MIPS, friends tape-out IC at 40nm for 2.4GHz News & Analysis 9/21/2010 Post a comment MIPS Technologies Inc., Open-Silicon Inc. and Dolphin Technology Inc. have announced the tape-out of an ASIC processor intended to operate at a clock frequency of more than 2.4-GHz when manufactured in a 40-nm manufacturing process.
Project maps ARM core variability at 32-nm News & Analysis 9/21/2010 Post a comment A European collaborative research project has spent about $5.8 million performing a characterization of an ARM926 core for the statistical variability that is inherent at the 32-nm manufacturing process node.
Plessey plans to run GaN, SiGe at UK fab News & Analysis 9/21/2010 Post a comment Plessey Semiconductors Ltd., a once-famous semiconductor name reborn as a management-owned buy-out company, is planning to extend its chip manufacturing capabilities to include gallium nitride and silicon-germanium.
Nanocrystalline alloy improves PRAM News & Analysis 9/20/2010 4 comments Binary eutectic-alloy nanostructure offers new phase change memory material that could increase density, lower temperature and speed switching of phase-change random access memory.
Femtocells lure embattled net operators News & Analysis 9/20/2010 14 comments Femtocells, small basestations designed for homes or small businesses to extend cellular networks’ indoor coverage, are poised to enter the public access infrastructure market, posing a possible disruption to the traditional macro basestation industry.
SmartFusion A2F500 dev kit available from Actel Product News 9/16/2010 5 comments The folks at Actel have just announced the availability of their A2F500 Development Kit for customers wanting to take immediate advantage of the highest density member of their SmartFusion intelligent mixed-signal FPGA family.
Sokudo joins CEA-Leti's e-beam litho project News & Analysis 9/16/2010 9 comments Sokudo Co. Ltd., a coating and track process equipment company, has announced it will join the Imagine research program based at CEA-Leti that is developing maskless lithography for IC manufacturing at 22-nm and beyond.
August sees sales slip, says analyst News & Analysis 9/16/2010 6 comments The three-month average of global chip sales for August is set to be $25.3 billion, compared with $25.2 billion in July, according to Bruce Diesen, an analyst at Carnegie Group (Oslo, Norway).
TZ1090 XENIF SoC integrates broadcast receiver, Wi-Fi and apps processor Product News 9/15/2010 Post a comment The TZ1090 XENIF from Toumaz is an advanced 32-bit processor based System-on-Chip (SoC) with integrated broadcast and connectivity. The XENIF is designed to be a highly competitive, cost-effective solution for advanced cost engineered digital radios, Wi-Fi-connected photo frames and Internet-connected consumer devices.
ESC Boston likely swan song for Actel's East News & Analysis 9/15/2010 1 comment When Actel CEO John East steps to the podium to deliver a keynote address at next week's Embedded Systems Conference in Boston, it is likely to represent a culmination of sorts for an electronics industry career that has spanned some 42 years.
Market share holds steady amid MPU rebound News & Analysis 9/15/2010 Post a comment Intel and AMD experienced virtually no change in their market share of the global microprocessor market as second quarter microprocessor sales improved dramatically from the historic lows of the second quarter of 2009, according to iSuppli.
ASML rolls predictive modeling tool for EUV News & Analysis 9/14/2010 2 comments Brion Technologies, a division of lithography leader ASML, rolled out a new software tool designed to provide accurate predictive modeling specifically for ASML extreme ultraviolet lithography scanners.
ARM, Trident, Ittiam make entertainment plans News & Analysis 9/13/2010 1 comment Trident has announced that is has produced a set-top box platform based on an ARM A-series processor. In a separate announcement Ittiam said it has implementated a Dolby MS10 multistream audio decoder on the A series of processors.
Battle-hardened veterans of the electronics industry have heard of the “connected car” so often that they assume it’s a done deal. But do we really know what it takes to get a car connected and what its future entails? Join EE Times editor Junko Yoshida as she moderates a panel of movers and shakers in the connected car business. Executives from Cisco, Siemens and NXP will share ideas, plans and hopes for connected cars and their future. After the first 30 minutes of the radio show, our listeners will have the opportunity to ask questions via live online chat.