Post a comment A historically low level of capital spending by chipmakers is paving the way tight supply conditions that will result in increased average selling prices but may have unforeseen ramifications, according to an industry analyst.
Rambus demos threaded modules at IDF News & Analysis 9/17/2009 Post a comment Rambus Inc. has partnered with Kingston Technology to create a prototype DDR3 memory module that increases performance and lowers power for main memory access, and they will demonstrate the prototype targeted at use with multicore processors at next week's Intel Developer Forum.
Companies partner for space qualified modules Product News 9/17/2009 Post a comment C-MAC MicroTechnology (Great Yarmouth, England) and Linear Technology (Milpitas, Calif.) have joined forces for a deal that will allow manufacturers outside of the U.S. to purchase space grade and rad-hard monolithic and multichip modules from a European manufacturer without the bureaucratic restrictions they have to face.
Design chiefs weigh in on SoC options News & Analysis 9/16/2009 Post a comment The ASIC versus FPGA debut took an interesting turn Wednesday (Sept. 16), as high-ranking executives from two design tool firms offered dueling keynote address on the virtues of and challenges facing FPGA-based and ASICs-based system-on-chip (SoCs) designs.
Patent office again finds in favor of MMP portfolio News & Analysis 9/16/2009 Post a comment The US Patent Office has again affirmed the validity of US’336, the most widely recognized patent in the Moore Microprocessor Patent (MMP) portfolio jointly owned by Patriot Scientific Corporation and the TPL Group (Cupertino, Calif.)
DisplayLink raises a further $8 million News & Analysis 9/16/2009 Post a comment DisplayLink Corp., the start-up developing semiconductors and software for network display applications, has raised $8 million in fourth-round funding, according to a regulatory filing.
Analyst: IC sales set for 'V' shaped recovery News & Analysis 9/16/2009 Post a comment Sales and unit volume shipments of NAND flash between January and July of this year increased by a massive 98 percent and 67 percent respectively, with healthy figures also for other categories, suggesting that the industry is headed towards swift recovery and a ‘V’ shaped rebound, says market trackers IC Insights.
Rambus ups guidance for third quarter News & Analysis 9/16/2009 Post a comment Memory technology licensor Rambus Inc. (Los Altos, Calif.) has revised upwards a revenues guidance issued in June and now expects sales for the third quarter to be between $27 million and $28 million rather than between $22 million to $25 million.
NEC, Renesas seal chip merger News & Analysis 9/16/2009 Post a comment The merger of Japanese chip groups NEC Electronics Corp and Renesas Technology is back on again, and with the help of about a $2.2 billon injection from the parent firms, NEC, Hitachi Ltd and Mitsubishi Electric Corp.
Ethernet caught in demand/cost squeeze News & Analysis 9/16/2009 1 comment In one of the central ironies of the Internet era, popular Web sites and service providers are driving bandwidth requirements through the roof while pushing the costs of systems through the floor, according to presentations from Facebook engineers and others at a meeting of the Ethernet Alliance.
Apple hires Intel's former top lawyer News & Analysis 9/15/2009 Post a comment Apple Inc. has named Bruce Sewell, the ex-Intel Corp. top lawyer, as its new general counsel as the company seeks to strengthen its legal team in anticipation of problems that might arise from its growing expansion into new market sectors.
Numonyx regains top spot in NOR flash News & Analysis 9/15/2009 1 comment Numonyx jumped back into the No. 1 position among NOR flash memory vendors in the second quarter, taking advantage of problems at chief rival Spansion, according to market research firm iSuppli .
SiPort brings HD radio to Micosoft's Zune News & Analysis 9/15/2009 Post a comment Fabless chip group SiPort (Santa Clara, Calif.) is trying to give a much needed boost to HD radio in the U.S., and has persuaded Microsoft to include it in the latest version of the software giant’s Zune portable media player, which goes on sale this week.
Nujira raises funds, targets defence News & Analysis 9/15/2009 Post a comment Power amplifier specialist Nujira (Cambridge, England) has raised a further £10 million to accelerate development of its handset technology. The company has also set up a group to work on projects in the defense sector, targeting improved power efficiency for military gear using its High Accuracy Tracking amplifier technology.
Altera claims highest-density FPGA Product News 9/14/2009 Post a comment Altera said it increased the high-end density range of its 40-nm Stratix IV E FPGAs to 820,000 logic elements, making the device the highest-density FPGA on the market, according to the company.
Element CXI targets 4G apps with computing array News & Analysis 9/14/2009 Post a comment Element CXI, the Milpitas, California based fabless group developing reconfigurable processors, is launching at this week's 4G World Forum in Chicago its nGEN Elemental Computing Array (ECA) platform targeting multi-mode and multi-band wireless applications.
Cypress expands PSoC family for sophisticated applications Product News 9/14/2009 Post a comment Cypress Semiconductor Corp. expands the family of its Programmable System-on-Chips (PSoCs) towards the high end. With the move, the company seeks to gain acceptance in power-hungry embedded applications such as industrial embedded controls, automotive in-cabin devices, digital entertainment and portable medical implementations.
3i disposes of European start-up investments News & Analysis 9/13/2009 Post a comment Venture capital group DFJ Esprit has sealed a deal to acquire a portfolio of high technology venture investments, mostly start-ups, from 3i Group plc, in a deal said to be worth £130 million (about $200 million).
MCUs - MCU for automotive engine control boasts on-chip 3.75 MB flash memory Product News 9/12/2009 Post a comment Renesas Technology America, Inc., has announced the SH72546R automotive powertrain control MCU, which combines a 3.75 MB on-chip flash memory with 200 MHz operation. The SH72546R is the third in Renesas Technology's line of SuperH high-performance control MCUs to employ the 90 nm process node to integrate large-capacity flash memory.
Lattice Semi narrows Q3 guidance News & Analysis 9/11/2009 Post a comment Lattice Semiconductor lifted the low end of its revenue guidance for the third quarter, saying it now expects to report revenue of between $46.9 million and $48.3 million.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Are the design challenges the same as with embedded systems, but with a little developer- and IT-skills added in? What do engineers need to know? Rick Merritt talks with two experts about the tools and best options for designing IoT devices in 2016. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.